James A. Busby

Person

New Paltz, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Electronic component comprising first and second conductive traces...
- Patent number 12,207,392
- Issue date Jan 21, 2025
- International Business Machines Corporation
- Matthew Doyle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coolant-cooled heat sink(s) with associated ultra-violet light asse...
- Patent number 12,005,148
- Issue date Jun 11, 2024
- International Business Machines Corporation
- Hongqing Zhang
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Cryptographic hardware security module with secure embedded heat pipe
- Patent number 11,991,277
- Issue date May 21, 2024
- International Business Machines Corporation
- Arthur J. Higby
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Multi chip hardware security module
- Patent number 11,882,645
- Issue date Jan 23, 2024
- International Business Machines Corporation
- Sushumna Iruvanti
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Secure ventilation through protective flexible sensors
- Patent number 11,822,707
- Issue date Nov 21, 2023
- International Business Machines Corporation
- William Santiago-Fernandez
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Tamper-respondent assemblies with pressure connector assemblies
- Patent number 11,765,816
- Issue date Sep 19, 2023
- International Business Machines Corporation
- Arthur J. Higby
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Tamper-respondent assemblies with porous heat transfer element(s)
- Patent number 11,716,808
- Issue date Aug 1, 2023
- International Business Machines Corporation
- Hongqing Zhang
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Leakage characterization for electronic circuit temperature monitoring
- Patent number 11,614,497
- Issue date Mar 28, 2023
- International Business Machines Corporation
- Matthew Doyle
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Leakage characterization and management for electronic circuit enha...
- Patent number 11,493,565
- Issue date Nov 8, 2022
- International Business Machines Corporation
- Matthew Doyle
- G01 - MEASURING TESTING
Information Patent Grant
Dielectric material change to optimize electrical and mechanical pr...
- Patent number 11,382,210
- Issue date Jul 5, 2022
- International Business Machines Corporation
- John R. Dangler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Data detection mitigation in printed circuit boards
- Patent number 11,244,079
- Issue date Feb 8, 2022
- International Business Machines Corporation
- Matteo Cocchini
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Tamper-respondent assembly with interconnect characteristic(s) obsc...
- Patent number 11,147,158
- Issue date Oct 12, 2021
- International Business Machines Corporation
- James A. Busby
- G01 - MEASURING TESTING
Information Patent Grant
Tamper-respondent sensors with liquid crystal polymer layers
- Patent number 11,122,682
- Issue date Sep 14, 2021
- International Business Machines Corporation
- James A. Busby
- G01 - MEASURING TESTING
Information Patent Grant
Enclosure-to-board interface with tamper-detect circuit(s)
- Patent number 11,083,082
- Issue date Aug 3, 2021
- International Business Machines Corporation
- Kathleen Ann Fadden
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Creating a secure volume
- Patent number 11,026,324
- Issue date Jun 1, 2021
- International Business Machines Corporation
- Arthur Higby
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Enclosure with tamper respondent sensor
- Patent number 10,956,623
- Issue date Mar 23, 2021
- International Business Machines Corporation
- Silvio Dragone
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
3-D flex circuit forming
- Patent number 10,932,374
- Issue date Feb 23, 2021
- International Business Machines Corporation
- Arthur Higby
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Tamper detection at enclosure-to-board interface
- Patent number 10,798,816
- Issue date Oct 6, 2020
- International Business Machines Corporation
- James A. Busby
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Tamper-respondent assemblies with bond protection
- Patent number 10,624,202
- Issue date Apr 14, 2020
- International Business Machines Corporation
- William L. Brodsky
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
3-D flex circuit forming
- Patent number 10,595,419
- Issue date Mar 17, 2020
- International Business Machines Corporation
- Arthur Higby
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Tamper detection at enclosure-to-board interface
- Patent number 10,595,401
- Issue date Mar 17, 2020
- International Business Machines Corporation
- James A. Busby
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Tamper-respondent assembly with interconnect characteristic(s) obsc...
- Patent number 10,575,398
- Issue date Feb 25, 2020
- International Business Machines Corporation
- James A. Busby
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Tamper-respondent assembly with interconnect characteristic(s) obsc...
- Patent number 10,568,202
- Issue date Feb 18, 2020
- International Business Machines Corporation
- James A. Busby
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Tamper-proof electronic packages with stressed glass component subs...
- Patent number 10,535,618
- Issue date Jan 14, 2020
- International Business Machines Corporation
- James A. Busby
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Tamper-proof electronic packages with stressed glass component subs...
- Patent number 10,535,619
- Issue date Jan 14, 2020
- International Business Machines Corporation
- James A. Busby
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Enclosure-to-board interface with tamper-detect circuit(s)
- Patent number 10,531,561
- Issue date Jan 7, 2020
- International Business Machines Corporation
- Kathleen Ann Fadden
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Tamper-respondent assemblies
- Patent number 10,334,722
- Issue date Jun 25, 2019
- International Business Machines Corporation
- William L. Brodsky
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Tamper-respondent assembly with flexible tamper-detect sensor(s) ov...
- Patent number 10,327,329
- Issue date Jun 18, 2019
- International Business Machines Corporation
- William L. Brodsky
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Enclosure-to-board interface with tamper-detect circuit(s)
- Patent number 10,306,753
- Issue date May 28, 2019
- International Business Machines Corporation
- Kathleen Ann Fadden
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Tamper-respondent assemblies with bond protection
- Patent number 10,264,665
- Issue date Apr 16, 2019
- International Business Machines Corporation
- William L. Brodsky
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
TAMPER-RESPONDENT ASSEMBLIES WITH INDIVIDUALIZED CHEMICAL MIXTURES...
- Publication number 20250098061
- Publication date Mar 20, 2025
- International Business Machines Corporation
- Philipp K. BUCHLING REGO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TAMPER-DETECT ASSEMBLIES INCLUDING HEAT SINK COVERS WITH INTEGRATED...
- Publication number 20250098062
- Publication date Mar 20, 2025
- International Business Machines Corporation
- Philipp K. BUCHLING REGO
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
GENERATION OF RANDOM SECURITY CIRCUIT PATTERNS FOR IN-SITU FABRICAT...
- Publication number 20250089174
- Publication date Mar 13, 2025
- International Business Machines Corporation
- Hongqing ZHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TEARING SECURITY FEATURE OF PRINTED CIRCUIT SUBSTRATES
- Publication number 20240121890
- Publication date Apr 11, 2024
- International Business Machines Corporation
- Arthur J. Higby
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MICROSTRIP CROSSTALK REDUCTION
- Publication number 20240098882
- Publication date Mar 21, 2024
- International Business Machines Corporation
- Matthew Doyle
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LEAKAGE CHARACTERIZATION FOR ELECTRONIC CIRCUIT TEMPERATURE MONITORING
- Publication number 20230228824
- Publication date Jul 20, 2023
- International Business Machines Corporation
- Matthew Doyle
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MULTI CHIP HARDWARE SECURITY MODULE
- Publication number 20230130104
- Publication date Apr 27, 2023
- International Business Machines Corporation
- Sushumna Iruvanti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CRYPTOGRAPHIC HARDWARE SECURITY MODULE WITH SECURE EMBEDDED HEAT PIPE
- Publication number 20230054606
- Publication date Feb 23, 2023
- International Business Machines Corporation
- Arthur J. Higby
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
TAMPER-RESPONDENT ASSEMBLIES WITH PRESSURE CONNECTOR ASSEMBLIES
- Publication number 20230052840
- Publication date Feb 16, 2023
- International Business Machines Corporation
- Arthur J. HIGBY
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SECURE VENTILATION THROUGH PROTECTIVE FLEXIBLE SENSORS
- Publication number 20220382921
- Publication date Dec 1, 2022
- International Business Machines Corporation
- William Santiago-Fernandez
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
COOLANT-COOLED HEAT SINK(S) WITH ASSOCIATED ULTRA-VIOLET LIGHT ASSE...
- Publication number 20220347327
- Publication date Nov 3, 2022
- International Business Machines Corporation
- Hongqing ZHANG
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
DIELECTRIC MATERIAL CHANGE TO OPTIMIZE ELECTRICAL AND MECHANICAL PR...
- Publication number 20220201839
- Publication date Jun 23, 2022
- International Business Machines Corporation
- John R. Dangler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TAMPER-RESPONDENT ASSEMBLIES WITH POROUS HEAT TRANSFER ELEMENT(S)
- Publication number 20220192011
- Publication date Jun 16, 2022
- International Business Machines Corporation
- Hongqing ZHANG
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
LEAKAGE CHARACTERIZATION FOR ELECTRONIC CIRCUIT TEMPERATURE MONITORING
- Publication number 20210165051
- Publication date Jun 3, 2021
- International Business Machines Corporation
- Matthew Doyle
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
LEAKAGE CHARACTERIZATION AND MANAGEMENT FOR ELECTRONIC CIRCUIT ENHA...
- Publication number 20210165052
- Publication date Jun 3, 2021
- International Business Machines Corporation
- Matthew Doyle
- G01 - MEASURING TESTING
Information Patent Application
DATA DETECTION MITIGATION IN PRINTED CIRCUIT BOARDS
- Publication number 20210081576
- Publication date Mar 18, 2021
- International Business Machines Corporation
- Matteo Cocchini
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CREATING A SECURE VOLUME
- Publication number 20200267830
- Publication date Aug 20, 2020
- International Business Machines Corporation
- Arthur Higby
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
3-D FLEX CIRCUIT FORMING
- Publication number 20200187367
- Publication date Jun 11, 2020
- International Business Machines Corporation
- Arthur Higby
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
TAMPER-RESPONDENT ASSEMBLY WITH INTERCONNECT CHARACTERISTIC(S) OBSC...
- Publication number 20200045812
- Publication date Feb 6, 2020
- International Business Machines Corporation
- James A. BUSBY
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ENCLOSURE-TO-BOARD INTERFACE WITH TAMPER-DETECT CIRCUIT(S)
- Publication number 20200008295
- Publication date Jan 2, 2020
- International Business Machines Corporation
- Kathleen Ann FADDEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ENCLOSURE WITH TAMPER RESPONDENT SENSOR
- Publication number 20190384942
- Publication date Dec 19, 2019
- International Business Machines Corporation
- Silvio Dragone
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
TAMPER-RESPONDENT SENSORS WITH LIQUID CRYSTAL POLYMER LAYERS
- Publication number 20190313526
- Publication date Oct 10, 2019
- International Business Machines Corporation
- James A. BUSBY
- G01 - MEASURING TESTING
Information Patent Application
ENCLOSURE-TO-BOARD INTERFACE WITH TAMPER-DETECT CIRCUIT(S)
- Publication number 20190261506
- Publication date Aug 22, 2019
- International Business Machines Corporation
- Kathleen Ann FADDEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TAMPER-RESPONDENT ASSEMBLY WITH INTERCONNECT CHARACTERISTIC(S) OBSC...
- Publication number 20190037686
- Publication date Jan 31, 2019
- International Business Machines Corporation
- James A. BUSBY
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
TAMPER-RESPONDENT ASSEMBLY WITH INTERCONNECT CHARACTERISTIC(S) OBSC...
- Publication number 20190037687
- Publication date Jan 31, 2019
- International Business Machines Corporation
- James A. BUSBY
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MULTI-LAYER STACK WITH EMBEDDED TAMPER-DETECT PROTECTION
- Publication number 20180365945
- Publication date Dec 20, 2018
- International Business Machines Corporation
- James A. BUSBY
- G08 - SIGNALLING
Information Patent Application
MULTI-LAYER STACK WITH EMBEDDED TAMPER-DETECT PROTECTION
- Publication number 20180365946
- Publication date Dec 20, 2018
- International Business Machines Corporation
- James A. BUSBY
- G08 - SIGNALLING
Information Patent Application
MULTI-LAYER STACK WITH EMBEDDED TAMPER-DETECT PROTECTION
- Publication number 20180365947
- Publication date Dec 20, 2018
- International Business Machines Corporation
- James A. BUSBY
- G08 - SIGNALLING
Information Patent Application
TAMPER-PROOF ELECTRONIC PACKAGES WITH STRESSED GLASS COMPONENT SUBS...
- Publication number 20180358311
- Publication date Dec 13, 2018
- International Business Machines Corporation
- James A. BUSBY
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
TAMPER-PROOF ELECTRONIC PACKAGES WITH STRESSED GLASS COMPONENT SUBS...
- Publication number 20180350757
- Publication date Dec 6, 2018
- International Business Machines Corporation
- James A. BUSBY
- G06 - COMPUTING CALCULATING COUNTING

James A. Busby

Person

Patents Grantslast 30 patents

Electronic component comprising first and second conductive traces...

Coolant-cooled heat sink(s) with associated ultra-violet light asse...

Cryptographic hardware security module with secure embedded heat pipe

Multi chip hardware security module

Secure ventilation through protective flexible sensors

Tamper-respondent assemblies with pressure connector assemblies

Tamper-respondent assemblies with porous heat transfer element(s)

Leakage characterization for electronic circuit temperature monitoring

Leakage characterization and management for electronic circuit enha...

Dielectric material change to optimize electrical and mechanical pr...

Data detection mitigation in printed circuit boards

Tamper-respondent assembly with interconnect characteristic(s) obsc...

Tamper-respondent sensors with liquid crystal polymer layers

Enclosure-to-board interface with tamper-detect circuit(s)

Creating a secure volume

Enclosure with tamper respondent sensor

3-D flex circuit forming

Tamper detection at enclosure-to-board interface

Tamper-respondent assemblies with bond protection

3-D flex circuit forming

Tamper detection at enclosure-to-board interface

Tamper-respondent assembly with interconnect characteristic(s) obsc...

Tamper-respondent assembly with interconnect characteristic(s) obsc...

Tamper-proof electronic packages with stressed glass component subs...

Tamper-proof electronic packages with stressed glass component subs...

Enclosure-to-board interface with tamper-detect circuit(s)

Tamper-respondent assemblies

Tamper-respondent assembly with flexible tamper-detect sensor(s) ov...

Enclosure-to-board interface with tamper-detect circuit(s)

Tamper-respondent assemblies with bond protection

Patents Applicationslast 30 patents

TAMPER-RESPONDENT ASSEMBLIES WITH INDIVIDUALIZED CHEMICAL MIXTURES...

TAMPER-DETECT ASSEMBLIES INCLUDING HEAT SINK COVERS WITH INTEGRATED...

GENERATION OF RANDOM SECURITY CIRCUIT PATTERNS FOR IN-SITU FABRICAT...

TEARING SECURITY FEATURE OF PRINTED CIRCUIT SUBSTRATES

MICROSTRIP CROSSTALK REDUCTION

LEAKAGE CHARACTERIZATION FOR ELECTRONIC CIRCUIT TEMPERATURE MONITORING

MULTI CHIP HARDWARE SECURITY MODULE

CRYPTOGRAPHIC HARDWARE SECURITY MODULE WITH SECURE EMBEDDED HEAT PIPE

TAMPER-RESPONDENT ASSEMBLIES WITH PRESSURE CONNECTOR ASSEMBLIES

SECURE VENTILATION THROUGH PROTECTIVE FLEXIBLE SENSORS

COOLANT-COOLED HEAT SINK(S) WITH ASSOCIATED ULTRA-VIOLET LIGHT ASSE...

DIELECTRIC MATERIAL CHANGE TO OPTIMIZE ELECTRICAL AND MECHANICAL PR...

TAMPER-RESPONDENT ASSEMBLIES WITH POROUS HEAT TRANSFER ELEMENT(S)

LEAKAGE CHARACTERIZATION FOR ELECTRONIC CIRCUIT TEMPERATURE MONITORING

LEAKAGE CHARACTERIZATION AND MANAGEMENT FOR ELECTRONIC CIRCUIT ENHA...

DATA DETECTION MITIGATION IN PRINTED CIRCUIT BOARDS

CREATING A SECURE VOLUME

3-D FLEX CIRCUIT FORMING

TAMPER-RESPONDENT ASSEMBLY WITH INTERCONNECT CHARACTERISTIC(S) OBSC...

ENCLOSURE-TO-BOARD INTERFACE WITH TAMPER-DETECT CIRCUIT(S)

ENCLOSURE WITH TAMPER RESPONDENT SENSOR

TAMPER-RESPONDENT SENSORS WITH LIQUID CRYSTAL POLYMER LAYERS

ENCLOSURE-TO-BOARD INTERFACE WITH TAMPER-DETECT CIRCUIT(S)

TAMPER-RESPONDENT ASSEMBLY WITH INTERCONNECT CHARACTERISTIC(S) OBSC...

TAMPER-RESPONDENT ASSEMBLY WITH INTERCONNECT CHARACTERISTIC(S) OBSC...

MULTI-LAYER STACK WITH EMBEDDED TAMPER-DETECT PROTECTION

MULTI-LAYER STACK WITH EMBEDDED TAMPER-DETECT PROTECTION

MULTI-LAYER STACK WITH EMBEDDED TAMPER-DETECT PROTECTION

TAMPER-PROOF ELECTRONIC PACKAGES WITH STRESSED GLASS COMPONENT SUBS...

TAMPER-PROOF ELECTRONIC PACKAGES WITH STRESSED GLASS COMPONENT SUBS...