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James H. Knapp
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Chandler, AZ, US
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Patents Grants
last 30 patents
Information
Patent Grant
Method of marking a low profile packaged semiconductor device
Patent number
8,574,961
Issue date
Nov 5, 2013
Semiconductor Components Industries, LLC
James Howard Knapp
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device with wire bond inductor and method
Patent number
7,227,240
Issue date
Jun 5, 2007
Semiconductor Components Industries, LLC
James Knapp
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of forming a semiconductor package and leadframe therefor
Patent number
7,109,064
Issue date
Sep 19, 2006
Semiconductor Components Industries, LLC
Joseph K. Fauty
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Direct chip attach structure and method
Patent number
6,835,580
Issue date
Dec 28, 2004
Semiconductor Components Industries, LLC
James Knapp
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Structure and method of forming a multiple leadframe semiconductor...
Patent number
6,833,290
Issue date
Dec 21, 2004
Semiconductor Components Industries, LLC
James H. Knapp
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit and laminated leadframe package
Patent number
6,747,341
Issue date
Jun 8, 2004
Semiconductor Components Industries, LLC
James Knapp
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and laminated leadframe package
Patent number
6,713,317
Issue date
Mar 30, 2004
Semiconductor Components Industries, LLC
James Knapp
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Structure and method of forming a multiple leadframe semiconductor...
Patent number
6,677,672
Issue date
Jan 13, 2004
Semiconductor Components Industries LLC
James H. Knapp
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Flexible substrate for packaging a semiconductor component
Patent number
6,300,679
Issue date
Oct 9, 2001
Semiconductor Components Industries, LLC
Prosanto K. Mukerji
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Optical coupler and method for coupling an optical fiber to an opto...
Patent number
6,116,791
Issue date
Sep 12, 2000
Motorola, Inc.
Albert John Laninga
G02 - OPTICS
Information
Patent Grant
Microelectronic package including a polymer encapsulated die
Patent number
6,093,972
Issue date
Jul 25, 2000
Motorola, Inc.
Francis J. Carney
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package consisting of multiple conductive layers
Patent number
6,081,031
Issue date
Jun 27, 2000
Semiconductor Components Industries, LLC
James P. Letterman
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Ball grid device with optically transmissive coating
Patent number
5,973,337
Issue date
Oct 26, 1999
Motorola, Inc.
James H. Knapp
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Optoelectronic device and method of assembly
Patent number
5,933,558
Issue date
Aug 3, 1999
Motorola, Inc.
Joseph E. Sauvageau
G02 - OPTICS
Information
Patent Grant
Method of manufacturing a semiconductor component
Patent number
5,928,595
Issue date
Jul 27, 1999
Motorola, Inc.
James H. Knapp
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information
Patent Grant
Semiconductor component
Patent number
5,900,669
Issue date
May 4, 1999
Motorola, Inc.
James H. Knapp
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Microelectronic package including a polymer encapsulated die, and m...
Patent number
5,895,229
Issue date
Apr 20, 1999
Motorola, Inc.
Francis J. Carney
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic component for aligning a light transmitting structure
Patent number
5,883,996
Issue date
Mar 16, 1999
Motorola, Inc.
James H. Knapp
G02 - OPTICS
Information
Patent Grant
Material transfer apparatus and method of using the same
Patent number
5,834,062
Issue date
Nov 10, 1998
Motorola, Inc.
Timothy L. Johnson
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Optoelectronic package including photonic device mounted in flexibl...
Patent number
5,768,456
Issue date
Jun 16, 1998
Motorola, Inc.
James H. Knapp
G02 - OPTICS
Information
Patent Grant
Optical waveguide
Patent number
5,761,364
Issue date
Jun 2, 1998
Motorola, Inc.
James H. Knapp
G02 - OPTICS
Information
Patent Grant
Polyimide optical waveguide having electrical conductivity
Patent number
5,659,648
Issue date
Aug 19, 1997
Motorola, Inc.
James H. Knapp
G02 - OPTICS
Information
Patent Grant
Method of fabricating an optical waveguide
Patent number
5,637,264
Issue date
Jun 10, 1997
Motorola, Inc.
James H. Knapp
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information
Patent Grant
Method for making semiconductor devices having electroplated leads
Patent number
5,529,682
Issue date
Jun 25, 1996
Motorola, Inc.
James H. Knapp
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device package and method of making
Patent number
5,468,910
Issue date
Nov 21, 1995
Motorola, Inc.
James H. Knapp
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package having an exposed die surface
Patent number
5,319,242
Issue date
Jun 7, 1994
Motorola, Inc.
Francis J. Carney
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of molding a carrier ring to leads
Patent number
5,182,071
Issue date
Jan 26, 1993
Motorola, Inc.
James H. Knapp
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information
Patent Grant
Apparatus for encapsulating a semiconductor device
Patent number
5,118,271
Issue date
Jun 2, 1992
Motorola, Inc.
John Baird
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information
Patent Grant
Plasma removal of unwanted material
Patent number
4,975,146
Issue date
Dec 4, 1990
Motorola Inc.
James H. Knapp
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Nitride removal method
Patent number
4,877,482
Issue date
Oct 31, 1989
Motorola Inc.
James H. Knapp
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Patents Applications
last 30 patents
Information
Patent Application
Method of marking a low profile packaged semiconductor device
Publication number
20060134836
Publication date
Jun 22, 2006
James Howard Knapp
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor device with wire bond inductor and method
Publication number
20050285262
Publication date
Dec 29, 2005
James Knapp
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method of forming a semiconductor package and leadframe therefor
Publication number
20050127482
Publication date
Jun 16, 2005
Semiconductor Components Industries, LLC.
Joseph K. Fauty
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DIRECT CHIP ATTACH STRUCTURE AND METHOD
Publication number
20040266037
Publication date
Dec 30, 2004
Semiconductor Components Industries, LLC.
James Knapp
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT AND LAMINATED LEADFRAME PACKAGE
Publication number
20040029312
Publication date
Feb 12, 2004
Semiconductor Components Industries, LLC.
James Knapp
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Integrated circuit and laminated leadframe package
Publication number
20040000702
Publication date
Jan 1, 2004
Semiconductor Components Industries, LLC.
James Knapp
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Structure and method of forming a multiple leadframe semiconductor...
Publication number
20030209804
Publication date
Nov 13, 2003
Semiconductor Components Industries, LLC.
James H. Knapp
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Structure and method of forming a multiple leadframe semiconductor...
Publication number
20030201520
Publication date
Oct 30, 2003
James H. Knapp
H01 - BASIC ELECTRIC ELEMENTS