James Isaac Fortner

Person

Newberg, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Methods and apparatus for flow isolation and focusing during electr...
- Patent number 11,001,934
- Issue date May 11, 2021
- Lam Research Corporation
- Stephen J. Banik
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
One-piece anode for tuning electroplating at an edge of a substrate
- Patent number 10,975,489
- Issue date Apr 13, 2021
- Lam Research Corporation
- James Isaac Fortner
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
High flow multi-way piston valve for deposition systems
- Patent number 10,969,036
- Issue date Apr 6, 2021
- Lam Research Corporation
- James Isaac Fortner
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Grant
Edge flow element for electroplating apparatus
- Patent number 10,094,034
- Issue date Oct 9, 2018
- Lam Research Corporation
- Gabriel Hay Graham
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Methods and apparatuses for dynamically tunable wafer-edge electrop...
- Patent number 9,752,248
- Issue date Sep 5, 2017
- Lam Research Corporation
- Burhanuddin Kagajwala
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Apparatus and method for dynamic control of plated uniformity with...
- Patent number 9,567,685
- Issue date Feb 14, 2017
- Lam Research Corporation
- Burhanuddin Kagajwala
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
ELECTRODEPOSITION OF METALS USING AN IONICALLY RESISTIVE IONICALLY...
- Publication number 20240141541
- Publication date May 2, 2024
- LAM RESEARCH CORPORATION
- Lee Peng Chua
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PROCESS KIT DE-BUBBLING
- Publication number 20230407514
- Publication date Dec 21, 2023
- LAM RESEARCH CORPORATION
- James Isaac Fortner
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ONE-PIECE ANODE FOR TUNING ELECTROPLATING AT AN EDGE OF A SUBSTRATE
- Publication number 20200173052
- Publication date Jun 4, 2020
- LAM RESEARCH CORPORATION
- James Isaac Fortner
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
HIGH FLOW MULTI-WAY PISTON VALVE FOR DEPOSITION SYSTEMS
- Publication number 20190368630
- Publication date Dec 5, 2019
- LAM RESEARCH CORPORATION
- James Isaac Fortner
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Application
METHODS AND APPARATUS FOR FLOW ISOLATION AND FOCUSING DURING ELECTR...
- Publication number 20190055665
- Publication date Feb 21, 2019
- LAM RESEARCH CORPORATION
- Stephen J. Banik
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROPLATING APPARATUS AND METHODS UTILIZING INDEPENDENT CONTROL...
- Publication number 20180258546
- Publication date Sep 13, 2018
- LAM RESEARCH CORPORATION
- Gabriel Hay Graham
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
EDGE FLOW ELEMENT FOR ELECTROPLATING APPARATUS
- Publication number 20170058417
- Publication date Mar 2, 2017
- LAM RESEARCH CORPORATION
- Gabriel Hay Graham
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
APPARATUS AND METHOD FOR DYNAMIC CONTROL OF PLATED UNIFORMITY WITH...
- Publication number 20160215408
- Publication date Jul 28, 2016
- LAM RESEARCH CORPORATION
- Burhanuddin Kagajwala
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHODS AND APPARATUSES FOR DYNAMICALLY TUNABLE WAFER-EDGE ELECTROP...
- Publication number 20160177466
- Publication date Jun 23, 2016
- LAM RESEARCH CORPORATION
- Burhanuddin Kagajawala
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

James Isaac Fortner

Person

Patents Grantslast 30 patents

Methods and apparatus for flow isolation and focusing during electr...

One-piece anode for tuning electroplating at an edge of a substrate

High flow multi-way piston valve for deposition systems

Edge flow element for electroplating apparatus

Methods and apparatuses for dynamically tunable wafer-edge electrop...

Apparatus and method for dynamic control of plated uniformity with...

Patents Applicationslast 30 patents

ELECTRODEPOSITION OF METALS USING AN IONICALLY RESISTIVE IONICALLY...

PROCESS KIT DE-BUBBLING

ONE-PIECE ANODE FOR TUNING ELECTROPLATING AT AN EDGE OF A SUBSTRATE

HIGH FLOW MULTI-WAY PISTON VALVE FOR DEPOSITION SYSTEMS

METHODS AND APPARATUS FOR FLOW ISOLATION AND FOCUSING DURING ELECTR...

ELECTROPLATING APPARATUS AND METHODS UTILIZING INDEPENDENT CONTROL...

EDGE FLOW ELEMENT FOR ELECTROPLATING APPARATUS

APPARATUS AND METHOD FOR DYNAMIC CONTROL OF PLATED UNIFORMITY WITH...

METHODS AND APPARATUSES FOR DYNAMICALLY TUNABLE WAFER-EDGE ELECTROP...