James J. Dietz

Person

Durham, NC, US

People

Patents Grantslast 30 patents

Information Patent Grant
System and method for testing one or more dies on a semiconductor w...
- Patent number 7,449,909
- Issue date Nov 11, 2008
- Infineon Technologies AG
- David SuitWai Ma
- G11 - INFORMATION STORAGE
Information Patent Grant
Integrated circuit in a maximum input/output configuration
- Patent number 7,305,594
- Issue date Dec 4, 2007
- Infineon Technologies AG
- James J. Dietz
- G11 - INFORMATION STORAGE
Information Patent Grant
System and method for testing one or more dies on a semiconductor w...
- Patent number 7,242,208
- Issue date Jul 10, 2007
- Infineon Technologies AG
- David SuitWai Ma
- G11 - INFORMATION STORAGE
Information Patent Grant
System and method for testing one or more dies on a semiconductor w...
- Patent number 7,119,567
- Issue date Oct 10, 2006
- Infineon Technologies North America Corp.
- David SuitWai Ma
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor wafer testing system
- Patent number 6,888,365
- Issue date May 3, 2005
- Infineon Technologies North America Corporation
- Daivid Suitwai Ma
- G01 - MEASURING TESTING
Information Patent Grant
Leadless socket for decapped semiconductor device
- Patent number 6,702,589
- Issue date Mar 9, 2004
- Infineon Technologies AG
- David SuitWai Ma
- G11 - INFORMATION STORAGE

Patents Applicationslast 30 patents

Information Patent Application
System and method for testing one or more dies on a semiconductor w...
- Publication number 20070152700
- Publication date Jul 5, 2007
- David SuitWai Ma
- G01 - MEASURING TESTING
Information Patent Application
System and method for testing one or more dies on a semiconductor w...
- Publication number 20060158209
- Publication date Jul 20, 2006
- Infineon Technologies AG
- David SuitWai Ma
- G01 - MEASURING TESTING
Information Patent Application
Integrated circuit in a maximum input/output configuration
- Publication number 20040103346
- Publication date May 27, 2004
- Infineon Technologies North America Corp.
- James J. Dietz
- G11 - INFORMATION STORAGE
Information Patent Application
Semiconductor die isolation system
- Publication number 20040051550
- Publication date Mar 18, 2004
- David Suitwai Ma
- G01 - MEASURING TESTING
Information Patent Application
Semiconductor wafer testing system
- Publication number 20040051547
- Publication date Mar 18, 2004
- Daivid Suitwai Ma
- G01 - MEASURING TESTING
Information Patent Application
System and method for testing one or more dies on a semiconductor w...
- Publication number 20040054951
- Publication date Mar 18, 2004
- David SuitWai Ma
- G01 - MEASURING TESTING
Information Patent Application
LEADLESS SOCKET FOR DECAPPED SEMICONDUCTOR DEVICE
- Publication number 20040033707
- Publication date Feb 19, 2004
- Infineon Technologies North America Corp.
- David SuitWai Ma
- G01 - MEASURING TESTING

James J. Dietz

Person

Patents Grantslast 30 patents

System and method for testing one or more dies on a semiconductor w...

Integrated circuit in a maximum input/output configuration

System and method for testing one or more dies on a semiconductor w...

System and method for testing one or more dies on a semiconductor w...

Semiconductor wafer testing system

Leadless socket for decapped semiconductor device

Patents Applicationslast 30 patents

System and method for testing one or more dies on a semiconductor w...

System and method for testing one or more dies on a semiconductor w...

Integrated circuit in a maximum input/output configuration

Semiconductor die isolation system

Semiconductor wafer testing system

System and method for testing one or more dies on a semiconductor w...

LEADLESS SOCKET FOR DECAPPED SEMICONDUCTOR DEVICE