JAMES M. BLACKWELL

Person

Portand, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Interconnect structure surface modifications by passivating agents
- Patent number 12,036,578
- Issue date Jul 16, 2024
- Intel Corporation
- Florian Gstrein
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Grant
Chemical compositions and methods of patterning microelectronic dev...
- Patent number 12,037,434
- Issue date Jul 16, 2024
- Intel Corporation
- Eungnak Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Subtractively patterned interconnect structures for integrated circ...
- Patent number 12,027,458
- Issue date Jul 2, 2024
- Intel Corporation
- Kevin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Directed self-assembly structures and techniques
- Patent number 12,012,473
- Issue date Jun 18, 2024
- Intel Corporation
- James Munro Blackwell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
EUV patterning methods, structures, and materials
- Patent number 11,984,317
- Issue date May 14, 2024
- Intel Corporation
- Marie Krysak
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Two-stage bake photoresist with releasable quencher
- Patent number 11,955,343
- Issue date Apr 9, 2024
- Intel Corporation
- Robert L. Bristol
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Lined photobucket structure for back end of line (BEOL) interconnec...
- Patent number 11,953,826
- Issue date Apr 9, 2024
- Intel Corporation
- James M. Blackwell
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Differential hardmasks for modulation of electrobucket sensitivity
- Patent number 11,955,377
- Issue date Apr 9, 2024
- Intel Corporation
- Kevin L. Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ligand-capped main group nanoparticles as high absorption extreme u...
- Patent number 11,874,600
- Issue date Jan 16, 2024
- Intel Corporation
- Marie Krysak
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Advanced lithography and self-assembled devices
- Patent number 11,854,787
- Issue date Dec 26, 2023
- Intel Corporation
- Richard E. Schenker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chain scission photoresists and methods for forming chain scission...
- Patent number 11,846,883
- Issue date Dec 19, 2023
- Intel Corporation
- Robert Bristol
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Subtractively patterned interconnect structures for integrated circ...
- Patent number 11,444,024
- Issue date Sep 13, 2022
- Intel Corporation
- Kevin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Activation of protected cross-linking catalysts during formation of...
- Patent number 11,406,972
- Issue date Aug 9, 2022
- Intel Corporation
- James M. Blackwell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced lithography and self-assembled devices
- Patent number 11,373,950
- Issue date Jun 28, 2022
- Intel Corporation
- Richard E. Schenker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ligand-capped main group nanoparticles as high absorption extreme u...
- Patent number 11,320,734
- Issue date May 3, 2022
- Intel Corporation
- Marie Krysak
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Two-stage bake photoresist with releasable quencher
- Patent number 11,315,798
- Issue date Apr 26, 2022
- Intel Corporation
- Robert L. Bristol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chain scission resist compositions for EUV lithography applications
- Patent number 11,262,654
- Issue date Mar 1, 2022
- Intel Corporation
- Lauren Doyle
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Differential hardmasks for modulation of electrobucket sensitivity
- Patent number 11,251,072
- Issue date Feb 15, 2022
- Intel Corporation
- Kevin L. Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bottom-up fill dielectric materials for semiconductor structure fab...
- Patent number 11,232,980
- Issue date Jan 25, 2022
- Intel Corporation
- Florian Gstrein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective etching and controlled atomic layer etching of transition...
- Patent number 11,217,456
- Issue date Jan 4, 2022
- Intel Corporation
- James M. Blackwell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carbon-based dielectric materials for semiconductor structure fabri...
- Patent number 11,217,455
- Issue date Jan 4, 2022
- Intel Corporation
- James M. Blackwell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lined photobucket structure for back end of line (BEOL) interconnec...
- Patent number 11,137,681
- Issue date Oct 5, 2021
- Intel Corporation
- James M. Blackwell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hardened plug for improved shorting margin
- Patent number 11,024,538
- Issue date Jun 1, 2021
- Intel Corporation
- Kevin L. Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Configurable resistor
- Patent number 11,011,481
- Issue date May 18, 2021
- Intel Corporation
- Kevin L. Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Triblock copolymers for self-aligning vias or contacts
- Patent number 10,950,501
- Issue date Mar 16, 2021
- Intel Corporation
- Todd R. Younkin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photobucket floor colors with selective grafting
- Patent number 10,892,184
- Issue date Jan 12, 2021
- Intel Corporation
- Robert L. Bristol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced lithography and self-assembled devices
- Patent number 10,892,223
- Issue date Jan 12, 2021
- Intel Corporation
- Richard E. Schenker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface-aligned lithographic patterning approaches for back end of...
- Patent number 10,796,909
- Issue date Oct 6, 2020
- Intel Corporation
- Robert L. Bristol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned via
- Patent number 10,615,117
- Issue date Apr 7, 2020
- Intel Corporation
- Kevin L. Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures and methods for improved lithographic processing
- Patent number 10,490,416
- Issue date Nov 26, 2019
- Intel Corporation
- Robert L. Bristol
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CHEMICAL COMPOSITIONS & METHODS OF PATTERNING MICROELECTRONIC DEVIC...
- Publication number 20240360264
- Publication date Oct 31, 2024
- Intel Corporation
- Eungnak Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBTRACTIVELY PATTERNED INTERCONNECT STRUCTURES FOR INTEGRATED CIRC...
- Publication number 20240304543
- Publication date Sep 12, 2024
- Intel Corporation
- Kevin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TIN CARBOXYLATE PRECURSORS FOR METAL OXIDE RESIST LAYERS AND RELATE...
- Publication number 20240272547
- Publication date Aug 15, 2024
- Intel Corporation
- Charles Cameron Mokhtarzadeh
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PATTERNING BASED ON IN-SITU FORMATION OF BLOCK COPOYLMER THROUGH DE...
- Publication number 20240222119
- Publication date Jul 4, 2024
- Intel Corporation
- Eungnak Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRECURSORS AND METHODS FOR PRODUCING BISMUTH-OXY-CARBIDE-BASED PHOT...
- Publication number 20240210821
- Publication date Jun 27, 2024
- Intel Corporation
- Charles Cameron Mokhtarzadeh
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
PRECURSORS AND METHODS FOR PRODUCING TIN-BASED PHOTORESIST
- Publication number 20240201586
- Publication date Jun 20, 2024
- Intel Corporation
- James Blackwell
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
ADVANCED LITHOGRAPHY AND SELF-ASSEMBLED DEVICES
- Publication number 20240071917
- Publication date Feb 29, 2024
- Intel Corporation
- Richard E. SCHENKER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBTRACTIVELY PATTERNED INTERCONNECT STRUCTURES FOR INTEGRATED CIR...
- Publication number 20220352068
- Publication date Nov 3, 2022
- Intel Corporation
- Kevin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADVANCED LITHOGRAPHY AND SELF-ASSEMBLED DEVICES
- Publication number 20220262722
- Publication date Aug 18, 2022
- Intel Corporation
- Richard E. SCHENKER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGAND-CAPPED MAIN GROUP NANOPARTICLES AS HIGH ABSORPTION EXTREME U...
- Publication number 20220229364
- Publication date Jul 21, 2022
- Intel Corporation
- Marie KRYSAK
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
TWO-STAGE BAKE PHOTORESIST WITH RELEASABLE QUENCHER
- Publication number 20220216065
- Publication date Jul 7, 2022
- Intel Corporation
- Robert L. BRISTOL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBTRACTIVELY PATTERNED INTERCONNECT STRUCTURES FOR INTEGRATED CIR...
- Publication number 20220139823
- Publication date May 5, 2022
- Intel Corporation
- Kevin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURES WITH AREA SELECTIVE ADHESION OR BARRIER MAT...
- Publication number 20220139772
- Publication date May 5, 2022
- Intel Corporation
- Christoper Jezewski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIFFERENTIAL HARDMASKS FOR MODULATION OF ELECTROBUCKET SENSITIVITY
- Publication number 20220130719
- Publication date Apr 28, 2022
- Intel Corporation
- Kevin L. LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOTTOM-UP FILL DIELECTRIC MATERIALS FOR SEMICONDUCTOR STRUCTURE FAB...
- Publication number 20220102207
- Publication date Mar 31, 2022
- Intel Corporation
- Florian GSTREIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LINED PHOTOBUCKET STRUCTURE FOR BACK END OF LINE (BEOL) INTERCONNEC...
- Publication number 20210397084
- Publication date Dec 23, 2021
- Intel Corporation
- James M. BLACKWELL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EUV PATTERNING METHODS, STRUCTURES, AND MATERIALS
- Publication number 20210375616
- Publication date Dec 2, 2021
- Intel Corporation
- Marie Krysak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMICAL COMPOSITIONS & METHODS OF PATTERNING MICROELECTRONIC DEVIC...
- Publication number 20210371566
- Publication date Dec 2, 2021
- Intel Corporation
- Eungnak Han
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
DIRECTED SELF-ASSEMBLY STRUCTURES AND TECHNIQUES
- Publication number 20210375745
- Publication date Dec 2, 2021
- Intel Corporation, Santa Clara, CA
- James Munro Blackwell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHAIN SCISSION RESIST COMPOSITIONS FOR EUV LITHOGRAPHY APPLICATIONS
- Publication number 20210200085
- Publication date Jul 1, 2021
- Intel Corporation
- Lauren Doyle
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
ADVANCED LITHOGRAPHY AND SELF-ASSEMBLED DEVICES
- Publication number 20210082800
- Publication date Mar 18, 2021
- Intel Corporation
- Richard E. SCHENKER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARBON-BASED DIELECTRIC MATERIALS FOR SEMICONDUCTOR STRUCTURE FABRI...
- Publication number 20210057230
- Publication date Feb 25, 2021
- Intel Corporation
- James M. BLACKWELL
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
INTEGRATED CIRCUIT STRUCTURE
- Publication number 20200402917
- Publication date Dec 24, 2020
- Intel Corporation
- Kevin L. Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE ETCHING AND CONTROLLED ATOMIC LAYER ETCHING OF TRANSITION...
- Publication number 20200395223
- Publication date Dec 17, 2020
- Intel Corporation
- James M. BLACKWELL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHAIN SCISSION PHOTORESISTS AND METHODS FOR FORMING CHAIN SCISSION...
- Publication number 20200103754
- Publication date Apr 2, 2020
- Intel Corporation
- Robert BRISTOL
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
HARDENED PLUG FOR IMPROVED SHORTING MARGIN
- Publication number 20200098629
- Publication date Mar 26, 2020
- Intel Corporation
- Kevin L. Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADVANCED LITHOGRAPHY AND SELF-ASSEMBLED DEVICES
- Publication number 20200066629
- Publication date Feb 27, 2020
- Intel Corporation
- Richard E. SCHENKER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONFIGURABLE RESISTOR
- Publication number 20190355678
- Publication date Nov 21, 2019
- Intel Corporation
- Kevin L. Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIFFERENTIAL HARDMASKS FOR MODULATION OF ELECTROBUCKET SENSITIVITY
- Publication number 20190318959
- Publication date Oct 17, 2019
- Intel Corporation
- Kevin L. LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTOBUCKET FLOOR COLORS WITH SELECTIVE GRAFTING
- Publication number 20190318958
- Publication date Oct 17, 2019
- Intel Corporation
- Robert L. BRISTOL
- H01 - BASIC ELECTRIC ELEMENTS

JAMES M. BLACKWELL

Person

Patents Grantslast 30 patents

Interconnect structure surface modifications by passivating agents

Chemical compositions and methods of patterning microelectronic dev...

Subtractively patterned interconnect structures for integrated circ...

Directed self-assembly structures and techniques

EUV patterning methods, structures, and materials

Two-stage bake photoresist with releasable quencher

Lined photobucket structure for back end of line (BEOL) interconnec...

Differential hardmasks for modulation of electrobucket sensitivity

Ligand-capped main group nanoparticles as high absorption extreme u...

Advanced lithography and self-assembled devices

Chain scission photoresists and methods for forming chain scission...

Subtractively patterned interconnect structures for integrated circ...

Activation of protected cross-linking catalysts during formation of...

Advanced lithography and self-assembled devices

Ligand-capped main group nanoparticles as high absorption extreme u...

Two-stage bake photoresist with releasable quencher

Chain scission resist compositions for EUV lithography applications

Differential hardmasks for modulation of electrobucket sensitivity

Bottom-up fill dielectric materials for semiconductor structure fab...

Selective etching and controlled atomic layer etching of transition...

Carbon-based dielectric materials for semiconductor structure fabri...

Lined photobucket structure for back end of line (BEOL) interconnec...

Hardened plug for improved shorting margin

Configurable resistor

Triblock copolymers for self-aligning vias or contacts

Photobucket floor colors with selective grafting

Advanced lithography and self-assembled devices

Surface-aligned lithographic patterning approaches for back end of...

Self-aligned via

Structures and methods for improved lithographic processing

Patents Applicationslast 30 patents

CHEMICAL COMPOSITIONS & METHODS OF PATTERNING MICROELECTRONIC DEVIC...

SUBTRACTIVELY PATTERNED INTERCONNECT STRUCTURES FOR INTEGRATED CIRC...

TIN CARBOXYLATE PRECURSORS FOR METAL OXIDE RESIST LAYERS AND RELATE...

PATTERNING BASED ON IN-SITU FORMATION OF BLOCK COPOYLMER THROUGH DE...

PRECURSORS AND METHODS FOR PRODUCING BISMUTH-OXY-CARBIDE-BASED PHOT...

PRECURSORS AND METHODS FOR PRODUCING TIN-BASED PHOTORESIST

ADVANCED LITHOGRAPHY AND SELF-ASSEMBLED DEVICES

SUBTRACTIVELY PATTERNED INTERCONNECT STRUCTURES FOR INTEGRATED CIR...

ADVANCED LITHOGRAPHY AND SELF-ASSEMBLED DEVICES

LIGAND-CAPPED MAIN GROUP NANOPARTICLES AS HIGH ABSORPTION EXTREME U...

TWO-STAGE BAKE PHOTORESIST WITH RELEASABLE QUENCHER

SUBTRACTIVELY PATTERNED INTERCONNECT STRUCTURES FOR INTEGRATED CIR...

INTERCONNECT STRUCTURES WITH AREA SELECTIVE ADHESION OR BARRIER MAT...

DIFFERENTIAL HARDMASKS FOR MODULATION OF ELECTROBUCKET SENSITIVITY

BOTTOM-UP FILL DIELECTRIC MATERIALS FOR SEMICONDUCTOR STRUCTURE FAB...

LINED PHOTOBUCKET STRUCTURE FOR BACK END OF LINE (BEOL) INTERCONNEC...

EUV PATTERNING METHODS, STRUCTURES, AND MATERIALS

CHEMICAL COMPOSITIONS & METHODS OF PATTERNING MICROELECTRONIC DEVIC...

DIRECTED SELF-ASSEMBLY STRUCTURES AND TECHNIQUES

CHAIN SCISSION RESIST COMPOSITIONS FOR EUV LITHOGRAPHY APPLICATIONS

ADVANCED LITHOGRAPHY AND SELF-ASSEMBLED DEVICES

CARBON-BASED DIELECTRIC MATERIALS FOR SEMICONDUCTOR STRUCTURE FABRI...

INTEGRATED CIRCUIT STRUCTURE

SELECTIVE ETCHING AND CONTROLLED ATOMIC LAYER ETCHING OF TRANSITION...

CHAIN SCISSION PHOTORESISTS AND METHODS FOR FORMING CHAIN SCISSION...

HARDENED PLUG FOR IMPROVED SHORTING MARGIN

ADVANCED LITHOGRAPHY AND SELF-ASSEMBLED DEVICES

CONFIGURABLE RESISTOR

DIFFERENTIAL HARDMASKS FOR MODULATION OF ELECTROBUCKET SENSITIVITY

PHOTOBUCKET FLOOR COLORS WITH SELECTIVE GRAFTING