James M. Holden

Person

San Jose, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Wafer dicing using femtosecond-based laser and plasma etch
- Patent number 12,131,952
- Issue date Oct 29, 2024
- Applied Materials, Inc.
- Wei-Sheng Lei
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer dicing using femtosecond-based laser and plasma etch
- Patent number 11,621,194
- Issue date Apr 4, 2023
- Applied Materials, Inc.
- Wei-Sheng Lei
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Proximity contact cover ring for plasma dicing
- Patent number 11,195,756
- Issue date Dec 7, 2021
- Applied Materials, Inc.
- James M. Holden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer dicing using femtosecond-based laser and plasma etch
- Patent number 10,910,271
- Issue date Feb 2, 2021
- Applied Materials, Inc.
- Wei-Sheng Lei
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer dicing using femtosecond-based laser and plasma etch
- Patent number 10,714,390
- Issue date Jul 14, 2020
- Applied Materials, Inc.
- Wei-Sheng Lei
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Transfer arm for film frame substrate handling during plasma singul...
- Patent number 10,692,765
- Issue date Jun 23, 2020
- Applied Materials, Inc.
- James M. Holden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer dicing using femtosecond-based laser and plasma etch
- Patent number 10,566,238
- Issue date Feb 18, 2020
- Applied Materials, Inc.
- Wei-Sheng Lei
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods and apparatus for substrate edge cleaning
- Patent number 10,217,650
- Issue date Feb 26, 2019
- Applied Materials, Inc.
- James Matthew Holden
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Grant
Wafer dicing using femtosecond-based laser and plasma etch
- Patent number 10,163,713
- Issue date Dec 25, 2018
- Applied Materials, Inc.
- Wei-Sheng Lei
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Damage isolation by shaped beam delivery in laser scribing process
- Patent number 10,112,259
- Issue date Oct 30, 2018
- Applied Materials, Inc.
- James M. Holden
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods and apparatus for substrate edge cleaning
- Patent number 9,443,714
- Issue date Sep 13, 2016
- Applied Materials, Inc.
- James Matthew Holden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and carrier for dicing a wafer
- Patent number 9,299,614
- Issue date Mar 29, 2016
- Applied Materials, Inc.
- James M. Holden
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer dicing using femtosecond-based laser and plasma etch
- Patent number 9,245,802
- Issue date Jan 26, 2016
- Applied Materials, Inc.
- Wei-Sheng Lei
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hybrid laser and plasma etch wafer dicing using substrate carrier
- Patent number 9,218,992
- Issue date Dec 22, 2015
- Applied Materials, Inc.
- Saravjeet Singh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods and apparatus for cleaning a substrate
- Patent number 9,177,782
- Issue date Nov 3, 2015
- Applied Materials, Inc.
- James Matthew Holden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bi-layer wafer-level underfill mask for wafer dicing and approaches...
- Patent number 9,130,056
- Issue date Sep 8, 2015
- Applied Materials, Inc.
- James M. Holden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-step and asymmetrically shaped laser beam scribing
- Patent number 9,054,176
- Issue date Jun 9, 2015
- Applied Materials, Inc.
- Wei-Sheng Lei
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Damage isolation by shaped beam delivery in laser scribing process
- Patent number 9,029,242
- Issue date May 12, 2015
- Applied Materials, Inc.
- James M. Holden
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Pre-patterned dry laminate mask for wafer dicing processes
- Patent number 8,999,816
- Issue date Apr 7, 2015
- Applied Materials, Inc.
- James M. Holden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid laser and plasma etch wafer dicing using substrate carrier
- Patent number 8,912,077
- Issue date Dec 16, 2014
- Applied Materials, Inc.
- Saravjeet Singh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Approaches for cleaning a wafer during hybrid laser scribing and pl...
- Patent number 8,883,615
- Issue date Nov 11, 2014
- Applied Materials, Inc.
- James Matthew Holden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer dicing using femtosecond-based laser and plasma etch
- Patent number 8,853,056
- Issue date Oct 7, 2014
- Applied Materials, Inc.
- Wei-Sheng Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-step and asymmetrically shaped laser beam scribing
- Patent number 8,759,197
- Issue date Jun 24, 2014
- Applied Materials, Inc.
- James M. Holden
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer dicing using femtosecond-based laser and plasma etch
- Patent number 8,642,448
- Issue date Feb 4, 2014
- Applied Materials, Inc.
- Wei-Sheng Lei
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-layer mask for substrate dicing by laser and plasma etch
- Patent number 8,557,682
- Issue date Oct 15, 2013
- Applied Materials, Inc.
- James M. Holden
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-step and asymmetrically shaped laser beam scribing
- Patent number 8,557,683
- Issue date Oct 15, 2013
- Applied Materials, Inc.
- Wei-Sheng Lei
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Spectrographic metrology of patterned wafers
- Patent number 7,969,568
- Issue date Jun 28, 2011
- Applied Materials, Inc.
- James Matthew Holden
- G01 - MEASURING TESTING
Information Patent Grant
Spectrometer measurement of diffracting structures
- Patent number 7,372,565
- Issue date May 13, 2008
- Nanometrics Incorporated
- James M. Holden
- G01 - MEASURING TESTING
Information Patent Grant
Apparatus and method for the measurement of diffracting structures
- Patent number 7,115,858
- Issue date Oct 3, 2006
- Nanometrics Incorporated
- James M. Holden
- G01 - MEASURING TESTING
Information Patent Grant
Configurable metrology device that operates in reflectance mode, tr...
- Patent number 6,842,251
- Issue date Jan 11, 2005
- Nanometrics Incorporated
- James M. Holden
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
WAFER DICING USING FEMTOSECOND-BASED LASER AND PLASMA ETCH
- Publication number 20230207393
- Publication date Jun 29, 2023
- Applied Materials, Inc.
- Wei-Sheng Lei
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER DICING USING FEMTOSECOND-BASED LASER AND PLASMA ETCH
- Publication number 20210134676
- Publication date May 6, 2021
- Applied Materials, Inc.
- Wei-Sheng Lei
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER DICING USING FEMTOSECOND-BASED LASER AND PLASMA ETCH
- Publication number 20200286787
- Publication date Sep 10, 2020
- Applied Materials, Inc.
- Wei-Sheng Lei
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
TRANSFER ARM FOR FILM FRAME SUBSTRATE HANDLING DURING PLASMA SINGUL...
- Publication number 20200258780
- Publication date Aug 13, 2020
- Applied Materials, Inc.
- James M. Holden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER DICING USING FEMTOSECOND-BASED LASER AND PLASMA ETCH
- Publication number 20200118880
- Publication date Apr 16, 2020
- Applied Materials, Inc.
- Wei-Sheng Lei
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER DICING USING FEMTOSECOND-BASED LASER AND PLASMA ETCH
- Publication number 20190088549
- Publication date Mar 21, 2019
- Applied Materials, Inc.
- Wei-Sheng Lei
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS AND APPARATUS FOR SUBSTRATE EDGE CLEANING
- Publication number 20170018441
- Publication date Jan 19, 2017
- Applied Materials, Inc.
- JAMES MATTHEW HOLDEN
- B08 - CLEANING
Information Patent Application
WAFER DICING USING FEMTOSECOND-BASED LASER AND PLASMA ETCH
- Publication number 20160141210
- Publication date May 19, 2016
- Wei-Sheng Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSFER ARM FOR FILM FRAME SUBSTRATE HANDLING DURING PLASMA SINGUL...
- Publication number 20160133519
- Publication date May 12, 2016
- James M. Holden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROXIMITY CONTACT COVER RING FOR PLASMA DICING
- Publication number 20160086852
- Publication date Mar 24, 2016
- James M. Holden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPROACHES FOR CLEANING A WAFER DURING HYBRID LASER SCRIBING AND PL...
- Publication number 20150255349
- Publication date Sep 10, 2015
- James Matthew Holden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DAMAGE ISOLATION BY SHAPED BEAM DELIVERY IN LASER SCRIBING PROCESS
- Publication number 20150217401
- Publication date Aug 6, 2015
- James M. HOLDEN
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND CARRIER FOR DICING A WAFER
- Publication number 20150162244
- Publication date Jun 11, 2015
- James M. Holden
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER DICING USING FEMTOSECOND-BASED LASER AND PLASMA ETCH
- Publication number 20140367041
- Publication date Dec 18, 2014
- Wei-Sheng Lei
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS AND APPARATUS FOR CLEANING A SUBSTRATE
- Publication number 20140251374
- Publication date Sep 11, 2014
- Applied Materials, Inc.
- JAMES MATTHEW HOLDEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR SUBSTRATE EDGE CLEANING
- Publication number 20140251375
- Publication date Sep 11, 2014
- JAMES MATTHEW HOLDEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-STEP AND ASYMMETRICALLY SHAPED LASER BEAM SCRIBING
- Publication number 20140246153
- Publication date Sep 4, 2014
- James M. Holden
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
HYBRID LASER AND PLASMA ETCH WAFER DICING USING SUBSTRATE CARRIER
- Publication number 20140144585
- Publication date May 29, 2014
- Saravjeet Singh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER DICING USING FEMTOSECOND-BASED LASER AND PLASMA ETCH
- Publication number 20140120697
- Publication date May 1, 2014
- Applied Materials, Inc.
- Wei-Sheng Lei
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-LAYER MASK FOR SUBSTRATE DICING BY LASER AND PLASMA ETCH
- Publication number 20140011337
- Publication date Jan 9, 2014
- James M. Holden
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-STEP AND ASYMMETRICALLY SHAPED LASER BEAM SCRIBING
- Publication number 20140011338
- Publication date Jan 9, 2014
- Wei-Sheng Lei
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LASER SCRIBING SYSTEMS, APPARATUS, AND METHODS
- Publication number 20130122687
- Publication date May 16, 2013
- Applied Materials, Inc.
- James Matthew Holden
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
HYBRID LASER AND PLASMA ETCH WAFER DICING USING SUBSTRATE CARRIER
- Publication number 20120322239
- Publication date Dec 20, 2012
- Saravjeet Singh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-STEP AND ASYMMETRICALLY SHAPED LASER BEAM SCRIBING
- Publication number 20120322232
- Publication date Dec 20, 2012
- Applied Materials, Inc.
- James M. HOLDEN
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
DAMAGE ISOLATION BY SHAPED BEAM DELIVERY IN LASER SCRIBING PROCESS
- Publication number 20120322240
- Publication date Dec 20, 2012
- Applied Materials, Inc.
- James M. HOLDEN
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-STEP AND ASYMMETRICALLY SHAPED LASER BEAM SCRIBING
- Publication number 20120322242
- Publication date Dec 20, 2012
- Applied Materials, Inc.
- Wei-Sheng LEI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-LAYER MASK FOR SUBSTRATE DICING BY LASER AND PLASMA ETCH
- Publication number 20120322241
- Publication date Dec 20, 2012
- Applied Materials, Inc.
- James M. HOLDEN
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER DICING USING FEMTOSECOND-BASED LASER AND PLASMA ETCH
- Publication number 20110312157
- Publication date Dec 22, 2011
- Wei-Sheng Lei
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTEGRATED THIN FILM METROLOGY SYSTEM USED IN A SOLAR CELL PRODUCTI...
- Publication number 20110033957
- Publication date Feb 10, 2011
- Applied Materials, Inc.
- James Matthew Holden
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
SPECTROGRAPHIC METROLOGY OF PATTERNED WAFERS
- Publication number 20100103411
- Publication date Apr 29, 2010
- Applied Materials, Inc.
- JAMES Matthew HOLDEN
- G01 - MEASURING TESTING

James M. Holden

Person

Patents Grantslast 30 patents

Wafer dicing using femtosecond-based laser and plasma etch

Wafer dicing using femtosecond-based laser and plasma etch

Proximity contact cover ring for plasma dicing

Wafer dicing using femtosecond-based laser and plasma etch

Wafer dicing using femtosecond-based laser and plasma etch

Transfer arm for film frame substrate handling during plasma singul...

Wafer dicing using femtosecond-based laser and plasma etch

Methods and apparatus for substrate edge cleaning

Wafer dicing using femtosecond-based laser and plasma etch

Damage isolation by shaped beam delivery in laser scribing process

Methods and apparatus for substrate edge cleaning

Method and carrier for dicing a wafer

Wafer dicing using femtosecond-based laser and plasma etch

Hybrid laser and plasma etch wafer dicing using substrate carrier

Methods and apparatus for cleaning a substrate

Bi-layer wafer-level underfill mask for wafer dicing and approaches...

Multi-step and asymmetrically shaped laser beam scribing

Damage isolation by shaped beam delivery in laser scribing process

Pre-patterned dry laminate mask for wafer dicing processes

Hybrid laser and plasma etch wafer dicing using substrate carrier

Approaches for cleaning a wafer during hybrid laser scribing and pl...

Wafer dicing using femtosecond-based laser and plasma etch

Multi-step and asymmetrically shaped laser beam scribing

Wafer dicing using femtosecond-based laser and plasma etch

Multi-layer mask for substrate dicing by laser and plasma etch

Multi-step and asymmetrically shaped laser beam scribing

Spectrographic metrology of patterned wafers

Spectrometer measurement of diffracting structures

Apparatus and method for the measurement of diffracting structures

Configurable metrology device that operates in reflectance mode, tr...

Patents Applicationslast 30 patents

WAFER DICING USING FEMTOSECOND-BASED LASER AND PLASMA ETCH

WAFER DICING USING FEMTOSECOND-BASED LASER AND PLASMA ETCH

WAFER DICING USING FEMTOSECOND-BASED LASER AND PLASMA ETCH

TRANSFER ARM FOR FILM FRAME SUBSTRATE HANDLING DURING PLASMA SINGUL...

WAFER DICING USING FEMTOSECOND-BASED LASER AND PLASMA ETCH

WAFER DICING USING FEMTOSECOND-BASED LASER AND PLASMA ETCH

METHODS AND APPARATUS FOR SUBSTRATE EDGE CLEANING

WAFER DICING USING FEMTOSECOND-BASED LASER AND PLASMA ETCH

TRANSFER ARM FOR FILM FRAME SUBSTRATE HANDLING DURING PLASMA SINGUL...

PROXIMITY CONTACT COVER RING FOR PLASMA DICING

APPROACHES FOR CLEANING A WAFER DURING HYBRID LASER SCRIBING AND PL...

DAMAGE ISOLATION BY SHAPED BEAM DELIVERY IN LASER SCRIBING PROCESS

METHOD AND CARRIER FOR DICING A WAFER

WAFER DICING USING FEMTOSECOND-BASED LASER AND PLASMA ETCH

METHODS AND APPARATUS FOR CLEANING A SUBSTRATE

METHODS AND APPARATUS FOR SUBSTRATE EDGE CLEANING

MULTI-STEP AND ASYMMETRICALLY SHAPED LASER BEAM SCRIBING

HYBRID LASER AND PLASMA ETCH WAFER DICING USING SUBSTRATE CARRIER

WAFER DICING USING FEMTOSECOND-BASED LASER AND PLASMA ETCH

MULTI-LAYER MASK FOR SUBSTRATE DICING BY LASER AND PLASMA ETCH

MULTI-STEP AND ASYMMETRICALLY SHAPED LASER BEAM SCRIBING

LASER SCRIBING SYSTEMS, APPARATUS, AND METHODS

HYBRID LASER AND PLASMA ETCH WAFER DICING USING SUBSTRATE CARRIER

MULTI-STEP AND ASYMMETRICALLY SHAPED LASER BEAM SCRIBING

DAMAGE ISOLATION BY SHAPED BEAM DELIVERY IN LASER SCRIBING PROCESS

MULTI-STEP AND ASYMMETRICALLY SHAPED LASER BEAM SCRIBING

MULTI-LAYER MASK FOR SUBSTRATE DICING BY LASER AND PLASMA ETCH

WAFER DICING USING FEMTOSECOND-BASED LASER AND PLASMA ETCH

INTEGRATED THIN FILM METROLOGY SYSTEM USED IN A SOLAR CELL PRODUCTI...

SPECTROGRAPHIC METROLOGY OF PATTERNED WAFERS