James Mathew

Person

Boise, ID, US

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated structures and methods of forming integrated structures
- Patent number 11,195,854
- Issue date Dec 7, 2021
- Micron Technology, Inc.
- Jie Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Slit stress modulation in semiconductor substrates
- Patent number 10,784,144
- Issue date Sep 22, 2020
- Intel Corporation
- James Mathew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated structures and methods of forming integrated structures
- Patent number 10,580,792
- Issue date Mar 3, 2020
- Micron Technology, Inc.
- Jie Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated structures and methods of forming integrated structures
- Patent number 10,083,984
- Issue date Sep 25, 2018
- Micron Technology, Inc.
- Jie Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Slit stress modulation in semiconductor substrates
- Patent number 9,935,000
- Issue date Apr 3, 2018
- Intel Corporation
- James Mathew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated structures and methods of forming integrated structures
- Patent number 9,773,805
- Issue date Sep 26, 2017
- Micron Technology, Inc.
- Jie Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming air gaps in memory arrays and memory arrays with air gaps t...
- Patent number 9,397,210
- Issue date Jul 19, 2016
- Micron Technology, Inc.
- James Mathew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Source/drain zones with a delectric plug over an isolation region b...
- Patent number 8,907,396
- Issue date Dec 9, 2014
- Micron Technology, Inc.
- John Hopkins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit devices and methods of forming memory array and...
- Patent number 8,575,716
- Issue date Nov 5, 2013
- Micron Technology, Inc.
- James Mathew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming air gaps in memory arrays and memory arrays with air gaps t...
- Patent number 8,569,130
- Issue date Oct 29, 2013
- Micron Technology, Inc.
- James Mathew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit devices and methods of forming memory array and...
- Patent number 8,461,016
- Issue date Jun 11, 2013
- Micron Technology, Inc.
- James Mathew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact formation
- Patent number 8,377,819
- Issue date Feb 19, 2013
- Micron Technology, Inc.
- James Mathew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact formation
- Patent number 8,034,706
- Issue date Oct 11, 2011
- Micron Technology, Inc.
- James Mathew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact formation
- Patent number 7,737,022
- Issue date Jun 15, 2010
- Micron Technology, Inc.
- James Mathew
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Integrated Structures and Methods of Forming Integrated Structures
- Publication number 20200176471
- Publication date Jun 4, 2020
- Micron Technology, Inc.
- Jie Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Integrated Structures and Methods of Forming Integrated Structures
- Publication number 20180358378
- Publication date Dec 13, 2018
- Micron Technology, Inc.
- Jie Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SLIT STRESS MODULATION IN SEMICONDUCTOR SUBSTRATES
- Publication number 20180174890
- Publication date Jun 21, 2018
- Intel Corporation
- James Mathew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Structures and Methods of Forming Integrated Structures
- Publication number 20170365617
- Publication date Dec 21, 2017
- Jie Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SLIT STRESS MODULATION IN SEMICONDUCTOR SUBSTRATES
- Publication number 20170250108
- Publication date Aug 31, 2017
- Intel Corporation
- James Mathew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMING AIR GAPS IN MEMORY ARRAYS AND MEMORY ARRAYS WITH AIR GAPS T...
- Publication number 20140027832
- Publication date Jan 30, 2014
- Micron Technology, Inc.
- James Mathew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICES AND METHODS OF FORMING MEMORY ARRAY AND...
- Publication number 20130249050
- Publication date Sep 26, 2013
- Micron Technology, Inc.
- James Mathew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOURCE/DRAIN ZONES WITH A DELECTRIC PLUG OVER AN ISOLATION REGION B...
- Publication number 20130168756
- Publication date Jul 4, 2013
- Micron Technology, Inc.
- John Hopkins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Devices And Methods Of Forming Memory Array And...
- Publication number 20130087883
- Publication date Apr 11, 2013
- James Mathew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT FORMATION
- Publication number 20120009779
- Publication date Jan 12, 2012
- Micron Technology, Inc.
- James Mathew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT FORMATION
- Publication number 20100233875
- Publication date Sep 16, 2010
- Micron Technology, Inc.
- James Mathew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT FORMATION
- Publication number 20090176365
- Publication date Jul 9, 2009
- Micron Technology, Inc.
- James Mathew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA TREATMENT OF INSULATING MATERIAL
- Publication number 20080246124
- Publication date Oct 9, 2008
- James Mathew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Contact formation
- Publication number 20070202677
- Publication date Aug 30, 2007
- Micron Technology, Inc.
- James Mathew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Hard mask damascene process used to form a semiconductor device
- Publication number 20030087514
- Publication date May 8, 2003
- Sanh Dang Tang
- H01 - BASIC ELECTRIC ELEMENTS

James Mathew

Person

Patents Grantslast 30 patents

Integrated structures and methods of forming integrated structures

Slit stress modulation in semiconductor substrates

Integrated structures and methods of forming integrated structures

Integrated structures and methods of forming integrated structures

Slit stress modulation in semiconductor substrates

Integrated structures and methods of forming integrated structures

Forming air gaps in memory arrays and memory arrays with air gaps t...

Source/drain zones with a delectric plug over an isolation region b...

Integrated circuit devices and methods of forming memory array and...

Forming air gaps in memory arrays and memory arrays with air gaps t...

Integrated circuit devices and methods of forming memory array and...

Contact formation

Contact formation

Contact formation

Patents Applicationslast 30 patents

Integrated Structures and Methods of Forming Integrated Structures

Integrated Structures and Methods of Forming Integrated Structures

SLIT STRESS MODULATION IN SEMICONDUCTOR SUBSTRATES

Integrated Structures and Methods of Forming Integrated Structures

SLIT STRESS MODULATION IN SEMICONDUCTOR SUBSTRATES

FORMING AIR GAPS IN MEMORY ARRAYS AND MEMORY ARRAYS WITH AIR GAPS T...

INTEGRATED CIRCUIT DEVICES AND METHODS OF FORMING MEMORY ARRAY AND...

SOURCE/DRAIN ZONES WITH A DELECTRIC PLUG OVER AN ISOLATION REGION B...

Integrated Circuit Devices And Methods Of Forming Memory Array And...

CONTACT FORMATION

CONTACT FORMATION

CONTACT FORMATION

PLASMA TREATMENT OF INSULATING MATERIAL

Contact formation

Hard mask damascene process used to form a semiconductor device