James Russell Bupp

Person

Endwell, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Manufacturing methods for printed circuit boards
- Patent number 7,240,430
- Issue date Jul 10, 2007
- International Business Machines Corporation
- Bernd Karl-Heinz Appelt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing methods for printed circuit boards
- Patent number 6,902,869
- Issue date Jun 7, 2005
- International Business Machines Corporation
- Bernd Karl-Heinz Appelt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing methods for printed circuit boards
- Patent number 6,684,497
- Issue date Feb 3, 2004
- International Business Machines Corporation
- Bernd Karl-Heinz Appelt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High performance packaging platform and method of making same
- Patent number 6,639,155
- Issue date Oct 28, 2003
- International Business Machines Corporation
- James R. Bupp
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board with continuous connective bumps
- Patent number 6,222,136
- Issue date Apr 24, 2001
- International Business Machines Corporation
- Bernd Karl-Heinz Appelt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic package with thermally conductive support member having...
- Patent number 5,773,884
- Issue date Jun 30, 1998
- International Business Machines Corporation
- Frank Edward Andros
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package with thermally conductive support member having...
- Patent number 5,633,533
- Issue date May 27, 1997
- International Business Machines Corporation
- Frank E. Andros
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package with thermally conductive support member having...
- Patent number 5,561,323
- Issue date Oct 1, 1996
- International Business Machines Corporation
- Frank E. Andros
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making an electronic package with a thermally conductive...
- Patent number 5,519,936
- Issue date May 28, 1996
- International Business Machines Corporation
- Frank E. Andros
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for conditioning a surface of a dielectric substrate for ele...
- Patent number 4,554,182
- Issue date Nov 19, 1985
- International Business Machines Corporation
- James R. Bupp
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Conditioning of a substrate for electroless direct bond plating in...
- Patent number 4,478,883
- Issue date Oct 23, 1984
- International Business Machines Corporation
- James R. Bupp
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of detecting and analyzing damage in printed circuit boards
- Patent number 4,400,618
- Issue date Aug 23, 1983
- International Business Machines Corporation
- James R. Bupp
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
Manufacturing methods for printed circuit boards
- Publication number 20050124096
- Publication date Jun 9, 2005
- International Business Machines Corporation
- Bernd Karl-Heinz Appelt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Manufacturing methods for printed circuit boards
- Publication number 20040091821
- Publication date May 13, 2004
- International Business Machines Corporation
- Bernd Karl-Heinz Appelt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Manufacturing methods for printed circuit boards
- Publication number 20010032828
- Publication date Oct 25, 2001
- International Business Machines Corporation
- Bernd Karl-Heinz Appelt
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

James Russell Bupp

Person

Patents Grantslast 30 patents

Manufacturing methods for printed circuit boards

Manufacturing methods for printed circuit boards

Manufacturing methods for printed circuit boards

High performance packaging platform and method of making same

Printed circuit board with continuous connective bumps

Electronic package with thermally conductive support member having...

Electronic package with thermally conductive support member having...

Electronic package with thermally conductive support member having...

Method of making an electronic package with a thermally conductive...

Method for conditioning a surface of a dielectric substrate for ele...

Conditioning of a substrate for electroless direct bond plating in...

Method of detecting and analyzing damage in printed circuit boards

Patents Applicationslast 30 patents

Manufacturing methods for printed circuit boards

Manufacturing methods for printed circuit boards

Manufacturing methods for printed circuit boards