Jason G. Milne

Person

El Segundo, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Die package having security features
- Patent number 11,688,700
- Issue date Jun 27, 2023
- Raytheon Company
- Jason M. Kehl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die encapsulation in oxide bonded wafer stack
- Patent number 10,784,234
- Issue date Sep 22, 2020
- Raytheon Company
- John J. Drab
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High frequency polymer on metal radiator
- Patent number 10,581,177
- Issue date Mar 3, 2020
- Raytheon Company
- Robert S. Isom
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanically improved microelectronic thermal interface structure f...
- Patent number 10,446,466
- Issue date Oct 15, 2019
- Raytheon Company
- Jason G. Milne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die encapsulation in oxide bonded wafer stack
- Patent number 10,242,967
- Issue date Mar 26, 2019
- Raytheon Company
- John J. Drab
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro-hoses for integrated circuit and device level cooling
- Patent number 9,960,101
- Issue date May 1, 2018
- Raytheon Company
- Jason G. Milne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Short coincident phased slot-fed dual polarized aperture
- Patent number 9,893,430
- Issue date Feb 13, 2018
- Raytheon Company
- Allen T. S. Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coolant distribution structure for monolithic microwave integrated...
- Patent number 9,502,330
- Issue date Nov 22, 2016
- Raytheon Company
- Anurag Gupta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Aerogel dielectric layer
- Patent number 9,218,989
- Issue date Dec 22, 2015
- Raytheon Company
- Mark S. Hauhe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RF puck
- Patent number 8,982,931
- Issue date Mar 17, 2015
- Raytheon Company
- John P. Gianvittorio
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Stacked wafer with coolant channels
- Patent number 8,921,992
- Issue date Dec 30, 2014
- Raytheon Company
- Christopher R. Koontz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for packaging semiconductors at a wafer level
- Patent number 8,653,673
- Issue date Feb 18, 2014
- Raytheon Company
- Robert B. Hallock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Variable height radiating aperture
- Patent number 8,648,759
- Issue date Feb 11, 2014
- Raytheon Company
- Allen Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for producing large flat panel and conformal active array a...
- Patent number 8,209,846
- Issue date Jul 3, 2012
- Raytheon Company
- Avery Y. Quil
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Methods for producing large flat panel and conformal active array a...
- Patent number 7,631,414
- Issue date Dec 15, 2009
- Raytheon Company
- Avery Y. Quil
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DIE PACKAGE HAVING SECURITY FEATURES
- Publication number 20220399290
- Publication date Dec 15, 2022
- Raytheon Company
- Jason M. Kehl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MECHANICALLY IMPROVED MICROELECTRONIC THERMAL INTERFACE STRUCTURE F...
- Publication number 20190341328
- Publication date Nov 7, 2019
- Raytheon Company
- Jason G. Milne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE ENCAPSULATION IN OXIDE BONDED WAFER STACK
- Publication number 20190221547
- Publication date Jul 18, 2019
- Raytheon Company
- John J. Drab
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE ENCAPSULATION IN OXIDE BONDED WAFER STACK
- Publication number 20180337160
- Publication date Nov 22, 2018
- Raytheon Company
- John J. Drab
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TILE FOR AN ACTIVE ELECTRONICALLY SCANNED ARRAY (AESA)
- Publication number 20180175476
- Publication date Jun 21, 2018
- Raytheon Company
- Mary A. Teshiba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH FREQUENCY POLYMER ON METAL RADIATOR
- Publication number 20180175513
- Publication date Jun 21, 2018
- Raytheon Company
- Robert S. Isom
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Coolant Distribution Structure For Monolithic Microwave Integrated...
- Publication number 20160365300
- Publication date Dec 15, 2016
- Raytheon Company
- Anurag Gupta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO-HOSES FOR INTEGRATED CIRCUIT AND DEVICE LEVEL COOLING
- Publication number 20160358842
- Publication date Dec 8, 2016
- Raytheon Company
- Jason G. Milne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP MMIC HAVING MOUNTING STIFFENER
- Publication number 20150380343
- Publication date Dec 31, 2015
- Raytheon Company
- Christopher R. Koontz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHORT COINCIDENT PHASED SLOT-FED DUAL POLARIZED APERTURE
- Publication number 20150077300
- Publication date Mar 19, 2015
- RAYTHEON COMPANY
- Allen T.S. Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RF PUCK
- Publication number 20140269856
- Publication date Sep 18, 2014
- Raytheon Company
- John P. Gianvittorio
- G01 - MEASURING TESTING
Information Patent Application
STACKED WAFER WITH COOLANT CHANNELS
- Publication number 20140264759
- Publication date Sep 18, 2014
- Christopher R. KOONTZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PACKAGING SEMICONDUCTORS AT A WAFER LEVEL
- Publication number 20130154124
- Publication date Jun 20, 2013
- Raytheon Company
- Robert B. Hallock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VARIABLE HEIGHT RADIATING APERTURE
- Publication number 20130082890
- Publication date Apr 4, 2013
- Raytheon Company
- Allen Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Aerogel dielectric layer
- Publication number 20130075795
- Publication date Mar 28, 2013
- Mark S. Hauhe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR PRODUCING LARGE FLAT PANEL AND CONFORMAL ACTIVE ARRAY A...
- Publication number 20100031495
- Publication date Feb 11, 2010
- Raytheon Company
- Avery Y. Quil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for producing large flat panel and conformal active array a...
- Publication number 20090044399
- Publication date Feb 19, 2009
- Raytheon Company
- Avery Y. Quil
- H01 - BASIC ELECTRIC ELEMENTS

Jason G. Milne

Person

Patents Grantslast 30 patents

Die package having security features

Die encapsulation in oxide bonded wafer stack

High frequency polymer on metal radiator

Mechanically improved microelectronic thermal interface structure f...

Die encapsulation in oxide bonded wafer stack

Micro-hoses for integrated circuit and device level cooling

Short coincident phased slot-fed dual polarized aperture

Coolant distribution structure for monolithic microwave integrated...

Aerogel dielectric layer

RF puck

Stacked wafer with coolant channels

Method for packaging semiconductors at a wafer level

Variable height radiating aperture

Methods for producing large flat panel and conformal active array a...

Methods for producing large flat panel and conformal active array a...

Patents Applicationslast 30 patents

DIE PACKAGE HAVING SECURITY FEATURES

MECHANICALLY IMPROVED MICROELECTRONIC THERMAL INTERFACE STRUCTURE F...

DIE ENCAPSULATION IN OXIDE BONDED WAFER STACK

DIE ENCAPSULATION IN OXIDE BONDED WAFER STACK

TILE FOR AN ACTIVE ELECTRONICALLY SCANNED ARRAY (AESA)

HIGH FREQUENCY POLYMER ON METAL RADIATOR

Coolant Distribution Structure For Monolithic Microwave Integrated...

MICRO-HOSES FOR INTEGRATED CIRCUIT AND DEVICE LEVEL COOLING

FLIP CHIP MMIC HAVING MOUNTING STIFFENER

SHORT COINCIDENT PHASED SLOT-FED DUAL POLARIZED APERTURE

RF PUCK

STACKED WAFER WITH COOLANT CHANNELS

METHOD FOR PACKAGING SEMICONDUCTORS AT A WAFER LEVEL

VARIABLE HEIGHT RADIATING APERTURE

Aerogel dielectric layer

METHODS FOR PRODUCING LARGE FLAT PANEL AND CONFORMAL ACTIVE ARRAY A...

Methods for producing large flat panel and conformal active array a...