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Jason R. Wright
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Chandler, AZ, US
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Patents Grants
last 30 patents
Information
Patent Grant
Method for increasing semiconductor device wafer strength
Patent number
10,998,231
Issue date
May 4, 2021
NXP USA, INC.
Colby Greg Rampley
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for making an electronic component package
Patent number
10,340,251
Issue date
Jul 2, 2019
NXP USA, INC.
Alan J. Magnus
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Microelectronic packages having mold-embedded traces and methods fo...
Patent number
9,899,298
Issue date
Feb 20, 2018
NXP USA, INC.
Michael B. Vincent
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic component package with multple electronic components
Patent number
9,761,570
Issue date
Sep 12, 2017
NXP USA, INC.
Michael B. Vincent
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wafer level packages and methods for producing wafer level packages...
Patent number
9,502,363
Issue date
Nov 22, 2016
FREESCALE SEMICONDUCTOR, INC.
Michael B. Vincent
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Microelectronic packages having mold-embedded traces and methods fo...
Patent number
9,331,029
Issue date
May 3, 2016
Freescale Semiconductor Inc.
Michael B. Vincent
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Devices and stacked microelectronic packages with package surface c...
Patent number
9,305,911
Issue date
Apr 5, 2016
FREESCALE SEMICONDUCTOR, INC.
Michael B. Vincent
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stacked microelectronic packages having sidewall conductors and met...
Patent number
9,299,670
Issue date
Mar 29, 2016
FREESCALE SEMICONDUCTOR, INC.
Weng F. Yap
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Microelectronic packages having layered interconnect structures and...
Patent number
9,281,293
Issue date
Mar 8, 2016
Freescale Semiconductor Inc.
Alan J. Magnus
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stacked microelectronic packages having sidewall conductors and met...
Patent number
9,257,415
Issue date
Feb 9, 2016
Freescale Semiconductor Inc.
Michael B Vincent
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stacked microelectronic packages having sidewall conductors and met...
Patent number
9,190,390
Issue date
Nov 17, 2015
Freescale Semiconductor Inc.
Zhiwei (Tony) Gong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stacked microelectronic packages having sidewall conductors and met...
Patent number
9,159,702
Issue date
Oct 13, 2015
Freescale Semiconductor Inc.
Zhiwei (Tony) Gong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device packaging having pre-encapsulation through via...
Patent number
9,142,502
Issue date
Sep 22, 2015
Zhiwei Gong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stacked microelectronic packages having patterned sidewall conducto...
Patent number
9,093,457
Issue date
Jul 28, 2015
Freescale Semiconductor Inc.
Zhiwei Gong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stacked microelectronic packages having sidewall conductors and met...
Patent number
9,064,977
Issue date
Jun 23, 2015
Freescale Semiconductor Inc.
Zhiwei Gong (Tony)
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stacked microelectronic packages having patterned sidewall conducto...
Patent number
9,040,387
Issue date
May 26, 2015
Freescale Semiconductor Inc.
Zhiwei Gong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Devices and stacked microelectronic packages with in-trench package...
Patent number
9,025,340
Issue date
May 5, 2015
FREESCALE SEMICONDUCTOR, INC.
Jason R. Wright
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method for packaging an electronic device assembly having a capped...
Patent number
8,592,241
Issue date
Nov 26, 2013
FREESCALE SEMICONDUCTOR, INC.
Scott M. Hayes
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Method of forming a packaged semiconductor device
Patent number
8,216,918
Issue date
Jul 10, 2012
FREESCALE SEMICONDUCTOR, INC.
Zhiwei Gong
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Methodology for processing a panel during semiconductor device fabr...
Patent number
7,892,950
Issue date
Feb 22, 2011
FREESCALE SEMICONDUCTOR, INC.
Alan J. Magnus
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
METHOD FOR INCREASING SEMICONDUCTOR DEVICE WAFER STRENGTH
Publication number
20200395247
Publication date
Dec 17, 2020
NXP USA, Inc.
Colby Greg Rampley
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR MAKING AN ELECTRONIC COMPONENT PACKAGE
Publication number
20180315734
Publication date
Nov 1, 2018
NXP USA, Inc.
Alan J. MAGNUS
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICROELECTRONIC PACKAGES HAVING MOLD-EMBEDDED TRACES AND METHODS F...
Publication number
20170092567
Publication date
Mar 30, 2017
Freescale Semiconductor Inc.
MICHAEL B. VINCENT
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WAFER LEVEL PACKAGES AND METHODS FOR PRODUCING WAFER LEVEL PACKAGES...
Publication number
20150270233
Publication date
Sep 24, 2015
MICHAEL B. VINCENT
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICROELECTRONIC PACKAGES HAVING MOLD-EMBEDDED TRACES AND METHODS F...
Publication number
20150262931
Publication date
Sep 17, 2015
MICHAEL B. VINCENT
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STACKED MICROELECTRONIC PACKAGES HAVING SIDEWALL CONDUCTORS AND MET...
Publication number
20150243635
Publication date
Aug 27, 2015
MICHAEL B. VINCENT
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DEVICES AND STACKED MICROELECTRONIC PACKAGES WITH PACKAGE SURFACE C...
Publication number
20150162310
Publication date
Jun 11, 2015
MICHAEL B. VINCENT
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICROELECTRONIC PACKAGES HAVING LAYERED INTERCONNECT STRUCTURES AND...
Publication number
20150115454
Publication date
Apr 30, 2015
Alan J. Magnus
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DEVICES AND STACKED MICROELECTRONIC PACKAGES WITH IN-TRENCH PACKAGE...
Publication number
20150092377
Publication date
Apr 2, 2015
JASON R. WRIGHT
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
STACKED MICROELECTRONIC PACKAGES HAVING SIDEWALL CONDUCTORS AND MET...
Publication number
20140264945
Publication date
Sep 18, 2014
WENG F. YAP
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STACKED MICROELECTRONIC PACKAGES HAVING SIDEWALL CONDUCTORS AND MET...
Publication number
20140054797
Publication date
Feb 27, 2014
FREESCALE SEMICONDUCTOR, INC.
ZHIWEI GONG (Tony)
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STACKED MICROELECTRONIC PACKAGES HAVING PATTERENED SIDEWALL CONDUCT...
Publication number
20140054796
Publication date
Feb 27, 2014
FREESCALE SEMICONDUCTOR, INC.
Zhiwei (Tony) Gong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STACKED MICROELECTRONIC PACKAGES HAVING SIDEWALL CONDUCTORS AND MET...
Publication number
20140054783
Publication date
Feb 27, 2014
FREESCALE SEMICONDUCTOR, INC.
ZHIWEI GONG (Tony)
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE PACKAGING USING ENCAPSULATED CONDUCTIVE BALLS...
Publication number
20130154091
Publication date
Jun 20, 2013
Jason R. Wright
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CAPPED DEVICE INTERCONNECT IN A SEMICONDUCTOR PACKAGE
Publication number
20130078753
Publication date
Mar 28, 2013
Scott M. Hayes
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
SEMICONDUCTOR DEVICE PACKAGING HAVING PRE-ENCAPSULATION THROUGH VIA...
Publication number
20130049217
Publication date
Feb 28, 2013
Zhiwei Gong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF FORMING A PACKAGED SEMICONDUCTOR DEVICE
Publication number
20120021565
Publication date
Jan 26, 2012
Zhiwei Gong
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
METHODOLOGY FOR PROCESSING A PANEL DURING SEMICONDUCTOR DEVICE FABR...
Publication number
20100279467
Publication date
Nov 4, 2010
FREESCALE SEMICONDUCTOR, INC.
Alan J. Magnus
H01 - BASIC ELECTRIC ELEMENTS