Jay A. Yoder

Person

Phoenix, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package structures and methods of manufacture
- Patent number 11,984,388
- Issue date May 14, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Stephen St. Germain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structures and methods of manufacture
- Patent number 11,710,686
- Issue date Jul 25, 2023
- Semiconductor Components Industries, LLC
- Stephen St. Germain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structures and methods of manufacture
- Patent number 11,217,515
- Issue date Jan 4, 2022
- Semiconductor Components Industries, LLC
- Stephen St. Germain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single or multi chip module package and related methods
- Patent number 10,522,448
- Issue date Dec 31, 2019
- Semiconductor Components Industries, LLC
- Stephen St. Germain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Holes and dimples to control solder flow
- Patent number 9,911,684
- Issue date Mar 6, 2018
- Semiconductor Components Industries, LLC
- Stephen St. Germain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single or multi chip module package and related methods
- Patent number 9,870,986
- Issue date Jan 16, 2018
- Semiconductor Components Industries, LLC
- Stephen St. Germain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die singulation method
- Patent number 9,847,219
- Issue date Dec 19, 2017
- Semiconductor Components Industries, LLC
- William F. Burghout
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single or multi chip module package and related methods
- Patent number 9,558,968
- Issue date Jan 31, 2017
- Semiconductor Components Industries, LLC
- Stephen St. Germain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die singulation method
- Patent number 9,484,210
- Issue date Nov 1, 2016
- Semiconductor Components Industries, LLC
- William F. Burghout
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die singulation method
- Patent number 9,034,733
- Issue date May 19, 2015
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- William F. Burghout
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die singulation method
- Patent number 8,664,089
- Issue date Mar 4, 2014
- Semiconductor Components Industries, LLC
- William F. Burghout
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of marking a low profile packaged semiconductor device
- Patent number 8,574,961
- Issue date Nov 5, 2013
- Semiconductor Components Industries, LLC
- James Howard Knapp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package having down-set leads and method
- Patent number 8,319,323
- Issue date Nov 27, 2012
- Semiconductor Components Industries, LLC
- James P. Letterman, Jr.
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Multi-chip semiconductor connector
- Patent number 8,253,239
- Issue date Aug 28, 2012
- Semiconductor Components Industries, LLC
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip semiconductor connector and method
- Patent number 7,875,964
- Issue date Jan 25, 2011
- Semiconductor Components Industries, LLC
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a leaded molded array package
- Patent number 7,820,528
- Issue date Oct 26, 2010
- Semiconductor Components Industries, LLC
- William F. Burghout
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component and method of manufacture
- Patent number 7,598,123
- Issue date Oct 6, 2009
- Semiconductor Components Industries, LLC
- Jay A. Yoder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a leaded molded array package
- Patent number 7,588,999
- Issue date Sep 15, 2009
- Semiconductor Components Industries, LLC
- William F. Burghout
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip semiconductor connector assemblies
- Patent number 7,508,060
- Issue date Mar 24, 2009
- Semiconductor Components Industries, LLC
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip semiconductor connector assembly method
- Patent number 7,498,195
- Issue date Mar 3, 2009
- Semiconductor Components Industries, LLC
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip semiconductor connector assemblies
- Patent number 7,298,034
- Issue date Nov 20, 2007
- Semiconductor Components Industries, LLC
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip semiconductor connector assembly method
- Patent number 7,202,105
- Issue date Apr 10, 2007
- Semiconductor Components Industries, LLC
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip semiconductor connector and method
- Patent number 7,202,106
- Issue date Apr 10, 2007
- Semiconductor Components Industries, LLC
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and laminated leadframe package
- Patent number 6,768,186
- Issue date Jul 27, 2004
- Semiconductor Components Industries, LLC
- James P. Letterman
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURES AND METHODS OF MANUFACTURE
- Publication number 20230317576
- Publication date Oct 5, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Stephen ST. GERMAIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURES AND METHODS OF MANUFACTURE
- Publication number 20220084920
- Publication date Mar 17, 2022
- Semiconductor Components Industries, LLC
- Stephen ST. GERMAIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURES AND METHODS OF MANUFACTURE
- Publication number 20190385939
- Publication date Dec 19, 2019
- Semiconductor Components Industries, LLC
- Stephen ST. GERMAIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINGLE OR MULTI CHIP MODULE PACKAGE AND RELATED METHODS
- Publication number 20180096925
- Publication date Apr 5, 2018
- Semiconductor Components Industries, LLC
- Stephen St. Germain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HOLES AND DIMPLES TO CONTROL SOLDER FLOW
- Publication number 20180053712
- Publication date Feb 22, 2018
- Semiconductor Components Industries, LLC
- Stephen ST. GERMAIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINGLE OR MULTI CHIP MODULE PACKAGE AND RELATED METHODS
- Publication number 20170110391
- Publication date Apr 20, 2017
- Semiconductor Components Industries, LLC
- Stephen St. Germain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE SINGULATION METHOD
- Publication number 20170004965
- Publication date Jan 5, 2017
- Semiconductor Components Industries, LLC
- William F. Burghout
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINGLE OR MULTI CHIP MODULE PACKAGE AND RELATED METHODS
- Publication number 20160079095
- Publication date Mar 17, 2016
- Semiconductor Components Industries, LLC
- Stephen St. Germain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE SINGULATION METHOD
- Publication number 20150228494
- Publication date Aug 13, 2015
- Semiconductor Components Industries, LLC
- William F. Burghout
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE SINGULATION METHOD
- Publication number 20140134828
- Publication date May 15, 2014
- Semiconductor Components Industries, LLC
- William F. Burghout
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE SINGULATION METHOD
- Publication number 20140051232
- Publication date Feb 20, 2014
- William F. Burghout
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP SEMICONDUCTOR CONNECTOR
- Publication number 20110068451
- Publication date Mar 24, 2011
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE HAVING DOWN-SET LEADS AND METHOD
- Publication number 20100000772
- Publication date Jan 7, 2010
- Semiconductor Components Industries, LLC
- James P. Letterman, JR.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A LEADED MOLDED ARRAY PACKAGE
- Publication number 20090298232
- Publication date Dec 3, 2009
- William F. Burghout
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR COMPONENT AND METHOD OF MANUFACTURE
- Publication number 20080217765
- Publication date Sep 11, 2008
- Jay A. Yoder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP SEMICONDUCTOR CONNECTOR ASSEMBLIES
- Publication number 20080006920
- Publication date Jan 10, 2008
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP SEMICONDUCTOR CONNECTOR AND METHOD
- Publication number 20070126106
- Publication date Jun 7, 2007
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP SEMICONDUCTOR CONNECTOR ASSEMBLY METHOD
- Publication number 20070126107
- Publication date Jun 7, 2007
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor component and method of manufacture
- Publication number 20070117259
- Publication date May 24, 2007
- Semiconductor Components Industries, LLC.
- Harold G. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of forming a leaded molded array package
- Publication number 20070111393
- Publication date May 17, 2007
- Semiconductor Components Industries, LLC.
- William F. Burghout
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of marking a low profile packaged semiconductor device
- Publication number 20060134836
- Publication date Jun 22, 2006
- James Howard Knapp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-chip semiconductor connector assemblies
- Publication number 20050285249
- Publication date Dec 29, 2005
- Semiconductor Components Industries, LLC.
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-chip semiconductor connector assembly method
- Publication number 20050287703
- Publication date Dec 29, 2005
- Semiconductor Components Industries, LLC.
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-chip semiconductor connector and method
- Publication number 20050285235
- Publication date Dec 29, 2005
- Semiconductor Components Industries, LLC.
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and laminated leadframe package
- Publication number 20040070062
- Publication date Apr 15, 2004
- Semiconductor Components Industries, LLC.
- James P. Letterman
- H01 - BASIC ELECTRIC ELEMENTS

Jay A. Yoder

Person

Patents Grantslast 30 patents

Semiconductor package structures and methods of manufacture

Semiconductor package structures and methods of manufacture

Semiconductor package structures and methods of manufacture

Single or multi chip module package and related methods

Holes and dimples to control solder flow

Single or multi chip module package and related methods

Semiconductor die singulation method

Single or multi chip module package and related methods

Semiconductor die singulation method

Semiconductor die singulation method

Semiconductor die singulation method

Method of marking a low profile packaged semiconductor device

Electronic package having down-set leads and method

Multi-chip semiconductor connector

Multi-chip semiconductor connector and method

Method of forming a leaded molded array package

Semiconductor component and method of manufacture

Method of forming a leaded molded array package

Multi-chip semiconductor connector assemblies

Multi-chip semiconductor connector assembly method

Multi-chip semiconductor connector assemblies

Multi-chip semiconductor connector assembly method

Multi-chip semiconductor connector and method

Semiconductor device and laminated leadframe package

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE STRUCTURES AND METHODS OF MANUFACTURE

SEMICONDUCTOR PACKAGE STRUCTURES AND METHODS OF MANUFACTURE

SEMICONDUCTOR PACKAGE STRUCTURES AND METHODS OF MANUFACTURE

SINGLE OR MULTI CHIP MODULE PACKAGE AND RELATED METHODS

HOLES AND DIMPLES TO CONTROL SOLDER FLOW

SINGLE OR MULTI CHIP MODULE PACKAGE AND RELATED METHODS

SEMICONDUCTOR DIE SINGULATION METHOD

SINGLE OR MULTI CHIP MODULE PACKAGE AND RELATED METHODS

SEMICONDUCTOR DIE SINGULATION METHOD

SEMICONDUCTOR DIE SINGULATION METHOD

SEMICONDUCTOR DIE SINGULATION METHOD

MULTI-CHIP SEMICONDUCTOR CONNECTOR

ELECTRONIC PACKAGE HAVING DOWN-SET LEADS AND METHOD

METHOD OF FORMING A LEADED MOLDED ARRAY PACKAGE

SEMICONDUCTOR COMPONENT AND METHOD OF MANUFACTURE

MULTI-CHIP SEMICONDUCTOR CONNECTOR ASSEMBLIES

MULTI-CHIP SEMICONDUCTOR CONNECTOR AND METHOD

MULTI-CHIP SEMICONDUCTOR CONNECTOR ASSEMBLY METHOD

Semiconductor component and method of manufacture

Method of forming a leaded molded array package

Method of marking a low profile packaged semiconductor device

Multi-chip semiconductor connector assemblies

Multi-chip semiconductor connector assembly method

Multi-chip semiconductor connector and method

Semiconductor device and laminated leadframe package