Je-Hsiung Jeffrey Lan

Person

San Diego, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
3D inductor design using bundle substrate vias
- Patent number 12,283,607
- Issue date Apr 22, 2025
- QUALCOMM Incorporated
- Jonghae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna modules employing three-dimensional (3D) build-up on mold p...
- Patent number 12,255,381
- Issue date Mar 18, 2025
- QUALCOMM Incorporated
- Ranadeep Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio frequency oscillator with ceramic resonator and surface-mount...
- Patent number 12,206,155
- Issue date Jan 21, 2025
- QUALCOMM Incorporated
- Kai Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backend and acoustic process integration for high-Q filter
- Patent number 12,155,373
- Issue date Nov 26, 2024
- QUALCOMM Incorporated
- Kai Liu
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Integrated device and integrated passive device comprising magnetic...
- Patent number 12,142,561
- Issue date Nov 12, 2024
- QUALCOMM Incorporated
- Kai Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal bridge interposer structure
- Patent number 12,046,530
- Issue date Jul 23, 2024
- QUALCOMM Incorporated
- Je-Hsiung Lan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film resistor (TFR) device structure for high performance radi...
- Patent number 12,040,268
- Issue date Jul 16, 2024
- QUALCOMM Incorporated
- Je-Hsiung Lan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface acoustic wave (SAW) filter packages employing an enhanced t...
- Patent number 11,984,874
- Issue date May 14, 2024
- QUALCOMM Incorporated
- Ranadeep Dutta
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
ESL-less AC resistor for high frequency applications
- Patent number 11,862,367
- Issue date Jan 2, 2024
- QUALCOMM Incorporated
- Jonghae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device on ceramic substrate
- Patent number 11,791,226
- Issue date Oct 17, 2023
- QUALCOMM Incorporated
- Je-Hsiung Lan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio frequency front end (RFFE) hetero-integration
- Patent number 11,749,746
- Issue date Sep 5, 2023
- QUALCOMM Incorporated
- Ranadeep Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package comprising stacked filters with a shared substrate cap
- Patent number 11,689,181
- Issue date Jun 27, 2023
- QUALCOMM Incorporated
- Jonghae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor interposer layer (CIL) chiplet design with conformal die...
- Patent number 11,658,103
- Issue date May 23, 2023
- QUALCOMM Incorporated
- Je-Hsiung Lan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High performance tunable filter
- Patent number 11,652,468
- Issue date May 16, 2023
- QUALCOMM Incorporated
- Je-Hsiung Lan
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Integrated device with electromagnetic shield
- Patent number 11,652,064
- Issue date May 16, 2023
- QUALCOMM Incorporated
- Jonghae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked inductor having a discrete metal-stack pattern
- Patent number 11,626,236
- Issue date Apr 11, 2023
- QUALCOMM Incorporated
- Jonghae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional (3D) integrated circuit with passive elements for...
- Patent number 11,605,620
- Issue date Mar 14, 2023
- QUALCOMM Incorporated
- Je-Hsiung Lan
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Antenna on glass with air cavity structure
- Patent number 11,594,804
- Issue date Feb 28, 2023
- QUALCOMM Incorporated
- Je-Hsiung Lan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterogeneous integrated wideband high electron mobility transistor...
- Patent number 11,437,367
- Issue date Sep 6, 2022
- QUALCOMM Incorporated
- Je-Hsiung Lan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced integrated passive device (IPD) with thin-film heat spread...
- Patent number 11,404,345
- Issue date Aug 2, 2022
- QUALCOMM Incorporated
- Je-Hsiung Lan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resonator device
- Patent number 11,394,360
- Issue date Jul 19, 2022
- QUALCOMM Incorporated
- Je-Hsiung Lan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked circuits of III-V devices over silicon with high quality in...
- Patent number 11,393,789
- Issue date Jul 19, 2022
- QUALCOMM Incorporated
- Je-Hsiung Lan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metamorphic high electron mobility transistor-heterojunction bipola...
- Patent number 11,380,678
- Issue date Jul 5, 2022
- QUALCOMM Incorporated
- Ranadeep Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device with 3D inductor and magnetic core in substrate
- Patent number 11,336,251
- Issue date May 17, 2022
- QUALCOMM Incorporated
- Je-Hsiung Lan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor interposer layer (CIL) in a die-to-wafer three-dimensiona...
- Patent number 11,158,590
- Issue date Oct 26, 2021
- QUALCOMM Incorporated
- Je-Hsiung Lan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die-to-wafer hybrid bonding with forming glass
- Patent number 11,152,272
- Issue date Oct 19, 2021
- QUALCOMM Incorporated
- Je-Hsiung Lan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuits (ICs) on a glass substrate
- Patent number 10,903,240
- Issue date Jan 26, 2021
- QUALCOMM Incorporated
- Shiqun Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Passive-on-glass (POG) device and method
- Patent number 10,607,980
- Issue date Mar 31, 2020
- QUALCOMM Incorporated
- Je-Hsiung Jeffrey Lan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Varying thickness inductor
- Patent number 10,354,795
- Issue date Jul 16, 2019
- QUALCOMM Incorporated
- Daeik Daniel Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuits (ICs) on a glass substrate
- Patent number 10,332,911
- Issue date Jun 25, 2019
- QUALCOMM Incorporated
- Shiqun Gu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED DEVICE COMPRISING SILICON SUBSTRATE WITH POROUS PORTION
- Publication number 20250096090
- Publication date Mar 20, 2025
- QUALCOMM Incorporated
- Ranadeep DUTTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUCTOR PERFORMANCE ENHANCEMENT USING AN OUTER, PERIPHERAL PATTERN...
- Publication number 20250096116
- Publication date Mar 20, 2025
- QUALCOMM Incorporated
- Jonghae KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DEVICES COUPLED TO INTERPOSER COMPRISING POROUS PORTION
- Publication number 20250096093
- Publication date Mar 20, 2025
- QUALCOMM Incorporated
- Ranadeep DUTTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ACOUSTIC DEVICES WITH INTEGRATED CIRCUIT ELEMENTS AND RELATED FABRI...
- Publication number 20250047262
- Publication date Feb 6, 2025
- QUALCOMM Incorporated
- Je-Hsiung LAN
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
PACKAGE COMPRISING A SUBSTRATE WITH INDUCTORS AND A MAGNETIC LAYER
- Publication number 20250037923
- Publication date Jan 30, 2025
- QUALCOMM Incorporated
- Kai LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE COMPRISING STACKED THROUGH ENCAPSULATION VIA INTERCONNECTS
- Publication number 20250022858
- Publication date Jan 16, 2025
- QUALCOMM Incorporated
- Kai LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICES INCLUDING THROUGH-SUBSTRATE VIAS (TSVs) FOR BACKSIDE INTERC...
- Publication number 20240421790
- Publication date Dec 19, 2024
- QUALCOMM Incorporated
- Je-Hsiung LAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUCTIVE DEVICE
- Publication number 20240387092
- Publication date Nov 21, 2024
- QUALCOMM Incorporated
- Kai LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA MODULE AS A RADIO-FREQUENCY (RF) INTEGRATED CIRCUIT (IC) DI...
- Publication number 20240347913
- Publication date Oct 17, 2024
- QUALCOMM Incorporated
- Ranadeep DUTTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIO FREQUENCY OSCILLATOR WITH CERAMIC RESONATOR AND SURFACE-MOUNT...
- Publication number 20240322417
- Publication date Sep 26, 2024
- QUALCOMM Incorporated
- Kai LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA ON GLASS WITH THROUGH GLASS VIA SIDEWALL SHIELDING STRUCTURE
- Publication number 20240313405
- Publication date Sep 19, 2024
- QUALCOMM Incorporated
- Je-Hsiung LAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPACT HYBRID ACOUSTIC WAVE FILTER STRUCTURE
- Publication number 20240258995
- Publication date Aug 1, 2024
- QUALCOMM Incorporated
- Je-Hsiung LAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAVITY-EMBEDDED TUNABLE FILTER
- Publication number 20240243036
- Publication date Jul 18, 2024
- QUALCOMM Incorporated
- Je-Hsiung LAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH MOLDING CONTACT ENABLED EMI SHIELDING
- Publication number 20240203895
- Publication date Jun 20, 2024
- QUALCOMM Incorporated
- Je-Hsiung LAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUCTIVE DEVICE STRUCTURE AND PROCESS METHOD
- Publication number 20240105760
- Publication date Mar 28, 2024
- QUALCOMM Incorporated
- Je-Hsiung LAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ON-CHIP HYBRID ELECTROMAGNETIC INTERFERENCE (EMI) SHIELDING WITH TH...
- Publication number 20240096817
- Publication date Mar 21, 2024
- QUALCOMM Incorporated
- Ranadeep DUTTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUCTOR PACKAGES EMPLOYING WIRE BONDS OVER A LEAD FRAME TO FORM IN...
- Publication number 20240038439
- Publication date Feb 1, 2024
- QUALCOMM Incorporated
- Kai Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL VERTICAL CO-SPIRAL INDUCTORS
- Publication number 20240021353
- Publication date Jan 18, 2024
- QUALCOMM Incorporated
- Jonghae KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DEVICE AND INTEGRATED PASSIVE DEVICE COMPRISING MAGNETIC...
- Publication number 20240006308
- Publication date Jan 4, 2024
- QUALCOMM Incorporated
- Kai LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN FILM RESISTOR (TFR) DEVICE STRUCTURE FOR HIGH PERFORMANCE RADI...
- Publication number 20230395491
- Publication date Dec 7, 2023
- QUALCOMM Incorporated
- Je-Hsiung LAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL (3D) INTEGRATED CIRCUIT (IC) (3DIC) PACKAGE EMPLO...
- Publication number 20230317677
- Publication date Oct 5, 2023
- QUALCOMM Incorporated
- Stanley Seungchul Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DEVICE AND INTEGRATED PASSIVE DEVICE COMPRISING MAGNETIC...
- Publication number 20230307355
- Publication date Sep 28, 2023
- QUALCOMM Incorporated
- Kai LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR EMBEDDED 3D RESONATOR FOR BROADBAND FILTER
- Publication number 20230275004
- Publication date Aug 31, 2023
- QUALCOMM Incorporated
- Jonghae KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA MODULES EMPLOYING THREE-DIMENSIONAL (3D) BUILD-UP ON MOLD P...
- Publication number 20230268637
- Publication date Aug 24, 2023
- QUALCOMM Incorporated
- Ranadeep DUTTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL BRIDGE INTERPOSER STRUCTURE
- Publication number 20230197554
- Publication date Jun 22, 2023
- QUALCOMM Incorporated
- Je-Hsiung LAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ESL-LESS AC RESISTOR FOR HIGH FREQUENCY APPLICATIONS
- Publication number 20230187106
- Publication date Jun 15, 2023
- QUALCOMM Incorporated
- Jonghae KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKEND AND ACOUSTIC PROCESS INTEGRATION FOR HIGH-Q FILTER
- Publication number 20230121565
- Publication date Apr 20, 2023
- QUALCOMM Incorporated
- Kai LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIO-FREQUENCY INTEGRATED CIRCUITS (RFICS) INCLUDING A POROSIFIED...
- Publication number 20230088569
- Publication date Mar 23, 2023
- QUALCOMM Incorporated
- Ranadeep DUTTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY SILICON BASED CAPACITOR
- Publication number 20230092429
- Publication date Mar 23, 2023
- QUALCOMM Incorporated
- Ranadeep DUTTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE ACOUSTIC WAVE (SAW) FILTER PACKAGES EMPLOYING AN ENHANCED T...
- Publication number 20230054636
- Publication date Feb 23, 2023
- QUALCOMM Incorporated
- Ranadeep DUTTA
- H03 - BASIC ELECTRONIC CIRCUITRY

Je-Hsiung Jeffrey Lan

Person

Patents Grantslast 30 patents

3D inductor design using bundle substrate vias

Antenna modules employing three-dimensional (3D) build-up on mold p...

Radio frequency oscillator with ceramic resonator and surface-mount...

Backend and acoustic process integration for high-Q filter

Integrated device and integrated passive device comprising magnetic...

Thermal bridge interposer structure

Thin film resistor (TFR) device structure for high performance radi...

Surface acoustic wave (SAW) filter packages employing an enhanced t...

ESL-less AC resistor for high frequency applications

Device on ceramic substrate

Radio frequency front end (RFFE) hetero-integration

Package comprising stacked filters with a shared substrate cap

Capacitor interposer layer (CIL) chiplet design with conformal die...

High performance tunable filter

Integrated device with electromagnetic shield

Stacked inductor having a discrete metal-stack pattern

Three-dimensional (3D) integrated circuit with passive elements for...

Antenna on glass with air cavity structure

Heterogeneous integrated wideband high electron mobility transistor...

Advanced integrated passive device (IPD) with thin-film heat spread...

Resonator device

Stacked circuits of III-V devices over silicon with high quality in...

Metamorphic high electron mobility transistor-heterojunction bipola...

Device with 3D inductor and magnetic core in substrate

Capacitor interposer layer (CIL) in a die-to-wafer three-dimensiona...

Die-to-wafer hybrid bonding with forming glass

Integrated circuits (ICs) on a glass substrate

Passive-on-glass (POG) device and method

Varying thickness inductor

Integrated circuits (ICs) on a glass substrate

Patents Applicationslast 30 patents

INTEGRATED DEVICE COMPRISING SILICON SUBSTRATE WITH POROUS PORTION

INDUCTOR PERFORMANCE ENHANCEMENT USING AN OUTER, PERIPHERAL PATTERN...

INTEGRATED DEVICES COUPLED TO INTERPOSER COMPRISING POROUS PORTION

ACOUSTIC DEVICES WITH INTEGRATED CIRCUIT ELEMENTS AND RELATED FABRI...

PACKAGE COMPRISING A SUBSTRATE WITH INDUCTORS AND A MAGNETIC LAYER

DEVICE COMPRISING STACKED THROUGH ENCAPSULATION VIA INTERCONNECTS

DEVICES INCLUDING THROUGH-SUBSTRATE VIAS (TSVs) FOR BACKSIDE INTERC...

INDUCTIVE DEVICE

ANTENNA MODULE AS A RADIO-FREQUENCY (RF) INTEGRATED CIRCUIT (IC) DI...

RADIO FREQUENCY OSCILLATOR WITH CERAMIC RESONATOR AND SURFACE-MOUNT...

ANTENNA ON GLASS WITH THROUGH GLASS VIA SIDEWALL SHIELDING STRUCTURE

COMPACT HYBRID ACOUSTIC WAVE FILTER STRUCTURE

CAVITY-EMBEDDED TUNABLE FILTER

THROUGH MOLDING CONTACT ENABLED EMI SHIELDING

INDUCTIVE DEVICE STRUCTURE AND PROCESS METHOD

ON-CHIP HYBRID ELECTROMAGNETIC INTERFERENCE (EMI) SHIELDING WITH TH...

INDUCTOR PACKAGES EMPLOYING WIRE BONDS OVER A LEAD FRAME TO FORM IN...

THREE-DIMENSIONAL VERTICAL CO-SPIRAL INDUCTORS

INTEGRATED DEVICE AND INTEGRATED PASSIVE DEVICE COMPRISING MAGNETIC...

THIN FILM RESISTOR (TFR) DEVICE STRUCTURE FOR HIGH PERFORMANCE RADI...

THREE-DIMENSIONAL (3D) INTEGRATED CIRCUIT (IC) (3DIC) PACKAGE EMPLO...

INTEGRATED DEVICE AND INTEGRATED PASSIVE DEVICE COMPRISING MAGNETIC...

CAPACITOR EMBEDDED 3D RESONATOR FOR BROADBAND FILTER

ANTENNA MODULES EMPLOYING THREE-DIMENSIONAL (3D) BUILD-UP ON MOLD P...

THERMAL BRIDGE INTERPOSER STRUCTURE

ESL-LESS AC RESISTOR FOR HIGH FREQUENCY APPLICATIONS

BACKEND AND ACOUSTIC PROCESS INTEGRATION FOR HIGH-Q FILTER

RADIO-FREQUENCY INTEGRATED CIRCUITS (RFICS) INCLUDING A POROSIFIED...

HIGH DENSITY SILICON BASED CAPACITOR

SURFACE ACOUSTIC WAVE (SAW) FILTER PACKAGES EMPLOYING AN ENHANCED T...