Jean-Marc Rollin

Person

Chapel Hill, NC, US

People

Patents Grantslast 30 patents

Information Patent Grant
Microwave/millimeter-wave waveguide to circuit board connector
- Patent number 11,342,683
- Issue date May 24, 2022
- Cubic Corporation
- Timothy Smith
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated electronic components and methods of formation thereof
- Patent number 10,431,521
- Issue date Oct 1, 2019
- Cubic Corporation
- Jean-Marc Rollin
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Structures and methods for interconnects and associated alignment a...
- Patent number 10,361,471
- Issue date Jul 23, 2019
- NUVOTRONICS, INC.
- Jean-Marc Rollin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer scale test interface unit and contactors
- Patent number 10,310,009
- Issue date Jun 4, 2019
- NUVOTRONICS, INC.
- Rick L. Thompson
- G01 - MEASURING TESTING
Information Patent Grant
Three-dimensional microstructures
- Patent number 10,305,158
- Issue date May 28, 2019
- Cubic Corporation
- David Sherrer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures and methods for interconnects and associated alignment a...
- Patent number 10,193,203
- Issue date Jan 29, 2019
- NUVOTRONICS, INC.
- Jean-Marc Rollin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated electronic components and methods of formation thereof
- Patent number 10,002,818
- Issue date Jun 19, 2018
- NUVOTRONICS, INC.
- Jean-Marc Rollin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional microstructures
- Patent number 9,843,084
- Issue date Dec 12, 2017
- NUVOTRONICS, INC.
- David Sherrer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Batch fabricated microconnectors
- Patent number 9,583,856
- Issue date Feb 28, 2017
- NUVOTRONICS, INC.
- David W. Sherrer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High frequency power combiner/divider
- Patent number 9,490,517
- Issue date Nov 8, 2016
- NUVOTRONICS, INC.
- Donald X. Wu
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Three-dimensional microstructures
- Patent number 9,413,052
- Issue date Aug 9, 2016
- NUVOTRONICS, INC.
- David Sherrer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microstructure including microstructural waveguide elements and/or...
- Patent number 9,306,255
- Issue date Apr 5, 2016
- NUVOTRONICS, INC.
- Jean-Marc Rollin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional microstructures
- Patent number 9,136,575
- Issue date Sep 15, 2015
- Nuvotronics, LLC
- David Sherrer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High frequency power combiner/divider
- Patent number 9,065,163
- Issue date Jun 23, 2015
- Nuvotronics, LLC
- Donald X. Wu
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Integrated electronic components and methods of formation thereof
- Patent number 9,024,417
- Issue date May 5, 2015
- Nuvotronics, LLC
- Jean-Marc Rollin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Batch fabricated microconnectors
- Patent number 8,814,601
- Issue date Aug 26, 2014
- Nuvotronics, LLC
- David W. Sherrer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional microstructures
- Patent number 8,698,577
- Issue date Apr 15, 2014
- Nuvotronics, LLC
- David Sherrer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coaxial transmission line microstructure including an enlarged coax...
- Patent number 8,542,079
- Issue date Sep 24, 2013
- Nuvotronics, LLC
- David W. Sherrer
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Coaxial transmission line microstructures and methods of formation...
- Patent number 7,898,356
- Issue date Mar 1, 2011
- Nuvotronics, LLC
- David W. Sherrer
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Integrated electronic components and methods of formation thereof
- Patent number 7,755,174
- Issue date Jul 13, 2010
- Nuvotonics, LLC
- Jean-Marc Rollin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
THREE-DIMENSIONAL MICROSTRUCTURES
- Publication number 20200076042
- Publication date Mar 5, 2020
- Cubic Corporation
- David Sherrer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES AND METHODS FOR INTERCONNECTS AND ASSOCIATED ALIGNMENT A...
- Publication number 20190393580
- Publication date Dec 26, 2019
- Nuvotronics, INC
- Jean-Marc Rollin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Microwave/Millimeter-Wave Waveguide to Circuit Board Connector
- Publication number 20190334249
- Publication date Oct 31, 2019
- Nuvotronics, INC
- Timothy Smith
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES AND METHODS FOR INTERCONNECTS AND ASSOCIATED ALIGNMENT A...
- Publication number 20180123217
- Publication date May 3, 2018
- Nuvotronics, INC
- Jean-Marc Rollin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED ELECTRONIC COMPONENTS AND METHODS OF FORMATION THEREOF
- Publication number 20180082923
- Publication date Mar 22, 2018
- Nuvotronics, INC
- Jean-Marc Rollin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MICROSTRUCTURES
- Publication number 20180069287
- Publication date Mar 8, 2018
- Nuvotronics, INC
- David Sherrer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BATCH FABRICATED MICROCONNECTORS
- Publication number 20170170592
- Publication date Jun 15, 2017
- Nuvotronics, INC
- David W. Sherrer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER SCALE TEST INTERFACT UNIT: LOW LOSS AND HIGH ISOLATION DEVICE...
- Publication number 20160341790
- Publication date Nov 24, 2016
- Nuvotronics, INC
- Rick L. Thompson
- G01 - MEASURING TESTING
Information Patent Application
THREE-DIMENSIONAL MICROSTRUCTURES
- Publication number 20160336639
- Publication date Nov 17, 2016
- Nuvotronics, INC
- David Sherrer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES AND METHODS FOR INTERCONNECTS AND ASSOCIATED ALIGNMENT A...
- Publication number 20160294035
- Publication date Oct 6, 2016
- Nuvotronics, INC
- Jean-Marc Rollin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH FREQUENCY POWER COMBINER/DIVIDER
- Publication number 20160036113
- Publication date Feb 4, 2016
- NUVOTRONICS, LLC
- Donald X. Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MICROSTRUCTURES
- Publication number 20150380795
- Publication date Dec 31, 2015
- NUVOTRONICS, LLC
- David Sherrer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED ELECTRONIC COMPONENTS AND METHODS OF FORMATION THEREOF
- Publication number 20150228554
- Publication date Aug 13, 2015
- NUVOTRONICS, LLC
- Jean-Marc Rollin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BATCH FABRICATED MICROCONNECTORS
- Publication number 20140364015
- Publication date Dec 11, 2014
- David W. Sherrer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MICROSTRUCTURES
- Publication number 20140218131
- Publication date Aug 7, 2014
- NUVOTRONICS, LLC
- David Sherrer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED ELECTRONIC COMPONENTS AND METHODS OF FORMATION THEREOF
- Publication number 20130285218
- Publication date Oct 31, 2013
- Jean-Marc Rollin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MICROSTRUCTURES
- Publication number 20120062335
- Publication date Mar 15, 2012
- David Sherrer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COAXIAL TRANSMISSION LINE MICROSTRUCTURES AND METHODS OF FORMATION...
- Publication number 20110273241
- Publication date Nov 10, 2011
- David W. Sherrer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED ELECTRONIC COMPONENTS AND METHODS OF FORMATION THEREOF
- Publication number 20100296252
- Publication date Nov 25, 2010
- Jean-Marc Rollin
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Coaxial transmission line microstructures and methods of formation...
- Publication number 20080246562
- Publication date Oct 9, 2008
- Rohm and Haas Electronic Materials L.L.C.
- David W. SHERRER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated electronic components and methods of formation thereof
- Publication number 20080240656
- Publication date Oct 2, 2008
- Rohm and Haas Electronic Materials L.L.C.
- Jean-Marc ROLLIN
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

Jean-Marc Rollin

Person

Patents Grantslast 30 patents

Microwave/millimeter-wave waveguide to circuit board connector

Integrated electronic components and methods of formation thereof

Structures and methods for interconnects and associated alignment a...

Wafer scale test interface unit and contactors

Three-dimensional microstructures

Structures and methods for interconnects and associated alignment a...

Integrated electronic components and methods of formation thereof

Three-dimensional microstructures

Batch fabricated microconnectors

High frequency power combiner/divider

Three-dimensional microstructures

Microstructure including microstructural waveguide elements and/or...

Three-dimensional microstructures

High frequency power combiner/divider

Integrated electronic components and methods of formation thereof

Batch fabricated microconnectors

Three-dimensional microstructures

Coaxial transmission line microstructure including an enlarged coax...

Coaxial transmission line microstructures and methods of formation...

Integrated electronic components and methods of formation thereof

Patents Applicationslast 30 patents

THREE-DIMENSIONAL MICROSTRUCTURES

STRUCTURES AND METHODS FOR INTERCONNECTS AND ASSOCIATED ALIGNMENT A...

Microwave/Millimeter-Wave Waveguide to Circuit Board Connector

STRUCTURES AND METHODS FOR INTERCONNECTS AND ASSOCIATED ALIGNMENT A...

INTEGRATED ELECTRONIC COMPONENTS AND METHODS OF FORMATION THEREOF

THREE-DIMENSIONAL MICROSTRUCTURES

BATCH FABRICATED MICROCONNECTORS

WAFER SCALE TEST INTERFACT UNIT: LOW LOSS AND HIGH ISOLATION DEVICE...

THREE-DIMENSIONAL MICROSTRUCTURES

STRUCTURES AND METHODS FOR INTERCONNECTS AND ASSOCIATED ALIGNMENT A...

HIGH FREQUENCY POWER COMBINER/DIVIDER

THREE-DIMENSIONAL MICROSTRUCTURES

INTEGRATED ELECTRONIC COMPONENTS AND METHODS OF FORMATION THEREOF

BATCH FABRICATED MICROCONNECTORS

THREE-DIMENSIONAL MICROSTRUCTURES

INTEGRATED ELECTRONIC COMPONENTS AND METHODS OF FORMATION THEREOF

THREE-DIMENSIONAL MICROSTRUCTURES

COAXIAL TRANSMISSION LINE MICROSTRUCTURES AND METHODS OF FORMATION...

INTEGRATED ELECTRONIC COMPONENTS AND METHODS OF FORMATION THEREOF

Coaxial transmission line microstructures and methods of formation...

Integrated electronic components and methods of formation thereof