Jeffory L. Smalley

Person

East Olympia, WA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Electronic systems with inverted circuit board with heat sink to ch...
- Patent number 12,131,977
- Issue date Oct 29, 2024
- Intel Corporation
- Barrett M. Faneuf
- G11 - INFORMATION STORAGE
Information Patent Grant
Electronic systems with inverted circuit board with heat sink to ch...
- Patent number 11,842,943
- Issue date Dec 12, 2023
- Intel Corporation
- Barrett M. Faneuf
- G11 - INFORMATION STORAGE
Information Patent Grant
Reflow grid array to support late attach of components
- Patent number 11,683,890
- Issue date Jun 20, 2023
- Intel Corporation
- Jonathan W. Thibado
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Interposer and electronic package
- Patent number 11,621,237
- Issue date Apr 4, 2023
- Intel Corporation
- Jonathan W. Thibado
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reflowable grid array to support grid heating
- Patent number 11,545,408
- Issue date Jan 3, 2023
- Intel Corporation
- Jonathan W. Thibado
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-surface heat sink suitable for multi-chip packages
- Patent number 11,495,518
- Issue date Nov 8, 2022
- Intel Corporation
- Shrenik Kothari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reflowable grid array as standby heater for reliability
- Patent number 11,488,839
- Issue date Nov 1, 2022
- Intel Corporation
- Jonathan W. Thibado
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Scalable, high load, low stiffness, and small footprint loading mec...
- Patent number 11,449,111
- Issue date Sep 20, 2022
- Intel Corporation
- Eric W. Buddrius
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Power bar package mount arrangement
- Patent number 11,038,293
- Issue date Jun 15, 2021
- Intel Corporation
- Brian D. Aspnes
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Top-side connector interface for processor packaging
- Patent number 10,880,994
- Issue date Dec 29, 2020
- Intel Corporation
- Russell S. Aoki
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Hydraulic bladder for CPU interconnection and cooling
- Patent number 10,455,731
- Issue date Oct 22, 2019
- Intel Corporation
- Ralph W. Jensen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electronic device, socket, and spacer to alter socket profile
- Patent number 10,455,685
- Issue date Oct 22, 2019
- Intel Corporation
- Steven A. Klein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanical seal and reservoir for microelectronic packages
- Patent number 10,418,309
- Issue date Sep 17, 2019
- Intel Corporation
- Bijoyraj Sahu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Rework grid array interposer with direct power
- Patent number 10,211,120
- Issue date Feb 19, 2019
- Intel Corporation
- Russell S. Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Socket contact techniques and configurations
- Patent number 10,205,292
- Issue date Feb 12, 2019
- Intel Corporation
- Dhanya Athreya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip self adjusting cooling solution
- Patent number 10,141,241
- Issue date Nov 27, 2018
- Intel Corporation
- Jeffory L. Smalley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat sink coupling using flexible heat pipes for multi-surface comp...
- Patent number 9,935,033
- Issue date Apr 3, 2018
- Intel Corporation
- Susan F. Smith
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Linear edge connector with activator bar and contact load spring
- Patent number 9,859,636
- Issue date Jan 2, 2018
- Intel Corporation
- Thomas A. Boyd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Socket loading element and associated techniques and configurations
- Patent number 9,848,510
- Issue date Dec 19, 2017
- Intel Corporation
- Vijaykumar Krithivasan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
CPU package substrates with removable memory mechanical interfaces
- Patent number 9,832,876
- Issue date Nov 28, 2017
- Intel Corporation
- Mani Prakash
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single base multi-floating surface cooling solution
- Patent number 9,806,003
- Issue date Oct 31, 2017
- Intel Corporation
- Jeffory L. Smalley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Socket contact techniques and configurations
- Patent number 9,780,510
- Issue date Oct 3, 2017
- Intel Corporation
- Dhanya Athreya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact protection for integrated circuit device loading
- Patent number 9,681,556
- Issue date Jun 13, 2017
- Intel Corporation
- David J. Llapitan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic assembly that includes a plurality of electronic packages
- Patent number 9,603,276
- Issue date Mar 21, 2017
- Intel Corporation
- David J. Llapitan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-array bottom-side connector using spring bias
- Patent number 9,490,560
- Issue date Nov 8, 2016
- Intel Corporation
- Gaurav Chawla
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Lateral slide pick and place cover for reduced bent pins in LGA soc...
- Patent number 9,385,444
- Issue date Jul 5, 2016
- Intel Corporation
- Vijaykumar Krithivasan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic assemblies with scalable clip-type connectors
- Patent number 9,325,087
- Issue date Apr 26, 2016
- Intel Corporation
- Gaurav Chawla
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Integrated circuit connectors
- Patent number 9,265,170
- Issue date Feb 16, 2016
- Intel Corporation
- Rajasekaran Swaminathan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Memory carrier and IHS coupling system
- Patent number 8,405,966
- Issue date Mar 26, 2013
- Dell Products L.P.
- Corey D. Hartman
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Fan mounting system
- Patent number 8,279,596
- Issue date Oct 2, 2012
- Dell Products L.P.
- Alejandro Z. Rodriguez
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
PROTRUSIONS OF SOCKET BODIES HAVING METAL
- Publication number 20250024622
- Publication date Jan 16, 2025
- Intel Corporation
- Richard Canham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENHANCED I/O SEMICONDUCTOR CHIP PACKAGE AND COOLING ASSEMBLY HAVING...
- Publication number 20240421025
- Publication date Dec 19, 2024
- Intel Corporation
- Lianchang DU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES INCLUDING CARRIERS WITH INCORPORATED SU...
- Publication number 20240357744
- Publication date Oct 24, 2024
- Intel Corporation
- Rick Canham
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTEGRATED CIRCUIT PACKAGES WITH DAMPENERS TO REDUCE VIBRATION EFFECTS
- Publication number 20240355702
- Publication date Oct 24, 2024
- Phil Geng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DAMPING ASSEMBLIES FOR HEAT SINKS AND RELATED METHODS
- Publication number 20240349457
- Publication date Oct 17, 2024
- Phil Geng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIQUID METAL CONNECTION DEVICE AND METHOD
- Publication number 20240297119
- Publication date Sep 5, 2024
- Intel Corporation
- Srikant Nekkanty
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-ENTRY SOCKET POWER DELIVERY STRUCTURE AND BACKPLATE
- Publication number 20240179832
- Publication date May 30, 2024
- Phil Geng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONNECTORS FOR PROCESSING PACKAGES
- Publication number 20240136766
- Publication date Apr 25, 2024
- Siva Prasad Jangili Ganga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COOLING SYSTEMS WITH MAIN AND REMOTE COOLING MASSES HAVING INTEGRAT...
- Publication number 20240096741
- Publication date Mar 21, 2024
- Intel Corporation
- Phil GENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC SYSTEMS WITH INVERTED CIRCUIT BOARD WITH HEAT SINK TO CH...
- Publication number 20240063082
- Publication date Feb 22, 2024
- Intel Corporation
- Barrett M. Faneuf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE INTEGRATED TORSION LOADING MECHANISM
- Publication number 20230395460
- Publication date Dec 7, 2023
- Intel Corporation
- David Shia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID METAL INTERCONNECT FOR MODULAR PACKAGE SERVER ARCHITECTURE
- Publication number 20230197621
- Publication date Jun 22, 2023
- Intel Corporation
- Karumbu Meyyappan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID METAL INTERCONNECT FOR MODULAR SYSTEM ON AN INTERPOSER SERVE...
- Publication number 20230197622
- Publication date Jun 22, 2023
- Intel Corporation
- Karumbu Meyyappan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID METAL INTERCONNECT FOR MODULAR SYSTEM ON AN INTERCONNECT SER...
- Publication number 20230197594
- Publication date Jun 22, 2023
- Intel Corporation
- Karumbu Meyyappan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID METAL CONNECTION DEVICE AND METHOD
- Publication number 20230187850
- Publication date Jun 15, 2023
- Intel Corporation
- Ziyin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE LIQUID METAL CONNECTION DEVICE AND METHOD
- Publication number 20230187337
- Publication date Jun 15, 2023
- Karumbu Meyyappan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO CONTROL...
- Publication number 20230038805
- Publication date Feb 9, 2023
- Intel Corporation
- Phil Geng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO CONTROL...
- Publication number 20230027076
- Publication date Jan 26, 2023
- Intel Corporation
- Andres Ramirez Macias
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED SEPARATOR DEVICES FOR HARDWARE COMPONENT SEPARATION
- Publication number 20230019643
- Publication date Jan 19, 2023
- Intel Corporation
- Daniel Neumann
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR CHIP PACKAGE THERMO-MECHANICAL COOLING ASSEMBLY
- Publication number 20220208645
- Publication date Jun 30, 2022
- Intel Corporation
- Olaotan ELENITOBA-JOHNSON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COOLING ASSEMBLY WITH STRAP ELEMENT TO DIMINISH LATERAL MOVEMENT OF...
- Publication number 20220174843
- Publication date Jun 2, 2022
- Intel Corporation
- Phil GENG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BALL GRID ARRAY CHIP (BGA) PACKAGE COOLING ASSEMBLY WITH BOLSTER PLATE
- Publication number 20220117080
- Publication date Apr 14, 2022
- Intel Corporation
- Phil GENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COOLING ASSEMBLY WITH DAMPENED OSCILLATION RESPONSE
- Publication number 20220117079
- Publication date Apr 14, 2022
- Intel Corporation
- Phil GENG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PATTERNED BOLSTER PLATE AND COMPOSITE BACK PLATE FOR SEMICONDUCTOR...
- Publication number 20210410317
- Publication date Dec 30, 2021
- Intel Corporation
- Phil GENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETICALLY SECURED SEMICONDUCTOR CHIP PACKAGE LOADING ASSEMBLY
- Publication number 20210378099
- Publication date Dec 2, 2021
- Intel Corporation
- Phil GENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNOLOGIES FOR PROCESSOR LOADING MECHANISMS
- Publication number 20210193558
- Publication date Jun 24, 2021
- Intel Corporation
- Ralph V. Miele
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOADING FRAME FOR HIGH I/O COUNT PACKAGED SEMICONDUCTOR CHIP
- Publication number 20210183737
- Publication date Jun 17, 2021
- Intel Corporation
- Jeffory L. SMALLEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENHANCED INTEGRATED CIRCUIT COMPONENT POWER DELIVERY
- Publication number 20210183846
- Publication date Jun 17, 2021
- Intel Corporation
- Jeffory L. Smalley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TOP-SIDE CONNECTOR INTERFACE FOR PROCESSOR PACKAGING
- Publication number 20210120668
- Publication date Apr 22, 2021
- Intel Corporation
- Russell S. Aoki
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ELECTRONIC SYSTEMS WITH INVERTED CIRCUIT BOARD WITH HEAT SINK TO CH...
- Publication number 20210043537
- Publication date Feb 11, 2021
- Intel Corporation
- Barrett M. FANEUF
- G11 - INFORMATION STORAGE

Jeffory L. Smalley

Person

Patents Grantslast 30 patents

Electronic systems with inverted circuit board with heat sink to ch...

Electronic systems with inverted circuit board with heat sink to ch...

Reflow grid array to support late attach of components

Interposer and electronic package

Reflowable grid array to support grid heating

Multi-surface heat sink suitable for multi-chip packages

Reflowable grid array as standby heater for reliability

Scalable, high load, low stiffness, and small footprint loading mec...

Power bar package mount arrangement

Top-side connector interface for processor packaging

Hydraulic bladder for CPU interconnection and cooling

Electronic device, socket, and spacer to alter socket profile

Mechanical seal and reservoir for microelectronic packages

Rework grid array interposer with direct power

Socket contact techniques and configurations

Multi-chip self adjusting cooling solution

Heat sink coupling using flexible heat pipes for multi-surface comp...

Linear edge connector with activator bar and contact load spring

Socket loading element and associated techniques and configurations

CPU package substrates with removable memory mechanical interfaces

Single base multi-floating surface cooling solution

Socket contact techniques and configurations

Contact protection for integrated circuit device loading

Electronic assembly that includes a plurality of electronic packages

Multi-array bottom-side connector using spring bias

Lateral slide pick and place cover for reduced bent pins in LGA soc...

Electronic assemblies with scalable clip-type connectors

Integrated circuit connectors

Memory carrier and IHS coupling system

Fan mounting system

Patents Applicationslast 30 patents

PROTRUSIONS OF SOCKET BODIES HAVING METAL

ENHANCED I/O SEMICONDUCTOR CHIP PACKAGE AND COOLING ASSEMBLY HAVING...

INTEGRATED CIRCUIT PACKAGES INCLUDING CARRIERS WITH INCORPORATED SU...

INTEGRATED CIRCUIT PACKAGES WITH DAMPENERS TO REDUCE VIBRATION EFFECTS

DAMPING ASSEMBLIES FOR HEAT SINKS AND RELATED METHODS

LIQUID METAL CONNECTION DEVICE AND METHOD

MULTI-ENTRY SOCKET POWER DELIVERY STRUCTURE AND BACKPLATE

CONNECTORS FOR PROCESSING PACKAGES

COOLING SYSTEMS WITH MAIN AND REMOTE COOLING MASSES HAVING INTEGRAT...

ELECTRONIC SYSTEMS WITH INVERTED CIRCUIT BOARD WITH HEAT SINK TO CH...

BACKSIDE INTEGRATED TORSION LOADING MECHANISM

LIQUID METAL INTERCONNECT FOR MODULAR PACKAGE SERVER ARCHITECTURE

LIQUID METAL INTERCONNECT FOR MODULAR SYSTEM ON AN INTERPOSER SERVE...

LIQUID METAL INTERCONNECT FOR MODULAR SYSTEM ON AN INTERCONNECT SER...

LIQUID METAL CONNECTION DEVICE AND METHOD

FLEXIBLE LIQUID METAL CONNECTION DEVICE AND METHOD

METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO CONTROL...

METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO CONTROL...

INTEGRATED SEPARATOR DEVICES FOR HARDWARE COMPONENT SEPARATION

SEMICONDUCTOR CHIP PACKAGE THERMO-MECHANICAL COOLING ASSEMBLY

COOLING ASSEMBLY WITH STRAP ELEMENT TO DIMINISH LATERAL MOVEMENT OF...

BALL GRID ARRAY CHIP (BGA) PACKAGE COOLING ASSEMBLY WITH BOLSTER PLATE

COOLING ASSEMBLY WITH DAMPENED OSCILLATION RESPONSE

PATTERNED BOLSTER PLATE AND COMPOSITE BACK PLATE FOR SEMICONDUCTOR...

MAGNETICALLY SECURED SEMICONDUCTOR CHIP PACKAGE LOADING ASSEMBLY

TECHNOLOGIES FOR PROCESSOR LOADING MECHANISMS

LOADING FRAME FOR HIGH I/O COUNT PACKAGED SEMICONDUCTOR CHIP

ENHANCED INTEGRATED CIRCUIT COMPONENT POWER DELIVERY

TOP-SIDE CONNECTOR INTERFACE FOR PROCESSOR PACKAGING

ELECTRONIC SYSTEMS WITH INVERTED CIRCUIT BOARD WITH HEAT SINK TO CH...