Jeffrey Salvacion SOLAS

Person

Angeles City, PH

People

Patents Grantslast 30 patents

Information Patent Grant
Sensor having tubular walled sensing cavity
- Patent number 12,135,303
- Issue date Nov 5, 2024
- Texas Instruments Incorporated
- Christlyn Faith Arias
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip packages having bond over active circuit (BOAC)...
- Patent number 11,942,407
- Issue date Mar 26, 2024
- Texas Instruments Incorporated
- Jeffrey Salvacion Solas
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SENSOR HAVING TUBULAR WALLED SENSING CAVITY
- Publication number 20250020610
- Publication date Jan 16, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Christlyn Faith ARIAS
- G01 - MEASURING TESTING
Information Patent Application
OPEN CAVITY SENSOR
- Publication number 20250006573
- Publication date Jan 2, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Maricel Fabia ESCAÑO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL PROCESS FOR SEMICONDUCTOR DEVICE PACKAGE
- Publication number 20240404973
- Publication date Dec 5, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Mohamad Ashraf bin Mohd Arshad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE WITH OPEN SENSOR CAVITY
- Publication number 20240363466
- Publication date Oct 31, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Jeffrey Salvacion Solas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR HAVING TUBULAR WALLED SENSING CAVITY
- Publication number 20240248058
- Publication date Jul 25, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Christlyn Faith ARIAS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP PACKAGES HAVING BOND OVER ACTIVE CIRCUIT (BOAC)...
- Publication number 20240234282
- Publication date Jul 11, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Jeffrey Salvacion SOLAS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE PLATING FOR PACKAGED SEMICONDUCTOR DEVICES
- Publication number 20240006351
- Publication date Jan 4, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Katleen Fajardo Timbol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP PACKAGES HAVING BOND OVER ACTIVE CIRCUIT (BOAC)...
- Publication number 20230068086
- Publication date Mar 2, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Jeffrey Salvacion SOLAS
- H01 - BASIC ELECTRIC ELEMENTS

Jeffrey Salvacion SOLAS

Person

Patents Grantslast 30 patents

Sensor having tubular walled sensing cavity

Semiconductor chip packages having bond over active circuit (BOAC)...

Patents Applicationslast 30 patents

SENSOR HAVING TUBULAR WALLED SENSING CAVITY

OPEN CAVITY SENSOR

WAFER LEVEL PROCESS FOR SEMICONDUCTOR DEVICE PACKAGE

SEMICONDUCTOR DEVICE PACKAGE WITH OPEN SENSOR CAVITY

SENSOR HAVING TUBULAR WALLED SENSING CAVITY

SEMICONDUCTOR CHIP PACKAGES HAVING BOND OVER ACTIVE CIRCUIT (BOAC)...

SELECTIVE PLATING FOR PACKAGED SEMICONDUCTOR DEVICES

SEMICONDUCTOR CHIP PACKAGES HAVING BOND OVER ACTIVE CIRCUIT (BOAC)...