Jen-Cheng Liu

Person

Hsin-Chu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Memory test circuit, memory chip, and testing method of memory chip
- Patent number 12,362,028
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jui-Jen Wu
- G11 - INFORMATION STORAGE
Information Patent Grant
Passivation layer for epitaxial semiconductor process
- Patent number 12,363,969
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yin-Kai Liao
Information Patent Grant
Sense amplifier circuit and method
- Patent number 12,354,701
- Issue date Jul 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jui-Jen Wu
- G11 - INFORMATION STORAGE
Information Patent Grant
Memory devices, circuits and methods of adjusting a sensing current...
- Patent number 12,347,474
- Issue date Jul 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Win-San Khwa
- G11 - INFORMATION STORAGE
Information Patent Grant
Non-volatile memory stored with encoded data
- Patent number 12,334,151
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Win-San Khwa
- G11 - INFORMATION STORAGE
Information Patent Grant
Metal-insulator-metal device with improved performance
- Patent number 12,322,694
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bonding technology for stacking integrated circuits
- Patent number 12,315,843
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Ming Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Isolation structure to increase image sensor performance
- Patent number 12,310,137
- Issue date May 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yen-Ting Chiang
Information Patent Grant
Method for controlling sense amplifier and control device using the...
- Patent number 12,283,340
- Issue date Apr 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jui-Jen Wu
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 12,283,564
- Issue date Apr 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including image sensor and method of forming t...
- Patent number 12,278,250
- Issue date Apr 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding process for forming semiconductor device structure
- Patent number 12,258,265
- Issue date Mar 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hang Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Image sensor with overlap of backside trench isolation structure an...
- Patent number 12,255,219
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Feng-Chi Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sense amplifier circuit, memory circuit, and sensing method thereof
- Patent number 12,237,009
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jui-Jen Wu
- G11 - INFORMATION STORAGE
Information Patent Grant
Shield structure for backside through substrate vias (TSVs)
- Patent number 12,230,554
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond pad structure with high via density
- Patent number 12,224,298
- Issue date Feb 11, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu-Hsien Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside contact to improve thermal dissipation away from semicondu...
- Patent number 12,218,106
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor image sensor and method of manufacturing the same
- Patent number 12,218,165
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor image-sensing structure and method for forming the same
- Patent number 12,218,164
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ming-Hsien Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
CSI with controllable isolation structure and methods of manufactur...
- Patent number 12,218,166
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Oversized via as through-substrate-via (TSV) stop layer
- Patent number 12,205,868
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked structure for CMOS image sensors including through-substrat...
- Patent number 12,176,370
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory test circuit, memory array, and testing method of memory array
- Patent number 12,170,123
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jui-Jen Wu
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor structure
- Patent number 12,154,927
- Issue date Nov 26, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yen-Ting Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High capacitance MIM device with self aligned spacer
- Patent number 12,154,939
- Issue date Nov 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Sheng Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite BSI structure and method of manufacturing the same
- Patent number 12,148,782
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei Chuang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor device
- Patent number 12,148,781
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Szu-Ying Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated chip for standard logic performance improvement having a...
- Patent number 12,142,569
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure comprising various via structures
- Patent number 12,087,597
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jen-Fu Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally stable copper-alloy adhesion layer for metal interconnect...
- Patent number 12,080,594
- Issue date Sep 3, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Cheng-Lun Tsai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DEVICE HAVING ROWS OF MRAM CELLS CONFIGURED FOR CONCURRENT WRITING...
- Publication number 20250239285
- Publication date Jul 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jui-Jen Wu
- G11 - INFORMATION STORAGE
Information Patent Application
CROSS-POINT MEMORY CELL AND METHOD
- Publication number 20250240976
- Publication date Jul 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jui-Jen WU
- G11 - INFORMATION STORAGE
Information Patent Application
METHOD FOR CONTROLLING SENSE AMPLIFIER AND CONTROL DEVICE USING THE...
- Publication number 20250218474
- Publication date Jul 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jui-Jen Wu
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250219016
- Publication date Jul 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250221067
- Publication date Jul 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Min-Feng KAO
Information Patent Application
INTEGRATED CIRCUIT WITH NOISE REDUCING CAPACITOR AND METHOD OF MANU...
- Publication number 20250201696
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ko Chun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-INSULATOR-METAL CAPACITOR WITH PARTIAL BOTTOM LANDING
- Publication number 20250203884
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jaio-Wei Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING PROCESS FOR FORMING SEMICONDUCTOR DEVICE STRUCTURE
- Publication number 20250187907
- Publication date Jun 12, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hang Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
IMAGE SENSOR WITH OVERLAP OF BACKSIDE TRENCH ISOLATION STRUCTURE AN...
- Publication number 20250185400
- Publication date Jun 5, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Feng-Chi Hung
Information Patent Application
MEMORY DEVICE
- Publication number 20250173086
- Publication date May 29, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Chieh Liu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SENSE AMPLIFIER CIRCUIT, MEMORY CIRCUIT, AND SENSING METHOD THEREOF
- Publication number 20250166699
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jui-Jen Wu
- G11 - INFORMATION STORAGE
Information Patent Application
SHIELD STRUCTURE FOR BACKSIDE THROUGH SUBSTRATE VIAS (TSVS)
- Publication number 20250149407
- Publication date May 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURES AND METHODS OF FORMING THE SAME
- Publication number 20250151433
- Publication date May 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Ying HO
Information Patent Application
BACKSIDE CONTACT TO IMPROVE THERMAL DISSIPATION AWAY FROM SEMICONDU...
- Publication number 20250149509
- Publication date May 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED CMOS IMAGE SENSOR COMPRISING A PIXEL SENSOR FOR HIGH CONVER...
- Publication number 20250142232
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Kuan Yu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SEMICONDUCTOR IMAGE SENSOR AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250143000
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- MIN-FENG KAO
Information Patent Application
HIGH PERFORMANCE STACKING PIXEL
- Publication number 20250143001
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsin-Hung Chen
Information Patent Application
SEMICONDUCTOR CAPACITOR FOR STACKED PIXEL
- Publication number 20250133856
- Publication date Apr 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shen-Hui Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT FABRICATION EMPLOYING SELF-ALIGNED MASK
- Publication number 20250126812
- Publication date Apr 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Hsien Lin
Information Patent Application
IMAGE SENSORS AND METHODS OF MANUFACTURING THEM
- Publication number 20250126914
- Publication date Apr 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng Ying Ho
Information Patent Application
SEMICONDUCTOR STRUCTURES AND METHODS OF FORMING THE SAME
- Publication number 20250126915
- Publication date Apr 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Kuan YU
Information Patent Application
SEMICONDUCTOR IMAGE-SENSING STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20250126912
- Publication date Apr 17, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- MING-HSIEN YANG
Information Patent Application
COMPUTING CIRCUIT, PARTIAL SUM REGISTER, AND COMPUTING METHOD
- Publication number 20250117187
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Win-San Khwa
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
OVERSIZED VIA AS THROUGH-SUBSTRATE-VIA (TSV) STOP LAYER
- Publication number 20250105098
- Publication date Mar 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY TEST CIRCUIT, MEMORY ARRAY, AND TESTING METHOD OF MEMORY ARRAY
- Publication number 20250095762
- Publication date Mar 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jui-Jen Wu
- G11 - INFORMATION STORAGE
Information Patent Application
DEEP TRENCH ISOLATION STRUCTURE FOR IMAGE SENSOR
- Publication number 20250072148
- Publication date Feb 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yen-Ting Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS AND METHOD OF MANUFACTURING AN INTEGRATED CIRCUIT...
- Publication number 20250062274
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jen-Hao Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE BONDING TOOL WITH MOVABLE COMPONENT FOR IMPROVED DIE PROTRUSION...
- Publication number 20250054786
- Publication date Feb 13, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Chih-Yuan Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUSES FOR CONVOLUTION OF INPUT DATA
- Publication number 20250053611
- Publication date Feb 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Win-San Khwa
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CAPACITOR ARRAY FORMATION USING SINGLE ETCH PROCESS
- Publication number 20250048658
- Publication date Feb 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Hsien Lin
- H01 - BASIC ELECTRIC ELEMENTS

Jen-Cheng Liu

Person

Patents Grantslast 30 patents

Memory test circuit, memory chip, and testing method of memory chip

Passivation layer for epitaxial semiconductor process

Sense amplifier circuit and method

Memory devices, circuits and methods of adjusting a sensing current...

Non-volatile memory stored with encoded data

Metal-insulator-metal device with improved performance

Hybrid bonding technology for stacking integrated circuits

Isolation structure to increase image sensor performance

Method for controlling sense amplifier and control device using the...

Semiconductor structure and manufacturing method thereof

Semiconductor device including image sensor and method of forming t...

Bonding process for forming semiconductor device structure

Image sensor with overlap of backside trench isolation structure an...

Sense amplifier circuit, memory circuit, and sensing method thereof

Shield structure for backside through substrate vias (TSVs)

Bond pad structure with high via density

Backside contact to improve thermal dissipation away from semicondu...

Semiconductor image sensor and method of manufacturing the same

Semiconductor image-sensing structure and method for forming the same

CSI with controllable isolation structure and methods of manufactur...

Oversized via as through-substrate-via (TSV) stop layer

Stacked structure for CMOS image sensors including through-substrat...

Memory test circuit, memory array, and testing method of memory array

Semiconductor structure

High capacitance MIM device with self aligned spacer

Composite BSI structure and method of manufacturing the same

Image sensor device

Integrated chip for standard logic performance improvement having a...

Semiconductor structure comprising various via structures

Thermally stable copper-alloy adhesion layer for metal interconnect...

Patents Applicationslast 30 patents

DEVICE HAVING ROWS OF MRAM CELLS CONFIGURED FOR CONCURRENT WRITING...

CROSS-POINT MEMORY CELL AND METHOD

METHOD FOR CONTROLLING SENSE AMPLIFIER AND CONTROL DEVICE USING THE...

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

IMAGE SENSOR AND METHOD OF MANUFACTURING THE SAME

INTEGRATED CIRCUIT WITH NOISE REDUCING CAPACITOR AND METHOD OF MANU...

METAL-INSULATOR-METAL CAPACITOR WITH PARTIAL BOTTOM LANDING

BONDING PROCESS FOR FORMING SEMICONDUCTOR DEVICE STRUCTURE

IMAGE SENSOR WITH OVERLAP OF BACKSIDE TRENCH ISOLATION STRUCTURE AN...

MEMORY DEVICE

SENSE AMPLIFIER CIRCUIT, MEMORY CIRCUIT, AND SENSING METHOD THEREOF

SHIELD STRUCTURE FOR BACKSIDE THROUGH SUBSTRATE VIAS (TSVS)

SEMICONDUCTOR STRUCTURES AND METHODS OF FORMING THE SAME

BACKSIDE CONTACT TO IMPROVE THERMAL DISSIPATION AWAY FROM SEMICONDU...

STACKED CMOS IMAGE SENSOR COMPRISING A PIXEL SENSOR FOR HIGH CONVER...

SEMICONDUCTOR IMAGE SENSOR AND METHOD OF MANUFACTURING THE SAME

HIGH PERFORMANCE STACKING PIXEL

SEMICONDUCTOR CAPACITOR FOR STACKED PIXEL

INTEGRATED CIRCUIT FABRICATION EMPLOYING SELF-ALIGNED MASK

IMAGE SENSORS AND METHODS OF MANUFACTURING THEM

SEMICONDUCTOR STRUCTURES AND METHODS OF FORMING THE SAME

SEMICONDUCTOR IMAGE-SENSING STRUCTURE AND METHOD FOR FORMING THE SAME

COMPUTING CIRCUIT, PARTIAL SUM REGISTER, AND COMPUTING METHOD

OVERSIZED VIA AS THROUGH-SUBSTRATE-VIA (TSV) STOP LAYER

MEMORY TEST CIRCUIT, MEMORY ARRAY, AND TESTING METHOD OF MEMORY ARRAY

DEEP TRENCH ISOLATION STRUCTURE FOR IMAGE SENSOR

BONDING APPARATUS AND METHOD OF MANUFACTURING AN INTEGRATED CIRCUIT...

DIE BONDING TOOL WITH MOVABLE COMPONENT FOR IMPROVED DIE PROTRUSION...

METHODS AND APPARATUSES FOR CONVOLUTION OF INPUT DATA

CAPACITOR ARRAY FORMATION USING SINGLE ETCH PROCESS