Jen-Huai Chang

Person

Jhongli Industrial Park, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Thermoelectric cooling of semiconductor devices
- Patent number 12,261,199
- Issue date Mar 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Test key and semiconductor die including the same
- Patent number 12,255,112
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tse-Pan Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die-group package having a deep trench device
- Patent number 12,249,590
- Issue date Mar 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory systems with vertical integration
- Patent number 12,249,390
- Issue date Mar 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chieh Lee
- G11 - INFORMATION STORAGE
Information Patent Grant
Method of forming testing module and method for using the same
- Patent number 12,243,787
- Issue date Mar 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertically mounted die groups
- Patent number 12,237,303
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density through silicon conductive structures
- Patent number 12,237,244
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including power management die in a stack and...
- Patent number 12,230,607
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan Chang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Vertical semiconductor package including horizontally stacked dies...
- Patent number 12,230,613
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out packages providing enhanced mechanical strength and methods...
- Patent number 12,224,268
- Issue date Feb 11, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for forming the same
- Patent number 12,218,049
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing package structure
- Patent number 12,183,695
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mandrel structures and methods of fabricating the same in semicondu...
- Patent number 12,176,212
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jen-Hong Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and methods of forming the same
- Patent number 12,166,076
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jen-Hong Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for wafer manufacturing process management
- Patent number 12,154,808
- Issue date Nov 26, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Mei-Hsuan Lin
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Semiconductor package with high density of through-silicon vias (TSV)
- Patent number 12,154,869
- Issue date Nov 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compound with analgesic effect for use in prevention and treatment...
- Patent number 12,129,273
- Issue date Oct 29, 2024
- Academia Sinica
- Chih-Cheng Chen
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Semiconductor package including package seal ring and methods for f...
- Patent number 12,125,761
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a core-shell feature and method for formi...
- Patent number 12,113,113
- Issue date Oct 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die including fuse structure and methods for forming...
- Patent number 12,107,078
- Issue date Oct 1, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical connector with a reinforced tongue
- Patent number 12,095,188
- Issue date Sep 17, 2024
- T-CONN PRECISION CORPORATION
- Chien-An Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including test pad and bonding pad structure...
- Patent number 12,094,844
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional device structure including embedded integrated pa...
- Patent number 12,094,925
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shielded deep trench capacitor structure and methods of forming the...
- Patent number 12,094,868
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Guard ring and manufacturing method thereof
- Patent number 12,087,709
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package having stress relief structure
- Patent number 12,087,729
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electromagnetic shielding structure for a semiconductor device and...
- Patent number 12,080,656
- Issue date Sep 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including neighboring die contact and seal ri...
- Patent number 12,068,262
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional device structure including seal ring connection c...
- Patent number 12,040,242
- Issue date Jul 16, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid node chiplet stacking design
- Patent number 12,039,244
- Issue date Jul 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jen-Yuan Chang
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME
- Publication number 20250105084
- Publication date Mar 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Chia Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250070060
- Publication date Feb 27, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- JEN-YUAN CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND METHOD FOR CONTROLLING FRAME RATE OF APPLICATION
- Publication number 20250061838
- Publication date Feb 20, 2025
- MEDIATEK INC.
- Yi-Hsin SHEN
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
SYSTEM AND METHOD FOR WAFER MANUFACTURING PROCESS MANAGEMENT
- Publication number 20250062147
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Rong Syuan FAN
- B60 - VEHICLES IN GENERAL
Information Patent Application
SEMICONDUCTOR DEVICE AND METHODS OF FORMING THE SAME
- Publication number 20250056851
- Publication date Feb 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jen-Hong Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH HIGH DENSITY OF THROUGH-SILICON VIAS (TSV)
- Publication number 20250054881
- Publication date Feb 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AUTOMATIC CORRECTION DEVICE OF ROBOTIC ARM AND METHOD THEREOF
- Publication number 20250046637
- Publication date Feb 6, 2025
- JUN-FU TECHNOLOGY INC
- Cheng-Hsiang LU
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
MAGNETIC ACTUATOR AND REHABILITATION DEVICE HAVING THE SAME
- Publication number 20250001248
- Publication date Jan 2, 2025
- National Tsing-Hua University
- Li-Wei CHENG
- A63 - SPORTS GAMES AMUSEMENTS
Information Patent Application
METHOD FOR FABRICATING SEMICONDUCTOR PACKAGE INCLUDING SOIC DIE STACKS
- Publication number 20240413110
- Publication date Dec 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240412982
- Publication date Dec 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240413108
- Publication date Dec 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MAKING
- Publication number 20240404965
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chen-Hsuan YEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PERFORMING INTER-SITE BACKUP PROCESSING OF WAFER LOTS
- Publication number 20240393118
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- Mei-Hsuan Lin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
IN-CHIP THERMOELECTRIC DEVICE
- Publication number 20240397823
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THEREOF
- Publication number 20240395783
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Yuan CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE AND METHOD FOR PREVENTING WARPAGE OF CHIP PA...
- Publication number 20240395729
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hsuan YEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING A PLURALITY OF DIELECTRIC MATERIALS...
- Publication number 20240395773
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DEVICE HAVING A HEAT DISSIPATION STRUCTURE
- Publication number 20240395654
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING EMBEDDED SILICON PHOTONICS CHIP IN A MULTI-D...
- Publication number 20240393552
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Yuan Chang
- G02 - OPTICS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING PACKAGE SEAL RING AND METHODS FOR F...
- Publication number 20240387484
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING POWER MANAGEMENT DIE IN A STACK AND...
- Publication number 20240387470
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan Chang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
THREE-DIMENSIONAL DEVICE STRUCTURE INCLUDING SUBSTRATE-EMBEDDED INT...
- Publication number 20240387618
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMOELECTRIC COOLING OF SEMICONDUCTOR DEVICES
- Publication number 20240379746
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GUARD RING AND MANUFACTURING METHOD THEREOF
- Publication number 20240379586
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Yuan CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROMAGNETIC SHIELDING STRUCTURE FOR A SEMICONDUCTOR DEVICE AND...
- Publication number 20240379581
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Yuan CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF MAKING
- Publication number 20240379564
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Yi-Chu WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE BONDING SYSTEM AND DIE BONDING METHOD USING THE SAME
- Publication number 20240375251
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Chu WU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE WITH A CORE-SHELL FEATURE AND METHOD FOR FORMI...
- Publication number 20240371959
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Chung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL SEMICONDUCTOR PACKAGE INCLUDING HORIZONTALLY STACKED DIES...
- Publication number 20240371841
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL DEVICE STRUCTURE INCLUDING EMBEDDED INTEGRATED PA...
- Publication number 20240363682
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan CHANG
- H01 - BASIC ELECTRIC ELEMENTS

Jen-Huai Chang

Person

Patents Grantslast 30 patents

Thermoelectric cooling of semiconductor devices

Test key and semiconductor die including the same

Die-group package having a deep trench device

Memory systems with vertical integration

Method of forming testing module and method for using the same

Vertically mounted die groups

High density through silicon conductive structures

Semiconductor device including power management die in a stack and...

Vertical semiconductor package including horizontally stacked dies...

Fan-out packages providing enhanced mechanical strength and methods...

Semiconductor structure and method for forming the same

Method of manufacturing package structure

Mandrel structures and methods of fabricating the same in semicondu...

Semiconductor device and methods of forming the same

System and method for wafer manufacturing process management

Semiconductor package with high density of through-silicon vias (TSV)

Compound with analgesic effect for use in prevention and treatment...

Semiconductor package including package seal ring and methods for f...

Semiconductor device with a core-shell feature and method for formi...

Semiconductor die including fuse structure and methods for forming...

Electrical connector with a reinforced tongue

Semiconductor package including test pad and bonding pad structure...

Three-dimensional device structure including embedded integrated pa...

Shielded deep trench capacitor structure and methods of forming the...

Guard ring and manufacturing method thereof

Multi-chip package having stress relief structure

Electromagnetic shielding structure for a semiconductor device and...

Semiconductor package including neighboring die contact and seal ri...

Three-dimensional device structure including seal ring connection c...

Hybrid node chiplet stacking design

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME

PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

ELECTRONIC DEVICE AND METHOD FOR CONTROLLING FRAME RATE OF APPLICATION

SYSTEM AND METHOD FOR WAFER MANUFACTURING PROCESS MANAGEMENT

SEMICONDUCTOR DEVICE AND METHODS OF FORMING THE SAME

SEMICONDUCTOR PACKAGE WITH HIGH DENSITY OF THROUGH-SILICON VIAS (TSV)

AUTOMATIC CORRECTION DEVICE OF ROBOTIC ARM AND METHOD THEREOF

MAGNETIC ACTUATOR AND REHABILITATION DEVICE HAVING THE SAME

METHOD FOR FABRICATING SEMICONDUCTOR PACKAGE INCLUDING SOIC DIE STACKS

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MAKING

METHOD OF PERFORMING INTER-SITE BACKUP PROCESSING OF WAFER LOTS

IN-CHIP THERMOELECTRIC DEVICE

PACKAGE STRUCTURE AND METHOD OF FORMING THEREOF

CHIP PACKAGE STRUCTURE AND METHOD FOR PREVENTING WARPAGE OF CHIP PA...

SEMICONDUCTOR DEVICE INCLUDING A PLURALITY OF DIELECTRIC MATERIALS...

STACKED SEMICONDUCTOR DEVICE HAVING A HEAT DISSIPATION STRUCTURE

METHOD FOR FABRICATING EMBEDDED SILICON PHOTONICS CHIP IN A MULTI-D...

SEMICONDUCTOR PACKAGE INCLUDING PACKAGE SEAL RING AND METHODS FOR F...

SEMICONDUCTOR DEVICE INCLUDING POWER MANAGEMENT DIE IN A STACK AND...

THREE-DIMENSIONAL DEVICE STRUCTURE INCLUDING SUBSTRATE-EMBEDDED INT...

THERMOELECTRIC COOLING OF SEMICONDUCTOR DEVICES

GUARD RING AND MANUFACTURING METHOD THEREOF

ELECTROMAGNETIC SHIELDING STRUCTURE FOR A SEMICONDUCTOR DEVICE AND...

SEMICONDUCTOR STRUCTURE AND METHOD OF MAKING

DIE BONDING SYSTEM AND DIE BONDING METHOD USING THE SAME

SEMICONDUCTOR DEVICE WITH A CORE-SHELL FEATURE AND METHOD FOR FORMI...

VERTICAL SEMICONDUCTOR PACKAGE INCLUDING HORIZONTALLY STACKED DIES...

THREE-DIMENSIONAL DEVICE STRUCTURE INCLUDING EMBEDDED INTEGRATED PA...