Jen-Yuan CHANG

Person

Hsinchu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor structure and method for forming the same
- Patent number 11,940,662
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jen-Yuan Chang
- G02 - OPTICS
Information Patent Grant
Stacked semiconductor device test circuits and methods of use
- Patent number 11,935,798
- Issue date Mar 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertically mounted die groups
- Patent number 11,929,348
- Issue date Mar 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deep trench capacitor fuse structure for high voltage breakdown def...
- Patent number 11,923,355
- Issue date Mar 5, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming
- Patent number 11,923,263
- Issue date Mar 5, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for bonding semiconductor devices, method for forming semico...
- Patent number 11,916,037
- Issue date Feb 27, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional device structure including embedded integrated pa...
- Patent number 11,908,838
- Issue date Feb 20, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric isolation structure for multi-gate transistors
- Patent number 11,888,049
- Issue date Jan 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jen-Hong Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die stack and integrated device structure including improved bondin...
- Patent number 11,869,859
- Issue date Jan 9, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out packages providing enhanced mechanical strength and methods...
- Patent number 11,862,610
- Issue date Jan 2, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die including fuse structure and methods for forming...
- Patent number 11,862,609
- Issue date Jan 2, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional device structure including substrate-embedded int...
- Patent number 11,855,130
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for forming the same
- Patent number 11,854,867
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for forming thereof
- Patent number 11,854,969
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of forming thereof
- Patent number 11,837,586
- Issue date Dec 5, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,830,948
- Issue date Nov 28, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jiun-Ming Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor arrangement and method of making
- Patent number 11,817,373
- Issue date Nov 14, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor device and manufacturing method thereof
- Patent number 11,776,896
- Issue date Oct 3, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compound with analgesic effect for use in prevention and treatment...
- Patent number 11,753,432
- Issue date Sep 12, 2023
- Academia Sinica
- Chih-Cheng Chen
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Semiconductor device including a plurality of dielectric materials...
- Patent number 11,742,325
- Issue date Aug 29, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device comprising a thermally conductive connector compr...
- Patent number 11,744,045
- Issue date Aug 29, 2023
- QUALCOMM Incorporated
- Hung-Wen Lin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electronic device comprising thermally conductive connector
- Patent number 11,733,749
- Issue date Aug 22, 2023
- QUALCOMM Incorporated
- Hung-Wen Lin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor die including guard ring structure and three-dimensio...
- Patent number 11,728,288
- Issue date Aug 15, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including test pad and bonding pad structure...
- Patent number 11,728,301
- Issue date Aug 15, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Terminal structure of high-frequency signal connector and manufactu...
- Patent number 11,688,990
- Issue date Jun 27, 2023
- T-CONN PRECISION CORPORATION
- Jen-Hao Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated device coupled to a step heat sink configured to provide...
- Patent number 11,637,051
- Issue date Apr 25, 2023
- QUALCOMM Incorporated
- Hung-Wen Lin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electromagnetic shielding structure for a semiconductor device and...
- Patent number 11,594,497
- Issue date Feb 28, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LED display screen module
- Patent number 11,552,219
- Issue date Jan 10, 2023
- Harvatek Corporation
- Jen-Hung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric isolation structure for multi-gate transistors
- Patent number 11,532,733
- Issue date Dec 20, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jen-Hong Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for forming the same
- Patent number 11,521,893
- Issue date Dec 6, 2022
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
UE ASSISTED HANDOVER TO SECONDARY CELL VIA BEAM FAILURE RECOVERY
- Publication number 20240107414
- Publication date Mar 28, 2024
- QUALCOMM Incorporated
- Yu-Chieh HUANG
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
FAN-OUT PACKAGES PROVIDING ENHANCED MECHANICAL STRENGTH AND METHODS...
- Publication number 20240088102
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FRAME CASSETTE WITH INTERNAL COVER CASES
- Publication number 20240087930
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PICK-AND-PLACE TOOL WITH WARPAGE-CORRECTION MECHANISM
- Publication number 20240087943
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE, CARRYING BUCKLE, AND CARRYING FRAME OF CARRYING...
- Publication number 20240065388
- Publication date Feb 29, 2024
- WISTRON NEWEB CORPORATION
- HUNG-MING CHANG
- A44 - HABERDASHERY JEWELLERY
Information Patent Application
SEMICONDUCTOR STRUCTURE WITH ROUGHENED SIDEWALL AND METHOD OF MANUF...
- Publication number 20240063272
- Publication date Feb 22, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- JEN-YUAN CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR BONDING STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20240063185
- Publication date Feb 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Yuan CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20240055527
- Publication date Feb 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jiun-Ming Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED SEMICONDUCTOR PACKAGING SYSTEM WITH ENHANCED DIELECTRIC-...
- Publication number 20240055389
- Publication date Feb 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP PACKAGE HAVING STRESS RELIEF STRUCTURE
- Publication number 20240055396
- Publication date Feb 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WEARABLE DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240053793
- Publication date Feb 15, 2024
- HTC CORPORATION
- Chang-Hsueh Liu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
DUMMY PATTERN STRUCTURE FOR REDUCING DISHING
- Publication number 20240047380
- Publication date Feb 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMMERSION COOLING SYSTEM FOR INTEGRATED CIRCUIT
- Publication number 20240049427
- Publication date Feb 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Yuan CHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
NETWORK ASSISTANT INFORMATION FOR USER EQUIPMENT TROUBLESHOOTING
- Publication number 20240048965
- Publication date Feb 8, 2024
- QUALCOMM Incorporated
- Kai-Chun CHENG
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING DEEP TRENCH CAPACITOR AND METHOD OF...
- Publication number 20240047383
- Publication date Feb 8, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- JEN-YUAN CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR MANUFACTURING A BONDED SEMICONDUCTOR STRUCTURE AND ME...
- Publication number 20240047242
- Publication date Feb 8, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- JEN-YUAN CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH POLYGONAL PROFILES FROM THE TOP VIEW AND...
- Publication number 20240047282
- Publication date Feb 8, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- JEN-YUAN CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THEREOF
- Publication number 20240038741
- Publication date Feb 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Yuan CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THEREOF
- Publication number 20240038686
- Publication date Feb 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PICK-AND-PLACE APPARATUS AND HEAD MATERIAL THEREOF
- Publication number 20240025056
- Publication date Jan 25, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- JEN-YUAN CHANG
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
BONDING TOOL AND BONDING METHOD THEREOF
- Publication number 20240030179
- Publication date Jan 25, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- JEN-YUAN CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THEREOF
- Publication number 20240030082
- Publication date Jan 25, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- JEN-YUAN CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PICK-AND-PLACE TOOL AND METHOD OF MANUFACTURING SEMICONDUCTOR STRUC...
- Publication number 20240021448
- Publication date Jan 18, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- JEN-YUAN CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IN-CHIP THERMOELECTRIC DEVICE
- Publication number 20240023442
- Publication date Jan 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOUND WITH ANALGESIC EFFECT FOR USE IN PREVENTION AND TREATMENT...
- Publication number 20240010669
- Publication date Jan 11, 2024
- ACADEMIA SINICA
- Chih-Cheng CHEN
- C07 - ORGANIC CHEMISTRY
Information Patent Application
VERTICALLY MOUNTED DIE GROUPS
- Publication number 20240014172
- Publication date Jan 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED SILICON PHOTONICS CHIP IN A MULTI-DIE PACKAGE
- Publication number 20240004151
- Publication date Jan 4, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Yuan Chang
- G02 - OPTICS
Information Patent Application
SEMICONDUCTOR DIE ASSEMBLY HAVING A POLYGONAL LINKING DIE
- Publication number 20240006374
- Publication date Jan 4, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PERFORMING INTER-SITE BACKUP PROCESSING OF WAFER LOTS
- Publication number 20240003692
- Publication date Jan 4, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- Mei-Hsuan Lin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20230411282
- Publication date Dec 21, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- JEN-YUAN CHANG
- H01 - BASIC ELECTRIC ELEMENTS

Jen-Yuan CHANG

Person

Patents Grantslast 30 patents

Semiconductor structure and method for forming the same

Stacked semiconductor device test circuits and methods of use

Vertically mounted die groups

Deep trench capacitor fuse structure for high voltage breakdown def...

Semiconductor device and method of forming

Method for bonding semiconductor devices, method for forming semico...

Three-dimensional device structure including embedded integrated pa...

Dielectric isolation structure for multi-gate transistors

Die stack and integrated device structure including improved bondin...

Fan-out packages providing enhanced mechanical strength and methods...

Semiconductor die including fuse structure and methods for forming...

Three-dimensional device structure including substrate-embedded int...

Semiconductor structure and method for forming the same

Semiconductor structure and method for forming thereof

Package structure and method of forming thereof

Semiconductor device and manufacturing method thereof

Semiconductor arrangement and method of making

Capacitor device and manufacturing method thereof

Compound with analgesic effect for use in prevention and treatment...

Semiconductor device including a plurality of dielectric materials...

Electronic device comprising a thermally conductive connector compr...

Electronic device comprising thermally conductive connector

Semiconductor die including guard ring structure and three-dimensio...

Semiconductor package including test pad and bonding pad structure...

Terminal structure of high-frequency signal connector and manufactu...

Integrated device coupled to a step heat sink configured to provide...

Electromagnetic shielding structure for a semiconductor device and...

LED display screen module

Dielectric isolation structure for multi-gate transistors

Semiconductor structure and method for forming the same

Patents Applicationslast 30 patents

UE ASSISTED HANDOVER TO SECONDARY CELL VIA BEAM FAILURE RECOVERY

FAN-OUT PACKAGES PROVIDING ENHANCED MECHANICAL STRENGTH AND METHODS...

FRAME CASSETTE WITH INTERNAL COVER CASES

PICK-AND-PLACE TOOL WITH WARPAGE-CORRECTION MECHANISM

ELECTRONIC DEVICE, CARRYING BUCKLE, AND CARRYING FRAME OF CARRYING...

SEMICONDUCTOR STRUCTURE WITH ROUGHENED SIDEWALL AND METHOD OF MANUF...

SEMICONDUCTOR BONDING STRUCTURE AND METHOD OF FORMING THE SAME

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

INTEGRATED SEMICONDUCTOR PACKAGING SYSTEM WITH ENHANCED DIELECTRIC-...

MULTI-CHIP PACKAGE HAVING STRESS RELIEF STRUCTURE

WEARABLE DEVICE AND MANUFACTURING METHOD THEREOF

DUMMY PATTERN STRUCTURE FOR REDUCING DISHING

IMMERSION COOLING SYSTEM FOR INTEGRATED CIRCUIT

NETWORK ASSISTANT INFORMATION FOR USER EQUIPMENT TROUBLESHOOTING

SEMICONDUCTOR STRUCTURE HAVING DEEP TRENCH CAPACITOR AND METHOD OF...

APPARATUS FOR MANUFACTURING A BONDED SEMICONDUCTOR STRUCTURE AND ME...

SEMICONDUCTOR DEVICE WITH POLYGONAL PROFILES FROM THE TOP VIEW AND...

PACKAGE STRUCTURE AND METHOD OF FORMING THEREOF

SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THEREOF

PICK-AND-PLACE APPARATUS AND HEAD MATERIAL THEREOF

BONDING TOOL AND BONDING METHOD THEREOF

SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THEREOF

PICK-AND-PLACE TOOL AND METHOD OF MANUFACTURING SEMICONDUCTOR STRUC...

IN-CHIP THERMOELECTRIC DEVICE

COMPOUND WITH ANALGESIC EFFECT FOR USE IN PREVENTION AND TREATMENT...

VERTICALLY MOUNTED DIE GROUPS

EMBEDDED SILICON PHOTONICS CHIP IN A MULTI-DIE PACKAGE

SEMICONDUCTOR DIE ASSEMBLY HAVING A POLYGONAL LINKING DIE

METHOD OF PERFORMING INTER-SITE BACKUP PROCESSING OF WAFER LOTS

SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME