Jen-Yuan CHANG

Person

Hsinchu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing package structure
- Patent number 12,183,695
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mandrel structures and methods of fabricating the same in semicondu...
- Patent number 12,176,212
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jen-Hong Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and methods of forming the same
- Patent number 12,166,076
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jen-Hong Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for wafer manufacturing process management
- Patent number 12,154,808
- Issue date Nov 26, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Mei-Hsuan Lin
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Semiconductor package with high density of through-silicon vias (TSV)
- Patent number 12,154,869
- Issue date Nov 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compound with analgesic effect for use in prevention and treatment...
- Patent number 12,129,273
- Issue date Oct 29, 2024
- Academia Sinica
- Chih-Cheng Chen
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Semiconductor package including package seal ring and methods for f...
- Patent number 12,125,761
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a core-shell feature and method for formi...
- Patent number 12,113,113
- Issue date Oct 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die including fuse structure and methods for forming...
- Patent number 12,107,078
- Issue date Oct 1, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical connector with a reinforced tongue
- Patent number 12,095,188
- Issue date Sep 17, 2024
- T-CONN PRECISION CORPORATION
- Chien-An Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including test pad and bonding pad structure...
- Patent number 12,094,844
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional device structure including embedded integrated pa...
- Patent number 12,094,925
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shielded deep trench capacitor structure and methods of forming the...
- Patent number 12,094,868
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Guard ring and manufacturing method thereof
- Patent number 12,087,709
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package having stress relief structure
- Patent number 12,087,729
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electromagnetic shielding structure for a semiconductor device and...
- Patent number 12,080,656
- Issue date Sep 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including neighboring die contact and seal ri...
- Patent number 12,068,262
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional device structure including seal ring connection c...
- Patent number 12,040,242
- Issue date Jul 16, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid node chiplet stacking design
- Patent number 12,039,244
- Issue date Jul 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jen-Yuan Chang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Dummy pattern structure for reducing dishing
- Patent number 12,033,959
- Issue date Jul 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die including guard ring structure and three-dimensio...
- Patent number 12,027,475
- Issue date Jul 2, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pick-and-place system with a stabilizer
- Patent number 12,027,403
- Issue date Jul 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die and photoelectric device integrated in same package
- Patent number 12,021,069
- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertically stacked semiconductor device including a hybrid bond con...
- Patent number 12,015,010
- Issue date Jun 18, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical semiconductor package including horizontally stacked dies...
- Patent number 12,009,349
- Issue date Jun 11, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deep trench capacitor including a compact contact region and method...
- Patent number 12,009,405
- Issue date Jun 11, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor device including a cooling structure
- Patent number 11,984,376
- Issue date May 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for forming the same
- Patent number 11,940,662
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jen-Yuan Chang
- G02 - OPTICS
Information Patent Grant
Stacked semiconductor device test circuits and methods of use
- Patent number 11,935,798
- Issue date Mar 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertically mounted die groups
- Patent number 11,929,348
- Issue date Mar 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MAGNETIC ACTUATOR AND REHABILITATION DEVICE HAVING THE SAME
- Publication number 20250001248
- Publication date Jan 2, 2025
- National Tsing-Hua University
- Li-Wei CHENG
- A63 - SPORTS GAMES AMUSEMENTS
Information Patent Application
METHOD FOR FABRICATING SEMICONDUCTOR PACKAGE INCLUDING SOIC DIE STACKS
- Publication number 20240413110
- Publication date Dec 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240412982
- Publication date Dec 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240413108
- Publication date Dec 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MAKING
- Publication number 20240404965
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chen-Hsuan YEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PERFORMING INTER-SITE BACKUP PROCESSING OF WAFER LOTS
- Publication number 20240393118
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- Mei-Hsuan Lin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
IN-CHIP THERMOELECTRIC DEVICE
- Publication number 20240397823
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THEREOF
- Publication number 20240395783
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Yuan CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE AND METHOD FOR PREVENTING WARPAGE OF CHIP PA...
- Publication number 20240395729
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hsuan YEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING A PLURALITY OF DIELECTRIC MATERIALS...
- Publication number 20240395773
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DEVICE HAVING A HEAT DISSIPATION STRUCTURE
- Publication number 20240395654
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING EMBEDDED SILICON PHOTONICS CHIP IN A MULTI-D...
- Publication number 20240393552
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Yuan Chang
- G02 - OPTICS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING PACKAGE SEAL RING AND METHODS FOR F...
- Publication number 20240387484
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING POWER MANAGEMENT DIE IN A STACK AND...
- Publication number 20240387470
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan Chang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
THREE-DIMENSIONAL DEVICE STRUCTURE INCLUDING SUBSTRATE-EMBEDDED INT...
- Publication number 20240387618
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMOELECTRIC COOLING OF SEMICONDUCTOR DEVICES
- Publication number 20240379746
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GUARD RING AND MANUFACTURING METHOD THEREOF
- Publication number 20240379586
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Yuan CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROMAGNETIC SHIELDING STRUCTURE FOR A SEMICONDUCTOR DEVICE AND...
- Publication number 20240379581
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Yuan CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF MAKING
- Publication number 20240379564
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Yi-Chu WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE BONDING SYSTEM AND DIE BONDING METHOD USING THE SAME
- Publication number 20240375251
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Chu WU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE WITH A CORE-SHELL FEATURE AND METHOD FOR FORMI...
- Publication number 20240371959
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Chung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL SEMICONDUCTOR PACKAGE INCLUDING HORIZONTALLY STACKED DIES...
- Publication number 20240371841
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL DEVICE STRUCTURE INCLUDING EMBEDDED INTEGRATED PA...
- Publication number 20240363682
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package Including Neighboring Die Contact Seal Ring a...
- Publication number 20240363554
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package Including Test Pad and Bonding Pad Structure...
- Publication number 20240363565
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND SHIELDING STRUCTURE
- Publication number 20240357780
- Publication date Oct 24, 2024
- WISTRON NEWEB CORPORATION
- TIAO-MING HSU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PICK-AND-PLACE SYSTEM WITH A STABILIZER
- Publication number 20240339348
- Publication date Oct 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Hybrid Node Chiplet Stacking Design
- Publication number 20240338507
- Publication date Oct 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Yuan Chang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
THREE-DIMENSIONAL DEVICE STRUCTURE INCLUDING SEAL RING CONNECTION C...
- Publication number 20240321654
- Publication date Sep 26, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING A SEMICONDUCTOR STRUCTURE
- Publication number 20240312972
- Publication date Sep 19, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- JEN-YUAN CHANG
- H01 - BASIC ELECTRIC ELEMENTS

Jen-Yuan CHANG

Person

Patents Grantslast 30 patents

Method of manufacturing package structure

Mandrel structures and methods of fabricating the same in semicondu...

Semiconductor device and methods of forming the same

System and method for wafer manufacturing process management

Semiconductor package with high density of through-silicon vias (TSV)

Compound with analgesic effect for use in prevention and treatment...

Semiconductor package including package seal ring and methods for f...

Semiconductor device with a core-shell feature and method for formi...

Semiconductor die including fuse structure and methods for forming...

Electrical connector with a reinforced tongue

Semiconductor package including test pad and bonding pad structure...

Three-dimensional device structure including embedded integrated pa...

Shielded deep trench capacitor structure and methods of forming the...

Guard ring and manufacturing method thereof

Multi-chip package having stress relief structure

Electromagnetic shielding structure for a semiconductor device and...

Semiconductor package including neighboring die contact and seal ri...

Three-dimensional device structure including seal ring connection c...

Hybrid node chiplet stacking design

Dummy pattern structure for reducing dishing

Semiconductor die including guard ring structure and three-dimensio...

Pick-and-place system with a stabilizer

Semiconductor die and photoelectric device integrated in same package

Vertically stacked semiconductor device including a hybrid bond con...

Vertical semiconductor package including horizontally stacked dies...

Deep trench capacitor including a compact contact region and method...

Stacked semiconductor device including a cooling structure

Semiconductor structure and method for forming the same

Stacked semiconductor device test circuits and methods of use

Vertically mounted die groups

Patents Applicationslast 30 patents

MAGNETIC ACTUATOR AND REHABILITATION DEVICE HAVING THE SAME

METHOD FOR FABRICATING SEMICONDUCTOR PACKAGE INCLUDING SOIC DIE STACKS

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MAKING

METHOD OF PERFORMING INTER-SITE BACKUP PROCESSING OF WAFER LOTS

IN-CHIP THERMOELECTRIC DEVICE

PACKAGE STRUCTURE AND METHOD OF FORMING THEREOF

CHIP PACKAGE STRUCTURE AND METHOD FOR PREVENTING WARPAGE OF CHIP PA...

SEMICONDUCTOR DEVICE INCLUDING A PLURALITY OF DIELECTRIC MATERIALS...

STACKED SEMICONDUCTOR DEVICE HAVING A HEAT DISSIPATION STRUCTURE

METHOD FOR FABRICATING EMBEDDED SILICON PHOTONICS CHIP IN A MULTI-D...

SEMICONDUCTOR PACKAGE INCLUDING PACKAGE SEAL RING AND METHODS FOR F...

SEMICONDUCTOR DEVICE INCLUDING POWER MANAGEMENT DIE IN A STACK AND...

THREE-DIMENSIONAL DEVICE STRUCTURE INCLUDING SUBSTRATE-EMBEDDED INT...

THERMOELECTRIC COOLING OF SEMICONDUCTOR DEVICES

GUARD RING AND MANUFACTURING METHOD THEREOF

ELECTROMAGNETIC SHIELDING STRUCTURE FOR A SEMICONDUCTOR DEVICE AND...

SEMICONDUCTOR STRUCTURE AND METHOD OF MAKING

DIE BONDING SYSTEM AND DIE BONDING METHOD USING THE SAME

SEMICONDUCTOR DEVICE WITH A CORE-SHELL FEATURE AND METHOD FOR FORMI...

VERTICAL SEMICONDUCTOR PACKAGE INCLUDING HORIZONTALLY STACKED DIES...

THREE-DIMENSIONAL DEVICE STRUCTURE INCLUDING EMBEDDED INTEGRATED PA...

Semiconductor Package Including Neighboring Die Contact Seal Ring a...

Semiconductor Package Including Test Pad and Bonding Pad Structure...

ELECTRONIC DEVICE AND SHIELDING STRUCTURE

PICK-AND-PLACE SYSTEM WITH A STABILIZER

Hybrid Node Chiplet Stacking Design

THREE-DIMENSIONAL DEVICE STRUCTURE INCLUDING SEAL RING CONNECTION C...

METHOD FOR FORMING A SEMICONDUCTOR STRUCTURE