Jenq-Gong Duh

Person

Hsinchu City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Method for inspecting a connecting surface of a flip chip
- Patent number 7,169,627
- Issue date Jan 30, 2007
- National Tsing Hua University
- Jenq-Gong Duh
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR MANUFACTURING ELECTRODE OF LITHIUM BATTERY
- Publication number 20150099641
- Publication date Apr 9, 2015
- Christine Jill Lee
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
POROUS LI4TI5O12 ANODE MATERIAL, METHOD OF MANUFACTURING THE SAME A...
- Publication number 20120308880
- Publication date Dec 6, 2012
- National Tsing Hua University
- Jenq Gong DUH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE, PACKAGING SUBSTRATE AND CHIP
- Publication number 20120181691
- Publication date Jul 19, 2012
- National Tsing Hua University
- Jenq-Gong DUH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER-MANGANESE BONDING STRUCTURE FOR ELECTRONIC PACKAGES
- Publication number 20110281136
- Publication date Nov 17, 2011
- Jenq-Gong Duh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
INDUCTOR WITH FERROMAGNETIC METAL FILM
- Publication number 20110175698
- Publication date Jul 21, 2011
- Jenq-Gong Duh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUCTOR STRUCTURE
- Publication number 20110109415
- Publication date May 12, 2011
- Jenq-Gong Duh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE STRUCTURE
- Publication number 20100277880
- Publication date Nov 4, 2010
- Jenq-Gong DUH
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
METALLIC BONDING STRUCTURE FOR COPPER AND SOLDER
- Publication number 20100244266
- Publication date Sep 30, 2010
- Jenq-Gong Duh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for fabricating concentration-gradient high-frequency ferrom...
- Publication number 20080296148
- Publication date Dec 4, 2008
- National Tsing Hua University
- Shan-Dong Li
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Manufacturing method of coating target
- Publication number 20080179193
- Publication date Jul 31, 2008
- National Tsing Hua University
- Jenq-Gong Duh
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Modification of an anode material and a preperation method thereof
- Publication number 20070148547
- Publication date Jun 28, 2007
- National Tsing Hua University
- Jenq-Gong Duh
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Mold for press-molding glass elements
- Publication number 20060179887
- Publication date Aug 17, 2006
- Ether Precision, Inc.
- James Cheng-Yuan Lung
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Application
Method for inspecting a connecting surface of a flip chip
- Publication number 20040253749
- Publication date Dec 16, 2004
- Jenq-Gong Duh
- H01 - BASIC ELECTRIC ELEMENTS

Jenq-Gong Duh

Person

Patents Grantslast 30 patents

Method for inspecting a connecting surface of a flip chip

Patents Applicationslast 30 patents

METHOD FOR MANUFACTURING ELECTRODE OF LITHIUM BATTERY

POROUS LI4TI5O12 ANODE MATERIAL, METHOD OF MANUFACTURING THE SAME A...

PACKAGE STRUCTURE, PACKAGING SUBSTRATE AND CHIP

COPPER-MANGANESE BONDING STRUCTURE FOR ELECTRONIC PACKAGES

INDUCTOR WITH FERROMAGNETIC METAL FILM

INDUCTOR STRUCTURE

ELECTRONIC PACKAGE STRUCTURE

METALLIC BONDING STRUCTURE FOR COPPER AND SOLDER

Method for fabricating concentration-gradient high-frequency ferrom...

Manufacturing method of coating target

Modification of an anode material and a preperation method thereof

Mold for press-molding glass elements

Method for inspecting a connecting surface of a flip chip