Jeremiah T. Pender

Person

San Jose, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method of patterning a low-k dielectric film
- Patent number 11,302,519
- Issue date Apr 12, 2022
- Applied Materials, Inc.
- Srinivas D. Nemani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cyclic spacer etching process with improved profile control
- Patent number 9,721,807
- Issue date Aug 1, 2017
- Applied Materials, Inc.
- Qingjun Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming features in a material layer utilizing a combin...
- Patent number 9,543,163
- Issue date Jan 10, 2017
- Applied Materials, Inc.
- Mang-Mang Ling
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for barrier layer removal
- Patent number 9,514,953
- Issue date Dec 6, 2016
- Applied Materials, Inc.
- Chia-Ling Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cyclic spacer etching process with improved profile control
- Patent number 9,478,433
- Issue date Oct 25, 2016
- Applied Materials, Inc.
- Qingjun Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for etching a dielectric barrier layer in a dual damascene...
- Patent number 9,299,577
- Issue date Mar 29, 2016
- Applied Materials, Inc.
- He Ren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of patterning a low-k dielectric film
- Patent number 9,165,783
- Issue date Oct 20, 2015
- Applied Materials, Inc.
- Srinivas D. Nemani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of patterning a silicon nitride dielectric film
- Patent number 9,093,389
- Issue date Jul 28, 2015
- Applied Materials, Inc.
- Srinivas D. Nemani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of removing a photoresist from a low-k dielectric film
- Patent number 8,980,754
- Issue date Mar 17, 2015
- Applied Materials, Inc.
- Yifeng Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for etching an etching stop layer utilizing a cyclical etch...
- Patent number 8,980,758
- Issue date Mar 17, 2015
- Applied Materials, Inc.
- Mang-Mang Ling
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for etching plural layers on a workpiece includin...
- Patent number 8,932,959
- Issue date Jan 13, 2015
- Applied Materials, Inc.
- Srinivas D. Nemani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of patterning a low-k dielectric film
- Patent number 8,802,572
- Issue date Aug 12, 2014
- Applied Materials, Inc.
- Srinivas D. Nemani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon oxide recess etch
- Patent number 8,748,322
- Issue date Jun 10, 2014
- Applied Materials, Inc.
- Nancy Fung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of patterning a low-K dielectric film
- Patent number 8,647,990
- Issue date Feb 11, 2014
- Applied Materials, Inc.
- Yifeng Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of patterning a low-k dielectric film
- Patent number 8,314,033
- Issue date Nov 20, 2012
- Applied Materials, Inc.
- Yifeng Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating interconnect structures for semiconductor de...
- Patent number 8,143,138
- Issue date Mar 27, 2012
- Applied Materials, Inc.
- Ryan James Patz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for monitoring process drift using plasma characteristics
- Patent number 7,848,898
- Issue date Dec 7, 2010
- Applied Materials Inc.
- Steven C. Shannon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for determining plasma characteristics
- Patent number 7,620,511
- Issue date Nov 17, 2009
- Applied Materials, Inc.
- Steven C. Shannon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chamber recovery after opening barrier over copper
- Patent number 7,575,007
- Issue date Aug 18, 2009
- Applied Materials, Inc.
- Hairong Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for determining plasma characteristics
- Patent number 7,440,859
- Issue date Oct 21, 2008
- Applied Materials, Inc.
- Steven C. Shannon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Selective etch process of a sacrificial light absorbing material (S...
- Patent number 7,309,448
- Issue date Dec 18, 2007
- Applied Materials, Inc.
- Hee Yeop Chae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective etch process of a sacrificial light absorbing material (S...
- Patent number 7,300,597
- Issue date Nov 27, 2007
- Applied Materials, Inc.
- Hee Yeop Chae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for determining plasma characteristics
- Patent number 7,286,948
- Issue date Oct 23, 2007
- Applied Materials, Inc.
- Steven C. Shannon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate cleaning process
- Patent number 6,440,864
- Issue date Aug 27, 2002
- Applied Materials Inc.
- Thomas J. Kropewnicki
- B08 - CLEANING

Patents Applicationslast 30 patents

Information Patent Application
CYCLIC SPACER ETCHING PROCESS WITH IMPROVED PROFILE CONTROL
- Publication number 20160293437
- Publication date Oct 6, 2016
- Applied Materials, Inc.
- Qingjun ZHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CYCLIC SPACER ETCHING PROCESS WITH IMPROVED PROFILE CONTROL
- Publication number 20160293438
- Publication date Oct 6, 2016
- Applied Materials, Inc.
- Qingjun ZHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCH ENHANCEMENT VIA CONTROLLED INTRODUCTION OF CHAMBER CONTAMINANTS
- Publication number 20160133441
- Publication date May 12, 2016
- Applied Materials, Inc.
- JONATHAN GERMAIN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF PATTERNING A LOW-K DIELECTRIC FILM
- Publication number 20150380215
- Publication date Dec 31, 2015
- Srinivas D. Nemani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR ETCHING A DIELECTRIC BARRIER LAYER IN A DUAL DAMASCENE...
- Publication number 20150214101
- Publication date Jul 30, 2015
- Applied Materials, Inc.
- He REN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECESSING ULTRA-LOW K DIELECTRIC USING REMOTE PLASMA SOURCE
- Publication number 20150200042
- Publication date Jul 16, 2015
- Applied Materials, Inc.
- Mang Mang Ling
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR BARRIER LAYER REMOVAL
- Publication number 20150140827
- Publication date May 21, 2015
- Applied Materials, Inc.
- Chia-Ling KAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR ETCHING AN ETCHING STOP LAYER UTILIZING A CYCLICAL ETCH...
- Publication number 20150079798
- Publication date Mar 19, 2015
- Applied Materials, Inc.
- Mang-Mang LING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW TEMPERATURE PLASMA ANNEAL PROCESS FOR SUBLIMATIVE ETCH PROCESSES
- Publication number 20150064921
- Publication date Mar 5, 2015
- Applied Materials, Inc.
- Srinivas D. NEMANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FORMING FEATURES IN A MATERIAL LAYER UTILIZING A COMBIN...
- Publication number 20150056814
- Publication date Feb 26, 2015
- Applied Materials, Inc.
- Mang-Mang LING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NEAR SURFACE ETCH SELECTIVITY ENHANCEMENT
- Publication number 20140342569
- Publication date Nov 20, 2014
- Applied Materials, Inc.
- Lina Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PATTERNING MAGNETIC MEMORY
- Publication number 20140308758
- Publication date Oct 16, 2014
- Srinivas D. Nemani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PATTERNING A SILICON NITRIDE DIELECTRIC FILM
- Publication number 20140199851
- Publication date Jul 17, 2014
- Applied Materials, Inc.
- Srinivas D. Nemani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEM FOR ETCHING PLURAL LAYERS ON A WORKPIECE INCLUDIN...
- Publication number 20140170856
- Publication date Jun 19, 2014
- Srinivas D. Nemani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PATTERNING A LOW-K DIELECTRIC FILM
- Publication number 20140120726
- Publication date May 1, 2014
- Srinivas D. Nemani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PATTERNING A LOW-K DIELECTRIC FILM
- Publication number 20140017898
- Publication date Jan 16, 2014
- Srinivas D. Nemani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PATTERNING A LOW-K DIELECTRIC FILM
- Publication number 20130040464
- Publication date Feb 14, 2013
- Yifeng Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF REMOVING A PHOTORESIST FROM A LOW-K DIELECTRIC FILM
- Publication number 20130023123
- Publication date Jan 24, 2013
- Yifeng Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PATTERNING A LOW-K DIELECTRIC FILM
- Publication number 20120077344
- Publication date Mar 29, 2012
- Yifeng Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR ETCHING SILICON-BASED ANTIREFLECTIVE LAYERS
- Publication number 20110253670
- Publication date Oct 20, 2011
- Applied Materials, Inc.
- YIFENG ZHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA-BASED ORGANIC MASK REMOVAL WITH SILICON FLUORIDE
- Publication number 20110079918
- Publication date Apr 7, 2011
- Applied Materials, Inc.
- Yifeng ZHOU
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
METHOD FOR FABRICATING INTERCONNECT STRUCTURES FOR SEMICONDUCTOR DE...
- Publication number 20100078825
- Publication date Apr 1, 2010
- Ryan James Patz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PHOTORESIST REMOVAL IN THE PRESENCE OF A LOW-K DIELECTRIC...
- Publication number 20100043821
- Publication date Feb 25, 2010
- Siyi Li
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
METHOD FOR PLASMA ETCHING POROUS LOW-K DIELECTRIC LAYERS
- Publication number 20100022091
- Publication date Jan 28, 2010
- SIYI LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR DETERMINING PLASMA CHARACTERISTICS
- Publication number 20090132189
- Publication date May 21, 2009
- Steven C. Shannon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MONITORING PROCESS DRIFT USING PLASMA CHARACTERISTICS
- Publication number 20090130856
- Publication date May 21, 2009
- Steven C. Shannon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Chamber recovery after opening barrier over copper
- Publication number 20080050922
- Publication date Feb 28, 2008
- Applied Materials, Inc.
- Hairong Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR DETERMINING PLASMA CHARACTERISTICS
- Publication number 20070294043
- Publication date Dec 20, 2007
- Steven C. Shannon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR DETERMINING PLASMA CHARACTERISTICS
- Publication number 20070289359
- Publication date Dec 20, 2007
- Steven C. Shannon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SELECTIVE ETCH PROCESS OF A SACRIFICIAL LIGHT ABSORBING MATERIAL (S...
- Publication number 20070020944
- Publication date Jan 25, 2007
- Applied Materials, Inc.
- Hee Yeop Chae
- H01 - BASIC ELECTRIC ELEMENTS

Jeremiah T. Pender

Person

Patents Grantslast 30 patents

Method of patterning a low-k dielectric film

Cyclic spacer etching process with improved profile control

Methods for forming features in a material layer utilizing a combin...

Methods for barrier layer removal

Cyclic spacer etching process with improved profile control

Methods for etching a dielectric barrier layer in a dual damascene...

Method of patterning a low-k dielectric film

Method of patterning a silicon nitride dielectric film

Method of removing a photoresist from a low-k dielectric film

Methods for etching an etching stop layer utilizing a cyclical etch...

Method and system for etching plural layers on a workpiece includin...

Method of patterning a low-k dielectric film

Silicon oxide recess etch

Method of patterning a low-K dielectric film

Method of patterning a low-k dielectric film

Method for fabricating interconnect structures for semiconductor de...

Method for monitoring process drift using plasma characteristics

Method for determining plasma characteristics

Chamber recovery after opening barrier over copper

Method for determining plasma characteristics

Selective etch process of a sacrificial light absorbing material (S...

Selective etch process of a sacrificial light absorbing material (S...

Method for determining plasma characteristics

Substrate cleaning process

Patents Applicationslast 30 patents

CYCLIC SPACER ETCHING PROCESS WITH IMPROVED PROFILE CONTROL

CYCLIC SPACER ETCHING PROCESS WITH IMPROVED PROFILE CONTROL

ETCH ENHANCEMENT VIA CONTROLLED INTRODUCTION OF CHAMBER CONTAMINANTS

METHOD OF PATTERNING A LOW-K DIELECTRIC FILM

METHODS FOR ETCHING A DIELECTRIC BARRIER LAYER IN A DUAL DAMASCENE...

RECESSING ULTRA-LOW K DIELECTRIC USING REMOTE PLASMA SOURCE

METHODS FOR BARRIER LAYER REMOVAL

METHODS FOR ETCHING AN ETCHING STOP LAYER UTILIZING A CYCLICAL ETCH...

LOW TEMPERATURE PLASMA ANNEAL PROCESS FOR SUBLIMATIVE ETCH PROCESSES

METHODS FOR FORMING FEATURES IN A MATERIAL LAYER UTILIZING A COMBIN...

NEAR SURFACE ETCH SELECTIVITY ENHANCEMENT

PATTERNING MAGNETIC MEMORY

METHOD OF PATTERNING A SILICON NITRIDE DIELECTRIC FILM

METHOD AND SYSTEM FOR ETCHING PLURAL LAYERS ON A WORKPIECE INCLUDIN...

METHOD OF PATTERNING A LOW-K DIELECTRIC FILM

METHOD OF PATTERNING A LOW-K DIELECTRIC FILM

METHOD OF PATTERNING A LOW-K DIELECTRIC FILM

METHOD OF REMOVING A PHOTORESIST FROM A LOW-K DIELECTRIC FILM

METHOD OF PATTERNING A LOW-K DIELECTRIC FILM

METHODS FOR ETCHING SILICON-BASED ANTIREFLECTIVE LAYERS

PLASMA-BASED ORGANIC MASK REMOVAL WITH SILICON FLUORIDE

METHOD FOR FABRICATING INTERCONNECT STRUCTURES FOR SEMICONDUCTOR DE...

METHOD OF PHOTORESIST REMOVAL IN THE PRESENCE OF A LOW-K DIELECTRIC...

METHOD FOR PLASMA ETCHING POROUS LOW-K DIELECTRIC LAYERS

METHOD FOR DETERMINING PLASMA CHARACTERISTICS

METHOD FOR MONITORING PROCESS DRIFT USING PLASMA CHARACTERISTICS

Chamber recovery after opening barrier over copper

METHOD FOR DETERMINING PLASMA CHARACTERISTICS

METHOD FOR DETERMINING PLASMA CHARACTERISTICS

SELECTIVE ETCH PROCESS OF A SACRIFICIAL LIGHT ABSORBING MATERIAL (S...