Jesse JONES

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Embedded die microelectronic device with molded component
- Patent number 12,087,700
- Issue date Sep 10, 2024
- Intel Corporation
- Srinivas Venkata Ramanuja Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lithographic cavity formation to enable EMIB bump pitch scaling
- Patent number 11,929,330
- Issue date Mar 12, 2024
- Intel Corporation
- Kristof Darmawikarta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Patternable die attach materials and processes for patterning
- Patent number 11,923,312
- Issue date Mar 5, 2024
- Intel Corporation
- Bai Nie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric filler material in conductive material that functions as...
- Patent number 11,527,484
- Issue date Dec 13, 2022
- Intel Corporation
- Jesse C. Jones
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lithographic cavity formation to enable EMIB bump pitch scaling
- Patent number 11,322,444
- Issue date May 3, 2022
- Intel Corporation
- Kristof Darmawikarta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded die microelectronic device with molded component
- Patent number 11,081,448
- Issue date Aug 3, 2021
- Intel Corporation
- Srinivas V. Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die placement and coupling apparatus
- Patent number 11,062,933
- Issue date Jul 13, 2021
- Intel Corporation
- Jesse C. Jones
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric filler material in conductive material that functions as...
- Patent number 10,847,471
- Issue date Nov 24, 2020
- Intel Corporation
- Jesse C. Jones
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MOLDING SYSTEM AND MOLDING METHOD
- Publication number 20250144857
- Publication date May 8, 2025
- Intel Corporation
- Zhixin XIE
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
MICROELECTRONIC ASSEMBLIES WITH EDGE STRESS REDUCTION IN GLASS CORES
- Publication number 20250112175
- Publication date Apr 3, 2025
- Intel Corporation
- Brandon C. Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS CORE PROTECTION USING PERIPHERAL BUFFER LAYERS
- Publication number 20250112136
- Publication date Apr 3, 2025
- Intel Corporation
- Bohan SHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRESS MITIGATION ARCHITECTURES FOR GLASS CORE SUBSTRATES
- Publication number 20250112140
- Publication date Apr 3, 2025
- Intel Corporation
- Rahul BHURE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-HEALING LINER FOR THROUGH GLASS VIA RELIABILITY
- Publication number 20250105119
- Publication date Mar 27, 2025
- Intel Corporation
- Yuqin LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID CORES INCLUDING ADHESIVE PROMOTION LAYERS AND RELATED METHODS
- Publication number 20250014954
- Publication date Jan 9, 2025
- Soham Agarwal
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
METHODS AND APPARATUS FOR PACKAGE SUBSTRATES WITH STACKS OF GLASS L...
- Publication number 20250006609
- Publication date Jan 2, 2025
- Intel Corporation
- Gang Duan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LITHOGRAPHIC CAVITY FORMATION TO ENABLE EMIB BUMP PITCH SCALING
- Publication number 20240243066
- Publication date Jul 18, 2024
- Intel Corporation
- Kristof DARMAWIKARTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LITHOGRAPHIC CAVITY FORMATION TO ENABLE EMIB BUMP PITCH SCALING
- Publication number 20240178145
- Publication date May 30, 2024
- Intel Corporation
- Kristof DARMAWIKARTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PATTERNABLE DIE ATTACH MATERIALS AND PROCESSES FOR PATTERNING
- Publication number 20240088052
- Publication date Mar 14, 2024
- Intel Corporation
- Bai NIE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LITHOGRAPHIC CAVITY FORMATION TO ENABLE EMIB BUMP PITCH SCALING
- Publication number 20220223527
- Publication date Jul 14, 2022
- Intel Corporation
- Kristof DARMAWIKARTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED DIE MICROELECTRONIC DEVICE WITH MOLDED COMPONENT
- Publication number 20210366835
- Publication date Nov 25, 2021
- Intel Corporation
- Srinivas Venkata Ramanuja Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELECTRIC FILLER MATERIAL IN CONDUCTIVE MATERIAL THAT FUNCTIONS AS...
- Publication number 20210043580
- Publication date Feb 11, 2021
- Intel Corporation
- Jesse C. Jones
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PATTERNABLE DIE ATTACH MATERIALS AND PROCESSES FOR PATTERNING
- Publication number 20200312771
- Publication date Oct 1, 2020
- Intel Corporation
- Bai NIE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIDUCIAL FOR AN ELECTRONIC DEVICE
- Publication number 20200027841
- Publication date Jan 23, 2020
- Intel Corporation
- Jesse C. Jones
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE PLACEMENT AND COUPLING APPARATUS
- Publication number 20200027775
- Publication date Jan 23, 2020
- Intel Corporation
- Jesse C. Jones
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
EMBEDDED DIE MICROELECTRONIC DEVICE WITH MOLDED COMPONENT
- Publication number 20190333861
- Publication date Oct 31, 2019
- Intel Corporation
- Srinivas V. Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LITHOGRAPHIC CAVITY FORMATION TO ENABLE EMIB BUMP PITCH SCALING
- Publication number 20190295951
- Publication date Sep 26, 2019
- Intel Corporation
- Kristof DARMAWIKARTA
- H01 - BASIC ELECTRIC ELEMENTS

Jesse JONES

Person

Patents Grantslast 30 patents

Embedded die microelectronic device with molded component

Lithographic cavity formation to enable EMIB bump pitch scaling

Patternable die attach materials and processes for patterning

Dielectric filler material in conductive material that functions as...

Lithographic cavity formation to enable EMIB bump pitch scaling

Embedded die microelectronic device with molded component

Die placement and coupling apparatus

Dielectric filler material in conductive material that functions as...

Patents Applicationslast 30 patents

MOLDING SYSTEM AND MOLDING METHOD

MICROELECTRONIC ASSEMBLIES WITH EDGE STRESS REDUCTION IN GLASS CORES

GLASS CORE PROTECTION USING PERIPHERAL BUFFER LAYERS

STRESS MITIGATION ARCHITECTURES FOR GLASS CORE SUBSTRATES

SELF-HEALING LINER FOR THROUGH GLASS VIA RELIABILITY

HYBRID CORES INCLUDING ADHESIVE PROMOTION LAYERS AND RELATED METHODS

METHODS AND APPARATUS FOR PACKAGE SUBSTRATES WITH STACKS OF GLASS L...

LITHOGRAPHIC CAVITY FORMATION TO ENABLE EMIB BUMP PITCH SCALING

LITHOGRAPHIC CAVITY FORMATION TO ENABLE EMIB BUMP PITCH SCALING

PATTERNABLE DIE ATTACH MATERIALS AND PROCESSES FOR PATTERNING

LITHOGRAPHIC CAVITY FORMATION TO ENABLE EMIB BUMP PITCH SCALING

EMBEDDED DIE MICROELECTRONIC DEVICE WITH MOLDED COMPONENT

DIELECTRIC FILLER MATERIAL IN CONDUCTIVE MATERIAL THAT FUNCTIONS AS...

PATTERNABLE DIE ATTACH MATERIALS AND PROCESSES FOR PATTERNING

FIDUCIAL FOR AN ELECTRONIC DEVICE

DIE PLACEMENT AND COUPLING APPARATUS

EMBEDDED DIE MICROELECTRONIC DEVICE WITH MOLDED COMPONENT

LITHOGRAPHIC CAVITY FORMATION TO ENABLE EMIB BUMP PITCH SCALING