Jhih-Wei LAI

Person

Taipei City, TW

People

Patents Applicationslast 30 patents

Information Patent Application
COMPOSITE CERAMIC SUBSTRATE HAVING MULTI-LAYER CONFIGURATION
- Publication number 20240360043
- Publication date Oct 31, 2024
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- Kai-Mou CHOU
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
CERAMIC METAL COMPOSITE SUBSTRATE
- Publication number 20240363482
- Publication date Oct 31, 2024
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- KAI-MOU CHOU
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
CERAMIC METAL COMPOSITE SUBSTRATE
- Publication number 20240363479
- Publication date Oct 31, 2024
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- KAI-MOU CHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING CONDUCTIVE CIRCUIT BOARD AND CONDUCTIVE CI...
- Publication number 20240365473
- Publication date Oct 31, 2024
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- YU-HSIEN LIAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CERAMIC SUBMOUNT FOR SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTUR...
- Publication number 20240304461
- Publication date Sep 12, 2024
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- CHENG-HUNG SHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD FOR MAKING THE SAME
- Publication number 20240284592
- Publication date Aug 22, 2024
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- CHENG-YU CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD STRUCTURE WITH EMBEDDED CERAMIC SUBSTRATE AND MANUFAC...
- Publication number 20240276636
- Publication date Aug 15, 2024
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- Yu-Hsien LIAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20240276650
- Publication date Aug 15, 2024
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- Yu-Hsien LIAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CHIP PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME
- Publication number 20240088049
- Publication date Mar 14, 2024
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- DEI-CHENG LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME
- Publication number 20240071776
- Publication date Feb 29, 2024
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- DEI-CHENG LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING CONDUCTIVE CIRCUIT BOARD AND CONDUCTIVE CI...
- Publication number 20240032204
- Publication date Jan 25, 2024
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- Yueh-Kai TANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Jhih-Wei LAI

Person

Patents Applicationslast 30 patents

COMPOSITE CERAMIC SUBSTRATE HAVING MULTI-LAYER CONFIGURATION

CERAMIC METAL COMPOSITE SUBSTRATE

CERAMIC METAL COMPOSITE SUBSTRATE

METHOD FOR MANUFACTURING CONDUCTIVE CIRCUIT BOARD AND CONDUCTIVE CI...

CERAMIC SUBMOUNT FOR SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTUR...

PRINTED CIRCUIT BOARD AND METHOD FOR MAKING THE SAME

CIRCUIT BOARD STRUCTURE WITH EMBEDDED CERAMIC SUBSTRATE AND MANUFAC...

CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

CHIP PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME

CHIP PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME

METHOD FOR MANUFACTURING CONDUCTIVE CIRCUIT BOARD AND CONDUCTIVE CI...