Membership
Tour
Register
Log in
Jihperng Leu
Follow
Person
Portland, OR, US
People
Overview
Industries
Organizations
People
Information
Impact
Patents Grants
last 30 patents
Information
Patent Grant
Method and apparatus for forming metal-metal oxide etch stop/barrie...
Patent number
8,299,617
Issue date
Oct 30, 2012
Intel Corporation
Xiaorong Morrow
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method and apparatus for forming metal-metal oxide etch stop/barrie...
Patent number
7,727,892
Issue date
Jun 1, 2010
Intel Corporation
Xiaorong Morrow
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Formation of interconnect structures by removing sacrificial materi...
Patent number
7,466,025
Issue date
Dec 16, 2008
Intel Corporation
Michael D. Goodner
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Mechanically robust dielectric film and stack
Patent number
7,348,283
Issue date
Mar 25, 2008
Intel Corporation
Jihperng Leu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Metal-metal oxide etch stop/barrier for integrated circuit intercon...
Patent number
7,339,271
Issue date
Mar 4, 2008
Intel Corporation
Xiaorong Morrow
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device using an interconnect
Patent number
7,320,935
Issue date
Jan 22, 2008
Intel Corporation
Jihperng Leu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Low-K dielectric structure and method
Patent number
7,294,934
Issue date
Nov 13, 2007
Intel Corporation
Grant M. Kloster
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Selectively converted inter-layer dielectric
Patent number
7,239,019
Issue date
Jul 3, 2007
Intel Corporation
Jihperng Leu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of making semiconductor device using a novel interconnect cl...
Patent number
7,214,594
Issue date
May 8, 2007
Intel Corporation
Lawrence D. Wong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Mechanically robust interconnect for low-k dielectric material usin...
Patent number
7,175,970
Issue date
Feb 13, 2007
Intel Corporation
Jun He
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Structure in a microelectronic device including a bi-layer for a di...
Patent number
7,164,206
Issue date
Jan 16, 2007
Intel Corporation
Grant Kloster
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Low-k dielectric film with good mechanical strength that varies in...
Patent number
7,145,245
Issue date
Dec 5, 2006
Intel Corporation
Grant Kloster
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of forming a selectively converted inter-layer dielectric us...
Patent number
7,018,918
Issue date
Mar 28, 2006
Intel Corporation
Grant M. Kloster
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Mechanically robust interconnect for low-k dielectric material usin...
Patent number
6,998,216
Issue date
Feb 14, 2006
Intel Corporation
Jun He
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Dual-damascene interconnects without an etch stop layer by alternat...
Patent number
6,992,391
Issue date
Jan 31, 2006
Intel Corporation
Andrew Ott
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Low-k dielectric film with good mechanical strength
Patent number
6,964,919
Issue date
Nov 15, 2005
Intel Corporation
Grant Kloster
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Selectively converted inter-layer dielectric
Patent number
6,943,121
Issue date
Sep 13, 2005
Intel Corporation
Jihperng Leu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Formation of interconnect structures by removing sacrificial materi...
Patent number
6,924,222
Issue date
Aug 2, 2005
Intel Corporation
Michael D. Goodner
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device having a region of a material which is vaporiz...
Patent number
6,903,461
Issue date
Jun 7, 2005
Intel Corporation
Grant M. Kloster
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Creating air gap in multi-level metal interconnects using electron...
Patent number
6,867,125
Issue date
Mar 15, 2005
Intel Corporation
Grant Kloster
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bonding a metal component to a low-k dielectric material
Patent number
6,846,755
Issue date
Jan 25, 2005
Intel Corporation
Grant M. Kloster
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Surface alteration of metal interconnect in integrated circuits for...
Patent number
6,794,755
Issue date
Sep 21, 2004
Intel Corporation
Jose A. Maiz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of making a semiconductor device by forming a masking layer...
Patent number
6,743,712
Issue date
Jun 1, 2004
Intel Corporation
Hyun-Mog Park
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of forming an air gap within a structure by exposing an ultr...
Patent number
6,734,094
Issue date
May 11, 2004
Intel Corporation
Grant M. Kloster
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Dielectric material treatment
Patent number
6,734,118
Issue date
May 11, 2004
Intel Corporation
Grant M. Kloster
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for improving nucleation and adhesion of CVD and ALD films d...
Patent number
6,605,549
Issue date
Aug 12, 2003
Intel Corporation
Jihperng Leu
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Method of making semiconductor device using an interconnect
Patent number
6,605,874
Issue date
Aug 12, 2003
Intel Corporation
Jihperng Leu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for making a dual damascene interconnect using a multilayer...
Patent number
6,479,391
Issue date
Nov 12, 2002
Intel Corporation
Patrick Morrow
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
METHOD AND APPARATUS FOR FORMING METAL-METAL OXIDE ETCH STOP/BARRIE...
Publication number
20100219529
Publication date
Sep 2, 2010
Xiaorong Morrow
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Mechanically robust dielectric film and stack
Publication number
20060138665
Publication date
Jun 29, 2006
Jihperng Leu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Mechanically robust interconnect for low-k dielectric material usin...
Publication number
20060073416
Publication date
Apr 6, 2006
Jun He
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Low-K dielectric film with good mechanical strength that varies in...
Publication number
20060009031
Publication date
Jan 12, 2006
Grant Kloster
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Porous ceramic materials as low-k films in semiconductor devices
Publication number
20050287787
Publication date
Dec 29, 2005
Grant M. Kloster
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Low-k dielectric structure and method
Publication number
20050272248
Publication date
Dec 8, 2005
Grant M. Kloster
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Selectively converted inter-layer dielectric
Publication number
20050236714
Publication date
Oct 27, 2005
Jihperng Leu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Interconnect adapted for reduced electron scattering
Publication number
20050224980
Publication date
Oct 13, 2005
Jihperng Leu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Dual-damascene interconnects without an etch stop layer by alternat...
Publication number
20050208753
Publication date
Sep 22, 2005
Andrew Ott
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Formation of interconnect structures by removing sacrificial materi...
Publication number
20050179140
Publication date
Aug 18, 2005
Michael D. Goodner
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SELECTIVELY CONVERTED INTER-LAYER DIELECTRIC
Publication number
20050181593
Publication date
Aug 18, 2005
Jihperng Leu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Creating air gap in multi-level metal interconnects using electron...
Publication number
20050164489
Publication date
Jul 28, 2005
Grant Kloster
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Bonding a metal component to a low-K dielectric material
Publication number
20050095743
Publication date
May 5, 2005
Grant M. Kloster
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method and structure for selective surface passivation
Publication number
20050087873
Publication date
Apr 28, 2005
Chih-I Wu
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
Method and apparatus for forming metal-metal oxide etch stop/barrie...
Publication number
20040224515
Publication date
Nov 11, 2004
Xiaorong Morrow
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Bonding a metal component to a low-k dielectric material
Publication number
20040161532
Publication date
Aug 19, 2004
Grant M. Kloster
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Forming openings within integrated circuits
Publication number
20040132276
Publication date
Jul 8, 2004
Grant M. Kloster
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method and structure for selective surface passivation
Publication number
20040126482
Publication date
Jul 1, 2004
Chih-I Wu
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
Method of making semiconductor devices using carbon nitride, a low-...
Publication number
20040119163
Publication date
Jun 24, 2004
Lawrence Wong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Formation of interconnect structures by removing sacrificial materi...
Publication number
20040099952
Publication date
May 27, 2004
Michael D. Goodner
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Low-K dielectric structure and method
Publication number
20040102031
Publication date
May 27, 2004
Grant M. Kloster
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Selectively converted inter-layer dielectric
Publication number
20040102032
Publication date
May 27, 2004
Grant M. Kloster
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Creating air gap in multi-level metal interconnects using electron...
Publication number
20040063305
Publication date
Apr 1, 2004
Grant Kloster
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method and apparatus for forming metal-metal oxide etch stop/barrie...
Publication number
20040058547
Publication date
Mar 25, 2004
Xiaorong Morrow
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Mechanically robust interconnect for low-k dielectric material usin...
Publication number
20040058277
Publication date
Mar 25, 2004
Jun He
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
A METHOD OF FORMING SURFACE ALTERATION OF METAL INTERCONNECT IN INT...
Publication number
20040056366
Publication date
Mar 25, 2004
Jose A. Maiz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Surface alteration of metal interconnect in integrated circuits for...
Publication number
20040056329
Publication date
Mar 25, 2004
Jose A. Maiz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DIELECTRIC MATERIAL TREATMENT
Publication number
20040056354
Publication date
Mar 25, 2004
Grant M. Kloster
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor device using an interconnect
Publication number
20040026786
Publication date
Feb 12, 2004
Intel Corporation
Jihperng Leu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Low-k dielectric film with good mechanical strength
Publication number
20040026783
Publication date
Feb 12, 2004
Grant Kloster
H01 - BASIC ELECTRIC ELEMENTS