Jing Xie

Person

University Park, PA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Power distribution networks for a three-dimensional (3D) integrated...
- Patent number 10,121,743
- Issue date Nov 6, 2018
- QUALCOMM Incorporated
- Pratyush Kamal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connection propagation for inter-logical block connections in integ...
- Patent number 9,929,733
- Issue date Mar 27, 2018
- QUALCOMM Incorporated
- Pratyush Kamal
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Microelectromechanical system (MEMS) bond release structure and met...
- Patent number 9,922,956
- Issue date Mar 20, 2018
- QUALCOMM Incorporated
- Je-Hsiung Jeffrey Lan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power gate placement techniques in three-dimensional (3D) integrate...
- Patent number 9,754,923
- Issue date Sep 5, 2017
- QUALCOMM Incorporated
- Jing Xie
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Dual power swing pipeline design with separation of combinational a...
- Patent number 9,628,077
- Issue date Apr 18, 2017
- Qualcomm Incorporated
- Jing Xie
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Three-dimensional (3D) memory cell separation among 3D integrated c...
- Patent number 9,583,179
- Issue date Feb 28, 2017
- QUALCOMM Incorporated
- Jing Xie
- G11 - INFORMATION STORAGE
Information Patent Grant
Three-dimensional (3D) memory cell separation among 3D integrated c...
- Patent number 9,171,608
- Issue date Oct 27, 2015
- QUALCOMM Incorporated
- Jing Xie
- G11 - INFORMATION STORAGE
Information Patent Grant
Clock distribution network for 3D integrated circuit
- Patent number 9,098,666
- Issue date Aug 4, 2015
- QUALCOMM Incorporated
- Kambiz Samadi
- G11 - INFORMATION STORAGE
Information Patent Grant
Flip-flops in a monolithic three-dimensional (3D) integrated circui...
- Patent number 9,041,448
- Issue date May 26, 2015
- QUALCOMM Incorporated
- Yang Du
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Data transfer across power domains
- Patent number 8,984,463
- Issue date Mar 17, 2015
- QUALCOMM Incorporated
- Jing Xie
- G11 - INFORMATION STORAGE

Patents Applicationslast 30 patents

Information Patent Application
POWER DISTRIBUTION NETWORKS FOR A THREE-DIMENSIONAL (3D) INTEGRATED...
- Publication number 20190027435
- Publication date Jan 24, 2019
- QUALCOMM Incorporated
- Pratyush Kamal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER DISTRIBUTION NETWORKS FOR A THREE-DIMENSIONAL (3D) INTEGRATED...
- Publication number 20180286800
- Publication date Oct 4, 2018
- QUALCOMM Incorporated
- Pratyush Kamal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LEVEL CONVERSION FLIP-FLOP CIRCUITS FOR MULTI-POWER DOMAIN IN...
- Publication number 20160285439
- Publication date Sep 29, 2016
- QUALCOMM Incorporated
- Jing XIE
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
DUAL POWER SWING PIPELINE DESIGN WITH SEPARATION OF COMBINATIONAL A...
- Publication number 20160261269
- Publication date Sep 8, 2016
- QUALCOMM Incorporated
- Jing XIE
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
MICROELECTROMECHANICAL SYSTEM (MEMS) BOND RELEASE STRUCTURE AND MET...
- Publication number 20160093591
- Publication date Mar 31, 2016
- QUALCOMM Incorporated
- Je-Hsiung Jeffrey LAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL (3D) MEMORY CELL SEPARATION AMONG 3D INTEGRATED C...
- Publication number 20150302919
- Publication date Oct 22, 2015
- QUALCOMM Incorporated
- Jing Xie
- G11 - INFORMATION STORAGE
Information Patent Application
THREE-DIMENSIONAL (3D) MEMORY CELL SEPARATION AMONG 3D INTEGRATED C...
- Publication number 20140269022
- Publication date Sep 18, 2014
- Jing Xie
- G11 - INFORMATION STORAGE
Information Patent Application
FLIP-FLOPS IN A MONOLITHIC THREE-DIMENSIONAL (3D) INTEGRATED CIRCUI...
- Publication number 20140253196
- Publication date Sep 11, 2014
- QUALCOMM Incorporated
- Yang Du
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DATA TRANSFER ACROSS POWER DOMAINS
- Publication number 20140146630
- Publication date May 29, 2014
- QUALCOMM Incorporated
- Jing Xie
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CLOCK DISTRIBUTION NETWORK FOR 3D INTEGRATED CIRCUIT
- Publication number 20140145347
- Publication date May 29, 2014
- QUALCOMM Incorporated
- Kambiz Samadi
- G06 - COMPUTING CALCULATING COUNTING

Person

Patents Grantslast 30 patents

Power distribution networks for a three-dimensional (3D) integrated...

Connection propagation for inter-logical block connections in integ...

Microelectromechanical system (MEMS) bond release structure and met...

Power gate placement techniques in three-dimensional (3D) integrate...

Dual power swing pipeline design with separation of combinational a...

Three-dimensional (3D) memory cell separation among 3D integrated c...

Three-dimensional (3D) memory cell separation among 3D integrated c...

Clock distribution network for 3D integrated circuit

Flip-flops in a monolithic three-dimensional (3D) integrated circui...

Data transfer across power domains

Patents Applicationslast 30 patents

POWER DISTRIBUTION NETWORKS FOR A THREE-DIMENSIONAL (3D) INTEGRATED...

POWER DISTRIBUTION NETWORKS FOR A THREE-DIMENSIONAL (3D) INTEGRATED...

MULTI-LEVEL CONVERSION FLIP-FLOP CIRCUITS FOR MULTI-POWER DOMAIN IN...

DUAL POWER SWING PIPELINE DESIGN WITH SEPARATION OF COMBINATIONAL A...

MICROELECTROMECHANICAL SYSTEM (MEMS) BOND RELEASE STRUCTURE AND MET...

THREE-DIMENSIONAL (3D) MEMORY CELL SEPARATION AMONG 3D INTEGRATED C...

THREE-DIMENSIONAL (3D) MEMORY CELL SEPARATION AMONG 3D INTEGRATED C...

FLIP-FLOPS IN A MONOLITHIC THREE-DIMENSIONAL (3D) INTEGRATED CIRCUI...

DATA TRANSFER ACROSS POWER DOMAINS

CLOCK DISTRIBUTION NETWORK FOR 3D INTEGRATED CIRCUIT