Jitsuo Kanazawa

Person

Chuo-ku, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Light emitting apparatus
- Patent number 7,671,468
- Issue date Mar 2, 2010
- TDK Corporation
- Jitsuo Kanazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device
- Patent number 7,505,239
- Issue date Mar 17, 2009
- TDK Corporation
- Jitsuo Kanazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device
- Patent number 7,355,251
- Issue date Apr 8, 2008
- TDK Corporation
- Jitsuo Kanazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Production method of electronic parts and water treatment apparatus
- Patent number 6,749,183
- Issue date Jun 15, 2004
- TDK Corporation
- Masashi Gotoh
- C02 - TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
Information Patent Grant
Circuit board having bonding areas to be joined with bumps by ultra...
- Patent number 6,730,858
- Issue date May 4, 2004
- TDK Corporation
- Masashi Gotoh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ultrasonic bonding method
- Patent number 6,565,687
- Issue date May 20, 2003
- TDK Corporation
- Masashi Gotoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Production method of electronic parts and water treatment apparatus
- Patent number 6,471,783
- Issue date Oct 29, 2002
- TDK Corporation
- Masashi Gotoh
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Ultrasonic bonding method and ultrasonic bonding apparatus
- Patent number 6,460,591
- Issue date Oct 8, 2002
- TDK Corporation
- Masashi Gotoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Acoustic wave device face-down mounted on a substrate
- Patent number 6,417,026
- Issue date Jul 9, 2002
- TDK Corporation
- Masashi Gotoh
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Chip junction nozzle
- Patent number 6,382,495
- Issue date May 7, 2002
- TDK Corporation
- Masashi Gotoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic part and manufacturing method therefor
- Patent number 6,320,739
- Issue date Nov 20, 2001
- TDK Corporation
- Masashi Gotoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin package fabrication process
- Patent number 6,282,781
- Issue date Sep 4, 2001
- TDK Corporation
- Masashi Gotoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulated surface mounting electronic part
- Patent number 6,281,436
- Issue date Aug 28, 2001
- TDK Corporation
- Masashi Gotoh
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Method of manufacturing a substrate having electrode arcs for conne...
- Patent number 6,263,565
- Issue date Jul 24, 2001
- TDK Corporation
- Masashi Gotoh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and process for the production thereof
- Patent number 6,204,454
- Issue date Mar 20, 2001
- TDK Corporation
- Masashi Gotoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip junction nozzle
- Patent number 6,189,760
- Issue date Feb 20, 2001
- TDK Corporation
- Masashi Gotoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Face-down mounted surface acoustic wave device
- Patent number 6,181,015
- Issue date Jan 30, 2001
- TDK Corporation
- Masashi Gotoh
- H03 - BASIC ELECTRONIC CIRCUITRY

Patents Applicationslast 30 patents

Information Patent Application
Light emitting device
- Publication number 20070081288
- Publication date Apr 12, 2007
- TDK Corporation
- Jitsuo Kanazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Light emitting apparatus
- Publication number 20070075323
- Publication date Apr 5, 2007
- TDK Corporation
- Jitsuo Kanazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Light emitting device
- Publication number 20060232373
- Publication date Oct 19, 2006
- TDK Corporation
- Jitsuo Kanazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ultrasonic bonding method
- Publication number 20030029543
- Publication date Feb 13, 2003
- TDK Corp.
- Masashi Gotoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Production method of electronic parts and water treatment apparatus
- Publication number 20030006513
- Publication date Jan 9, 2003
- TDK Corporation
- Masashi Gotoh
- C01 - INORGANIC CHEMISTRY
Information Patent Application
Electronic part and manufacturing method therefor
- Publication number 20020014687
- Publication date Feb 7, 2002
- TDK Corporation
- Masashi Gotoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD HAVING BONDING AREAS TO BE JOINED WITH BUMPS BY ULTRA...
- Publication number 20010018982
- Publication date Sep 6, 2001
- MASASHI GOTOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip junction nozzle
- Publication number 20010011668
- Publication date Aug 9, 2001
- TDK CORPORATION 13-1, Nihonbashi 1-chome, Chuo-ku, Tokyo, Japan
- Masashi Gotoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip device and method for producing the same
- Publication number 20010001293
- Publication date May 17, 2001
- TDK Corporation
- Masashi Gotoh
- H01 - BASIC ELECTRIC ELEMENTS

Jitsuo Kanazawa

Person

Patents Grantslast 30 patents

Light emitting apparatus

Light emitting device

Light emitting device

Production method of electronic parts and water treatment apparatus

Circuit board having bonding areas to be joined with bumps by ultra...

Ultrasonic bonding method

Production method of electronic parts and water treatment apparatus

Ultrasonic bonding method and ultrasonic bonding apparatus

Acoustic wave device face-down mounted on a substrate

Chip junction nozzle

Electronic part and manufacturing method therefor

Resin package fabrication process

Encapsulated surface mounting electronic part

Method of manufacturing a substrate having electrode arcs for conne...

Wiring board and process for the production thereof

Chip junction nozzle

Face-down mounted surface acoustic wave device

Patents Applicationslast 30 patents

Light emitting device

Light emitting apparatus

Light emitting device

Ultrasonic bonding method

Production method of electronic parts and water treatment apparatus

Electronic part and manufacturing method therefor

CIRCUIT BOARD HAVING BONDING AREAS TO BE JOINED WITH BUMPS BY ULTRA...

Chip junction nozzle

Chip device and method for producing the same