Claims
- 1. An ultrasonic bonding method arranged to mount a chip device on a resin substrate by performing ultrasonic bonding such that the position of a connecting electrode of the chip device is aligned to the position of a circuit electrode provided for a resin substrate having elastic modulus εr at room temperature and elastic modulus εh, realized when said resin substrate is heated, said ultrasonic bonding method comprising:heating said resin substrate to a temperature at which the ratio of the elastic modulus εr at room temperature and the elastic modulus εh realized after heating satisfies 1>εh/εr≧0.5 when said circuit electrode and said connecting electrode are ultrasonic-bonded to each other.
- 2. An ultrasonic bonding method according to claim 1, wherein temperature raised when said resin substrate is ultrasonic-bonded satisfies a range from 80° C. to 170° C.
- 3. An ultrasonic bonding method according to claim 1, wherein an amount of amplitude of ultrasonic waves arranged to be imparted on said chip device when said ultrasonic bonding operation is performed satisfies a range from 0.8 μm to 1.6 μm.
- 4. An ultrasonic bonding method according to claim 1, wherein said chip device is a surface acoustic wave device having a dielectric substrate, and said connecting electrode is a bump electrode formed on said dielectric substrate and made of gold or a gold alloy.
- 5. An ultrasonic bonding method according to claim 1, wherein said resin substrate is a thermosetting resin substrate, and said circuit electrode is constituted by forming a plated layer on the surface of a copper foil pattern, and the uppermost layer of said plated layer is made of gold.
Priority Claims (1)
Number |
Date |
Country |
Kind |
11-113213 |
Apr 1999 |
JP |
|
CROSS-REFERENCE TO RELATED APPLICATIONS
This application is a divisional of, and claims priority to U.S. patent Ser. No. 09/544,601, filed Apr. 6, 2000, U.S. Pat. No. 6,460,591 and claims priority to Japanese Application No. 11-113213, filed Apr. 21, 1999. The entire contents of the parent application and the Japanese application are incorporated herein by reference.
US Referenced Citations (5)