Jochen Thomas

Person

Regensburg, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor component comprising an interposer substrate
- Patent number 8,624,372
- Issue date Jan 7, 2014
- Infineon Technologies AG
- Wolfgang Hetzel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with plastic package molding compound, semicon...
- Patent number 8,072,085
- Issue date Dec 6, 2011
- Qimonda AG
- Wolfgang Hetzel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit with re-route layer and stacked die assembly
- Patent number 7,948,071
- Issue date May 24, 2011
- Qimonda AG
- Jochen Thomas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip ball grid array package and method of manufacture
- Patent number 7,851,899
- Issue date Dec 14, 2010
- UTAC - United Test and Assembly Test Center Ltd.
- Fung Leng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit chip and integrated device
- Patent number 7,456,505
- Issue date Nov 25, 2008
- Infineon Technologies AG
- Minka Gospodinova
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit with re-route layer and stacked die assembly
- Patent number 7,422,930
- Issue date Sep 9, 2008
- Infineon Technologies AG
- Jochen Thomas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip device and method for producing a multi-chip device
- Patent number 7,402,911
- Issue date Jul 22, 2008
- Infineon Technologies AG
- Jochen Thomas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module having an internal semiconductor chip stack, a...
- Patent number 7,352,057
- Issue date Apr 1, 2008
- Infineon Technologies AG
- Jurgen Grafe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a rewiring level and method for producing...
- Patent number 7,345,363
- Issue date Mar 18, 2008
- Infineon Technologies AG
- Minka Gospodinova-Daltcheva
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip device and method for producing a multi-chip device
- Patent number 7,297,574
- Issue date Nov 20, 2007
- Infineon Technologies AG
- Jochen Thomas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component with multilayered rewiring plate and method fo...
- Patent number 7,294,910
- Issue date Nov 13, 2007
- Infineon Technologies AG
- Jochen Thomas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-supporting connecting element for a semiconductor chip
- Patent number 7,253,514
- Issue date Aug 7, 2007
- Infineon Technologies, AG
- Anton Legen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a stack arrangement of a memory module
- Patent number 7,198,979
- Issue date Apr 3, 2007
- Infineon Technologies AG
- Jochen Thomas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
FBGA arrangement
- Patent number 7,023,097
- Issue date Apr 4, 2006
- Infineon Technologies AG
- Jochen Thomas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component having stacked semiconductor chips in parallel...
- Patent number 6,977,427
- Issue date Dec 20, 2005
- Infineon Technologies AG
- Wolfgang Hetzel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack arrangement of a memory module
- Patent number 6,927,484
- Issue date Aug 9, 2005
- Infineon Technologies AG
- Jochen Thomas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device having a stack of semiconductor chips and method...
- Patent number 6,894,381
- Issue date May 17, 2005
- Infineon Technologies AG
- Wolfgang Hetzel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component with stacked electronic elements
- Patent number 6,768,191
- Issue date Jul 27, 2004
- Infineon Technologies AG
- Ingo Wennemuth
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE WITH PLASTIC PACKAGE MOLDING COMPOUND, SEMICON...
- Publication number 20100032817
- Publication date Feb 11, 2010
- Wolfgang Hetzel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit with Re-Route Layer and Stacked Die Assembly
- Publication number 20080203575
- Publication date Aug 28, 2008
- Jochen Thomas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT
- Publication number 20080203581
- Publication date Aug 28, 2008
- QIMONDA AG
- Jochen Thomas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die arrangement and method for producing a die arrangement
- Publication number 20080079150
- Publication date Apr 3, 2008
- Juergen Simon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated device having a plurality of chip arrangements and metho...
- Publication number 20070210433
- Publication date Sep 13, 2007
- Rajesh Subraya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-chip ball grid array package and method of manufacture
- Publication number 20070158815
- Publication date Jul 12, 2007
- Fung Leng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated chip device in a package
- Publication number 20070090527
- Publication date Apr 26, 2007
- Jochen Thomas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor component comprising an interposer substrate and meth...
- Publication number 20070040261
- Publication date Feb 22, 2007
- Wolfgang Hetzel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated circuit chip and integrated device
- Publication number 20070023898
- Publication date Feb 1, 2007
- Minka Gospodinova
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-chip device and method for producing a multi-chip device
- Publication number 20060290005
- Publication date Dec 28, 2006
- Jochen Thomas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-chip device and method for producing a multi-chip device
- Publication number 20060286822
- Publication date Dec 21, 2006
- Jochen Thomas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device with a rewiring level and method for producing...
- Publication number 20060244120
- Publication date Nov 2, 2006
- Minka Gospodinova-Daltcheva
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor module having an internal semiconductor chip stack, a...
- Publication number 20060091518
- Publication date May 4, 2006
- Jurgen Grafe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic component comprising a multilayer wiring frame and metho...
- Publication number 20060043539
- Publication date Mar 2, 2006
- Jochen Thomas
- B82 - NANO-TECHNOLOGY
Information Patent Application
Integrated circuit with re-route layer and stacked die assembly
- Publication number 20050194674
- Publication date Sep 8, 2005
- Jochen Thomas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Connecting elements on semiconductor chips for semiconductor compon...
- Publication number 20050156308
- Publication date Jul 21, 2005
- Anton Legen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FBGA arrangement
- Publication number 20050098870
- Publication date May 12, 2005
- Jochen Thomas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic device having a stack of semiconductor chips and method...
- Publication number 20040159954
- Publication date Aug 19, 2004
- Infineon Technologies AG
- Wolfgang Hetzel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for manufacturing a stack arrangement of a memory module
- Publication number 20040126910
- Publication date Jul 1, 2004
- Jochen Thomas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stack arrangement of a memory module
- Publication number 20040113256
- Publication date Jun 17, 2004
- Jochen Thomas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic component having stacked semiconductor chips in parallel...
- Publication number 20040108585
- Publication date Jun 10, 2004
- Wolfgang Hetzel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic component with stacked electronic elements and method fo...
- Publication number 20030030143
- Publication date Feb 13, 2003
- Ingo Wennemuth
- H01 - BASIC ELECTRIC ELEMENTS

Jochen Thomas

Person

Patents Grantslast 30 patents

Semiconductor component comprising an interposer substrate

Semiconductor device with plastic package molding compound, semicon...

Integrated circuit with re-route layer and stacked die assembly

Multi-chip ball grid array package and method of manufacture

Integrated circuit chip and integrated device

Integrated circuit with re-route layer and stacked die assembly

Multi-chip device and method for producing a multi-chip device

Semiconductor module having an internal semiconductor chip stack, a...

Semiconductor device with a rewiring level and method for producing...

Multi-chip device and method for producing a multi-chip device

Electronic component with multilayered rewiring plate and method fo...

Self-supporting connecting element for a semiconductor chip

Method for manufacturing a stack arrangement of a memory module

FBGA arrangement

Electronic component having stacked semiconductor chips in parallel...

Stack arrangement of a memory module

Electronic device having a stack of semiconductor chips and method...

Electronic component with stacked electronic elements

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE WITH PLASTIC PACKAGE MOLDING COMPOUND, SEMICON...

Integrated Circuit with Re-Route Layer and Stacked Die Assembly

INTEGRATED CIRCUIT

Die arrangement and method for producing a die arrangement

Integrated device having a plurality of chip arrangements and metho...

Multi-chip ball grid array package and method of manufacture

Integrated chip device in a package

Semiconductor component comprising an interposer substrate and meth...

Integrated circuit chip and integrated device

Multi-chip device and method for producing a multi-chip device

Multi-chip device and method for producing a multi-chip device

Semiconductor device with a rewiring level and method for producing...

Semiconductor module having an internal semiconductor chip stack, a...

Electronic component comprising a multilayer wiring frame and metho...

Integrated circuit with re-route layer and stacked die assembly

Connecting elements on semiconductor chips for semiconductor compon...

FBGA arrangement

Electronic device having a stack of semiconductor chips and method...

Method for manufacturing a stack arrangement of a memory module

Stack arrangement of a memory module

Electronic component having stacked semiconductor chips in parallel...

Electronic component with stacked electronic elements and method fo...