Joffre F. Bernard

Person

Redwood City, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Memory device with improved performance
- Patent number 8,373,148
- Issue date Feb 12, 2013
- Spansion LLC
- Zhida Lan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gettering/stop layer for prevention of reduction of insulating oxid...
- Patent number 8,093,698
- Issue date Jan 10, 2012
- Spansion LLC
- Manuj Rathor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to prevent alloy formation when forming layered metal oxides...
- Patent number 7,790,497
- Issue date Sep 7, 2010
- Spansion LLC
- Steven Avanzino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of controlling zinc-doping in a copper-zinc alloy thin film...
- Patent number 6,811,671
- Issue date Nov 2, 2004
- Advanced Micro Devices, Inc.
- Sergey Lopatin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming wiring by implantation of seed layer material
- Patent number 6,770,559
- Issue date Aug 3, 2004
- Advanced Micro Devices, Inc.
- Ercan Adem
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of reducing electromigration by ordering zinc-doping in an e...
- Patent number 6,630,741
- Issue date Oct 7, 2003
- Advanced Micro Devices, Inc.
- Sergey Lopatin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a semiconductor device by calcium doping a co...
- Patent number 6,624,074
- Issue date Sep 23, 2003
- Advanced Micro Devices, Inc.
- Sergey Lopatin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device fabricated by reducing carbon, sulphur, and ox...
- Patent number 6,621,165
- Issue date Sep 16, 2003
- Sergey Lopatin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Barrier-to-seed layer alloying in integrated circuit interconnects
- Patent number 6,541,860
- Issue date Apr 1, 2003
- Advanced Micro Devices, Inc.
- Christy Mei-Chu Woo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sub-cap and method of manufacture therefor in integrated circuit ca...
- Patent number 6,515,367
- Issue date Feb 4, 2003
- Advanced Micro Devices, Inc.
- Joffre F. Bernard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric treatment in integrated circuit interconnects
- Patent number 6,479,898
- Issue date Nov 12, 2002
- Advanced Micro Devices, Inc.
- Dawn M. Hopper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device formed by calcium doping a copper surface usin...
- Patent number 6,469,387
- Issue date Oct 22, 2002
- Advanced Micro Devices, Inc.
- Sergey Lopatin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Amorphous and gradated barrier layer for integrated circuit interco...
- Patent number 6,465,867
- Issue date Oct 15, 2002
- Advanced Micro Devices, Inc.
- Joffre F. Bernard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of reducing carbon, sulphur, and oxygen impurities in a calc...
- Patent number 6,444,580
- Issue date Sep 3, 2002
- Advanced Micro Devices, Inc.
- Sergey Lopatin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sub-cap and method of manufacture therefor in integrated circuit ca...
- Patent number 6,406,996
- Issue date Jun 18, 2002
- Advanced Micro Devices, Inc.
- Joffre F. Bernard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Formation of self-aligned passivation for interconnect to minimize...
- Patent number 6,309,959
- Issue date Oct 30, 2001
- Advanced Micro Devices, Inc.
- Pin-Chin C. Wang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method to prevent alloy formation when forming layered metal oxides...
- Publication number 20090163018
- Publication date Jun 25, 2009
- Spansion LLC
- Steven Avanzino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Memory device with improved performance
- Publication number 20080265240
- Publication date Oct 30, 2008
- Spansion LLC, Advanced Micro Devices, Inc.
- Zhida Lan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Gettering/stop layer for prevention of reduction of insulating oxid...
- Publication number 20080130195
- Publication date Jun 5, 2008
- Spansion LLC
- Manuj Rathor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for improving electromigration performance of metallization...
- Publication number 20030217462
- Publication date Nov 27, 2003
- Fei Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Joffre F. Bernard

Person

Patents Grantslast 30 patents

Memory device with improved performance

Gettering/stop layer for prevention of reduction of insulating oxid...

Method to prevent alloy formation when forming layered metal oxides...

Method of controlling zinc-doping in a copper-zinc alloy thin film...

Method of forming wiring by implantation of seed layer material

Method of reducing electromigration by ordering zinc-doping in an e...

Method of fabricating a semiconductor device by calcium doping a co...

Semiconductor device fabricated by reducing carbon, sulphur, and ox...

Barrier-to-seed layer alloying in integrated circuit interconnects

Sub-cap and method of manufacture therefor in integrated circuit ca...

Dielectric treatment in integrated circuit interconnects

Semiconductor device formed by calcium doping a copper surface usin...

Amorphous and gradated barrier layer for integrated circuit interco...

Method of reducing carbon, sulphur, and oxygen impurities in a calc...

Sub-cap and method of manufacture therefor in integrated circuit ca...

Formation of self-aligned passivation for interconnect to minimize...

Patents Applicationslast 30 patents

Method to prevent alloy formation when forming layered metal oxides...

Memory device with improved performance

Gettering/stop layer for prevention of reduction of insulating oxid...

Method for improving electromigration performance of metallization...