Johann Alsmeier

Person

San Jose, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Three-dimensional memory device with finned support pillar structur...
- Patent number 12,322,710
- Issue date Jun 3, 2025
- SanDisk Technologies, Inc.
- Jixin Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Field effect transistors with gate fins and method of making the same
- Patent number 12,279,445
- Issue date Apr 15, 2025
- SanDisk Technologies, Inc.
- Srinivas Pulugurtha
Information Patent Grant
Bonded semiconductor die assembly containing through-stack via stru...
- Patent number 12,243,865
- Issue date Mar 4, 2025
- SanDisk Technologies, Inc.
- Johann Alsmeier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device containing bridges for enhanced str...
- Patent number 12,148,710
- Issue date Nov 19, 2024
- SanDisk Technologies LLC
- Koichi Matsuno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device with multiple types of support pill...
- Patent number 12,096,632
- Issue date Sep 17, 2024
- SanDisk Technologies LLC
- Koichi Matsuno
Information Patent Grant
Preventing erase disturb in NAND
- Patent number 12,087,371
- Issue date Sep 10, 2024
- SanDisk Technologies LLC
- Yanli Zhang
- G11 - INFORMATION STORAGE
Information Patent Grant
Three-dimensional memory device with multiple types of support pill...
- Patent number 12,029,036
- Issue date Jul 2, 2024
- SanDisk Technologies LLC
- Kenichi Shimomura
Information Patent Grant
Memory device using a multilayer ferroelectric stack and method of...
- Patent number 11,968,839
- Issue date Apr 23, 2024
- SanDisk Technologies LLC
- Yanli Zhang
Information Patent Grant
Bonded memory devices and methods of making the same
- Patent number 11,903,218
- Issue date Feb 13, 2024
- SanDisk Technologies LLC
- Raghuveer S. Makala
Information Patent Grant
Three-dimensional memory device including low-k drain-select-level...
- Patent number 11,871,580
- Issue date Jan 9, 2024
- SanDisk Technologies LLC
- Peng Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device including low-k drain-select-level...
- Patent number 11,856,765
- Issue date Dec 26, 2023
- SanDisk Technologies LLC
- Koichi Matsuno
Information Patent Grant
Three-dimensional memory device with wiggled drain-select-level iso...
- Patent number 11,805,649
- Issue date Oct 31, 2023
- SanDisk Technologies LLC
- Srinivas Pulugurtha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded semiconductor die assembly containing through-stack via stru...
- Patent number 11,587,920
- Issue date Feb 21, 2023
- SanDisk Technologies LLC
- Johann Alsmeier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device having on-pitch drain select gate e...
- Patent number 11,552,094
- Issue date Jan 10, 2023
- SanDisk Technologies LLC
- James Kai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded memory devices and methods of making the same
- Patent number 11,538,817
- Issue date Dec 27, 2022
- SanDisk Technologies LLC
- Raghuveer S. Makala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device containing bridges for enhanced str...
- Patent number 11,532,570
- Issue date Dec 20, 2022
- SanDisk Technologies LLC
- Genta Mizuno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device employing thinned insulating layers...
- Patent number 11,489,043
- Issue date Nov 1, 2022
- SanDisk Technologies LLC
- James Kai
- G11 - INFORMATION STORAGE
Information Patent Grant
Non-volatile memory with memory array between circuits
- Patent number 11,481,154
- Issue date Oct 25, 2022
- SanDisk Technologies LLC
- Deepanshu Dutta
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Memory device using a multilayer ferroelectric stack and method of...
- Patent number 11,469,251
- Issue date Oct 11, 2022
- SanDisk Technologies LLC
- Yanli Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
On-pitch drain select level isolation structure for three-dimension...
- Patent number RE49165
- Issue date Aug 9, 2022
- SanDisk Technologies LLC
- Yanli Zhang
Information Patent Grant
Three-dimensional memory device employing thinned insulating layers...
- Patent number 11,398,496
- Issue date Jul 26, 2022
- SanDisk Technologies LLC
- James Kai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device containing bit lines separated by air gaps and...
- Patent number 11,387,142
- Issue date Jul 12, 2022
- SanDisk Technologies LLC
- Koichi Matsuno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device including backside trench support s...
- Patent number 11,380,707
- Issue date Jul 5, 2022
- SanDisk Technologies LLC
- Koichi Matsuno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device including an inter-tier etch stop l...
- Patent number 11,296,101
- Issue date Apr 5, 2022
- SanDisk Technologies LLC
- Yao-Sheng Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional NOR array including active region pillars and met...
- Patent number 11,251,199
- Issue date Feb 15, 2022
- SanDisk Technologies LLC
- Yanli Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device with logic signal routing through a...
- Patent number 11,222,881
- Issue date Jan 11, 2022
- SanDisk Technologies LLC
- Yanli Zhang
- G11 - INFORMATION STORAGE
Information Patent Grant
Bonded three-dimensional memory devices and methods of making the s...
- Patent number 11,195,857
- Issue date Dec 7, 2021
- SanDisk Technologies LLC
- James Kai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cross-point array of ferroelectric field effect transistors and met...
- Patent number 11,164,890
- Issue date Nov 2, 2021
- SanDisk Technologies LLC
- Yanli Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded assembly containing oxidation barriers and/or adhesion enhan...
- Patent number 11,139,272
- Issue date Oct 5, 2021
- SanDisk Technologies LLC
- Raghuveer S. Makala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for removing a bulk substrate from a bonded assembly of wafers
- Patent number 11,127,729
- Issue date Sep 21, 2021
- SanDisk Technologies LLC
- James Kai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BONDING STRUCTURES FOR HIGH-DENSITY METAL-TO-METAL BONDING AND METH...
- Publication number 20250157964
- Publication date May 15, 2025
- WESTERN DIGITAL TECHNOLOGIES, INC.,
- Adarsh RAJASHEKHAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE INCLUDING SLOPING WORD LINES FOR ST...
- Publication number 20250126784
- Publication date Apr 17, 2025
- WESTERN DIGITAL TECHNOLOGIES, INC.,
- Johann ALSMEIER
Information Patent Application
STAIRLESS THREE-DIMENSIONAL MEMORY DEVICE WITH LAYER CONTACT VIA ST...
- Publication number 20250079294
- Publication date Mar 6, 2025
- WESTERN DIGITAL TECHNOLOGIES, INC.,
- Jixin YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE WITH PILLAR SHAPED TRENCH BRIDGE ST...
- Publication number 20250081453
- Publication date Mar 6, 2025
- WESTERN DIGITAL TECHNOLOGIES, INC.,
- Yuya SANADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE WITH PILLAR SHAPED TRENCH BRIDGE ST...
- Publication number 20250081458
- Publication date Mar 6, 2025
- WESTERN DIGITAL TECHNOLOGIES, INC.,
- Koichi MATSUNO
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE CONTAINING MULTI-LEVEL BRIDGE SUPPO...
- Publication number 20240395710
- Publication date Nov 28, 2024
- SANDISK TECHNOLOGIES LLC
- Koichi MATSUNO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE INCLUDING TRENCH BRIDGE STRUCTURES...
- Publication number 20240386959
- Publication date Nov 21, 2024
- Western Digital Technologies, Inc.
- Jixin YU
- G11 - INFORMATION STORAGE
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE CONTAINING TRENCH SUPPORT BRIDGE ST...
- Publication number 20240371789
- Publication date Nov 7, 2024
- WESTERN DIGITAL TECHNOLOGIES, INC.,
- Koichi MATSUNO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE WITH THROUGH-STACK CONTACT VIA STRU...
- Publication number 20240373631
- Publication date Nov 7, 2024
- WESTERN DIGITAL TECHNOLOGIES, INC.,
- Koichi MATSUNO
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE CONTAINING COMPOSITE DIELECTRIC ISO...
- Publication number 20240334695
- Publication date Oct 3, 2024
- SANDISK TECHNOLOGIES LLC
- Jixin YU
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE CONTAINING MULTI-LEVEL WORD LINE CO...
- Publication number 20240290714
- Publication date Aug 29, 2024
- SANDISK TECHNOLOGIES LLC
- Mark D. KRAMAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE WITH INTEGRATED CONTACT AND SUPPORT...
- Publication number 20240274191
- Publication date Aug 15, 2024
- SANDISK TECHNOLOGIES LLC
- Koichi MATSUNO
- G11 - INFORMATION STORAGE
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE AND METHOD OF MAKING THEREOF INCLUD...
- Publication number 20240250023
- Publication date Jul 25, 2024
- SANDISK TECHNOLOGIES LLC
- Ruogu Matthew ZHU
- G11 - INFORMATION STORAGE
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE AND METHOD OF MAKING THEREOF INCLUD...
- Publication number 20240251551
- Publication date Jul 25, 2024
- SANDISK TECHNOLOGIES LLC
- Ruogu Matthew ZHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL NOR ARRAY AND METHOD OF MAKING THE SAME
- Publication number 20240206171
- Publication date Jun 20, 2024
- SANDISK TECHNOLOGIES LLC
- Masaaki HIGASHITANI
- G11 - INFORMATION STORAGE
Information Patent Application
THREE-DIMENSIONAL NOR ARRAY AND METHOD OF MAKING THE SAME
- Publication number 20240206170
- Publication date Jun 20, 2024
- SANDISK TECHNOLOGIES LLC
- Satoshi SHIMIZU
- G11 - INFORMATION STORAGE
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE WITH SEPARATED SOURCE LINES AND MET...
- Publication number 20240172431
- Publication date May 23, 2024
- SANDISK TECHNOLOGIES LLC
- James KAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE INCLUDING LATERALLY SEPARATED SOURC...
- Publication number 20240127864
- Publication date Apr 18, 2024
- SANDISK TECHNOLOGIES LLC
- Masaaki HIGASHITANI
- G11 - INFORMATION STORAGE
Information Patent Application
PREVENTING ERASE DISTURB IN NAND
- Publication number 20240105271
- Publication date Mar 28, 2024
- SANDISK TECHNOLOGIES LLC
- Yanli Zhang
- G11 - INFORMATION STORAGE
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE CONTAINING LATERALLY-UNDULATING LAT...
- Publication number 20240064983
- Publication date Feb 22, 2024
- SANDISK TECHNOLOGIES LLC
- Takashi KASHIMURA
Information Patent Application
BONDED SEMICONDUCTOR DIE ASSEMBLY CONTAINING THROUGH-STACK VIA STRU...
- Publication number 20230163116
- Publication date May 25, 2023
- Johann Alsmeier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIELD EFFECT TRANSISTORS WITH GATE FINS AND METHOD OF MAKING THE SAME
- Publication number 20230082824
- Publication date Mar 16, 2023
- SANDISK TECHNOLOGIES LLC
- Srinivas PULUGURTHA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE USING A MULTILAYER FERROELECTRIC STACK AND METHOD OF...
- Publication number 20220415924
- Publication date Dec 29, 2022
- SANDISK TECHNOLOGIES LLC
- Yanli ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE INCLUDING LOW-K DRAIN-SELECT-LEVEL...
- Publication number 20220367487
- Publication date Nov 17, 2022
- SANDISK TECHNOLOGIES LLC
- Peng ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE INCLUDING LOW-K DRAIN-SELECT-LEVEL...
- Publication number 20220367499
- Publication date Nov 17, 2022
- SANDISK TECHNOLOGIES LLC
- Koichi MATSUNO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE WITH MULTIPLE TYPES OF SUPPORT PILL...
- Publication number 20220352196
- Publication date Nov 3, 2022
- SANDISK TECHNOLOGIES LLC
- Kenichi SHIMOMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE WITH FINNED SUPPORT PILLAR STRUCTUR...
- Publication number 20220352091
- Publication date Nov 3, 2022
- SANDISK TECHNOLOGIES LLC
- Jixin YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE WITH MULTIPLE TYPES OF SUPPORT PILL...
- Publication number 20220352197
- Publication date Nov 3, 2022
- SANDISK TECHNOLOGIES LLC
- Koichi MATSUNO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE CONTAINING BRIDGES FOR ENHANCED STR...
- Publication number 20220254728
- Publication date Aug 11, 2022
- SANDISK TECHNOLOGIES LLC
- Koichi MATSUNO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE CONTAINING BRIDGES FOR ENHANCED STR...
- Publication number 20220254733
- Publication date Aug 11, 2022
- SANDISK TECHNOLOGIES LLC
- Genta MIZUNO
- H01 - BASIC ELECTRIC ELEMENTS

Johann Alsmeier

Person

Patents Grantslast 30 patents

Three-dimensional memory device with finned support pillar structur...

Field effect transistors with gate fins and method of making the same

Bonded semiconductor die assembly containing through-stack via stru...

Three-dimensional memory device containing bridges for enhanced str...

Three-dimensional memory device with multiple types of support pill...

Preventing erase disturb in NAND

Three-dimensional memory device with multiple types of support pill...

Memory device using a multilayer ferroelectric stack and method of...

Bonded memory devices and methods of making the same

Three-dimensional memory device including low-k drain-select-level...

Three-dimensional memory device including low-k drain-select-level...

Three-dimensional memory device with wiggled drain-select-level iso...

Bonded semiconductor die assembly containing through-stack via stru...

Three-dimensional memory device having on-pitch drain select gate e...

Bonded memory devices and methods of making the same

Three-dimensional memory device containing bridges for enhanced str...

Three-dimensional memory device employing thinned insulating layers...

Non-volatile memory with memory array between circuits

Memory device using a multilayer ferroelectric stack and method of...

On-pitch drain select level isolation structure for three-dimension...

Three-dimensional memory device employing thinned insulating layers...

Semiconductor device containing bit lines separated by air gaps and...

Three-dimensional memory device including backside trench support s...

Three-dimensional memory device including an inter-tier etch stop l...

Three-dimensional NOR array including active region pillars and met...

Three-dimensional memory device with logic signal routing through a...

Bonded three-dimensional memory devices and methods of making the s...

Cross-point array of ferroelectric field effect transistors and met...

Bonded assembly containing oxidation barriers and/or adhesion enhan...

Method for removing a bulk substrate from a bonded assembly of wafers

Patents Applicationslast 30 patents

BONDING STRUCTURES FOR HIGH-DENSITY METAL-TO-METAL BONDING AND METH...

THREE-DIMENSIONAL MEMORY DEVICE INCLUDING SLOPING WORD LINES FOR ST...

STAIRLESS THREE-DIMENSIONAL MEMORY DEVICE WITH LAYER CONTACT VIA ST...

THREE-DIMENSIONAL MEMORY DEVICE WITH PILLAR SHAPED TRENCH BRIDGE ST...

THREE-DIMENSIONAL MEMORY DEVICE WITH PILLAR SHAPED TRENCH BRIDGE ST...

THREE-DIMENSIONAL MEMORY DEVICE CONTAINING MULTI-LEVEL BRIDGE SUPPO...

THREE-DIMENSIONAL MEMORY DEVICE INCLUDING TRENCH BRIDGE STRUCTURES...

THREE-DIMENSIONAL MEMORY DEVICE CONTAINING TRENCH SUPPORT BRIDGE ST...

THREE-DIMENSIONAL MEMORY DEVICE WITH THROUGH-STACK CONTACT VIA STRU...

THREE-DIMENSIONAL MEMORY DEVICE CONTAINING COMPOSITE DIELECTRIC ISO...

THREE-DIMENSIONAL MEMORY DEVICE CONTAINING MULTI-LEVEL WORD LINE CO...

THREE-DIMENSIONAL MEMORY DEVICE WITH INTEGRATED CONTACT AND SUPPORT...

THREE-DIMENSIONAL MEMORY DEVICE AND METHOD OF MAKING THEREOF INCLUD...

THREE-DIMENSIONAL MEMORY DEVICE AND METHOD OF MAKING THEREOF INCLUD...

THREE-DIMENSIONAL NOR ARRAY AND METHOD OF MAKING THE SAME

THREE-DIMENSIONAL NOR ARRAY AND METHOD OF MAKING THE SAME

THREE-DIMENSIONAL MEMORY DEVICE WITH SEPARATED SOURCE LINES AND MET...

THREE-DIMENSIONAL MEMORY DEVICE INCLUDING LATERALLY SEPARATED SOURC...

PREVENTING ERASE DISTURB IN NAND

THREE-DIMENSIONAL MEMORY DEVICE CONTAINING LATERALLY-UNDULATING LAT...

BONDED SEMICONDUCTOR DIE ASSEMBLY CONTAINING THROUGH-STACK VIA STRU...

FIELD EFFECT TRANSISTORS WITH GATE FINS AND METHOD OF MAKING THE SAME

MEMORY DEVICE USING A MULTILAYER FERROELECTRIC STACK AND METHOD OF...

THREE-DIMENSIONAL MEMORY DEVICE INCLUDING LOW-K DRAIN-SELECT-LEVEL...

THREE-DIMENSIONAL MEMORY DEVICE INCLUDING LOW-K DRAIN-SELECT-LEVEL...

THREE-DIMENSIONAL MEMORY DEVICE WITH MULTIPLE TYPES OF SUPPORT PILL...

THREE-DIMENSIONAL MEMORY DEVICE WITH FINNED SUPPORT PILLAR STRUCTUR...

THREE-DIMENSIONAL MEMORY DEVICE WITH MULTIPLE TYPES OF SUPPORT PILL...

THREE-DIMENSIONAL MEMORY DEVICE CONTAINING BRIDGES FOR ENHANCED STR...

THREE-DIMENSIONAL MEMORY DEVICE CONTAINING BRIDGES FOR ENHANCED STR...