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John B. Riley
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San Jose, CA, US
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Patents Grants
last 30 patents
Information
Patent Grant
Components, methods and assemblies for stacked packages
Patent number
7,294,928
Issue date
Nov 13, 2007
Tessera, Inc.
Kyong-Mo Bang
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Stacked microelectronic assemblies
Patent number
7,149,095
Issue date
Dec 12, 2006
Tessera, Inc.
Michael Warner
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Stacked microelectronic assemblies and methods of making same
Patent number
6,885,106
Issue date
Apr 26, 2005
Tessera, Inc.
Philip Damberg
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Multilayer substrate with interconnection vias and method of manufa...
Publication number
20090071707
Publication date
Mar 19, 2009
Tessera, Inc.
Kimitaka Endo
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
Stackable electronic device assembly
Publication number
20080105963
Publication date
May 8, 2008
Tessera, Inc.
William Walter Carlson
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Components, methods and assemblies for stacked packages
Publication number
20080042274
Publication date
Feb 21, 2008
Tessera, Inc.
Kyong-Mo Bang
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Microelectronic packages and methods therefor
Publication number
20070205496
Publication date
Sep 6, 2007
Tessera, Inc.
Belgacem Haba
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Stackable electronic device assembly and high G-force test fixture
Publication number
20070138612
Publication date
Jun 21, 2007
Tessera, Inc.
Michael Warner
G01 - MEASURING TESTING
Information
Patent Application
Microelectronic packages and methods therefor
Publication number
20050285246
Publication date
Dec 29, 2005
Tessera, Inc.
Belgacem Haba
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Components, methods and assemblies for stacked packages
Publication number
20040145054
Publication date
Jul 29, 2004
Tessera, Inc.
Kyong-Mo Bang
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Methods of making microelectronic assemblies including folded subst...
Publication number
20030168725
Publication date
Sep 11, 2003
Tessera, Inc.
Michael Warner
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Low-height multi-component assemblies
Publication number
20030048624
Publication date
Mar 13, 2003
Tessera, Inc.
Philip Damberg
H01 - BASIC ELECTRIC ELEMENTS