John C. Malinowski

Person

Jericho, VT, US

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor structure with thin film resistor and terminal bond pad
- Patent number 9,287,345
- Issue date Mar 15, 2016
- GLOBALFOUNDRIES Inc.
- Fen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-healing crack stop structure
- Patent number 9,230,921
- Issue date Jan 5, 2016
- GLOBALFOUNDRIES Inc.
- Stephen P. Ayotte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Discontinuous guard ring
- Patent number 8,729,664
- Issue date May 20, 2014
- International Business Machines Corporation
- Jeffrey P. Gambino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for reading a feature pattern from a packaged die
- Patent number 8,565,510
- Issue date Oct 22, 2013
- International Business Machines Corporation
- John M. Cohn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming thin film resistor and terminal bond pad simulta...
- Patent number 8,563,336
- Issue date Oct 22, 2013
- International Business Machines Corporation
- Fen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Product chips and die with a feature pattern that contains informat...
- Patent number 8,299,609
- Issue date Oct 30, 2012
- International Business Machines Corporation
- John M. Cohn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabricating product chips and die with a feature pattern that conta...
- Patent number 8,187,897
- Issue date May 29, 2012
- International Business Machines Corporation
- John M. Cohn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual chip stack method for electro-static discharge protection of i...
- Patent number 7,067,914
- Issue date Jun 27, 2006
- International Business Machines Corporation
- John C. Malinowski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-level RF passive device
- Patent number 7,053,460
- Issue date May 30, 2006
- International Business Machines Corporation
- Richard P. Volant
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of polishing C4 molybdenum masks to remove molybdenum peaks
- Patent number 7,025,891
- Issue date Apr 11, 2006
- International Business Machines Corporation
- Steven R. Codding
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Process for implanting a deep subcollector with self-aligned photo...
- Patent number 6,656,815
- Issue date Dec 2, 2003
- International Business Machines Corporation
- Douglas D. Coolbaugh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective nitride: oxide anisotropic etch process
- Patent number 6,656,375
- Issue date Dec 2, 2003
- International Business Machines Corporation
- Michael D. Armacost
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Modular high frequency integrated circuit structure
- Patent number 6,413,868
- Issue date Jul 2, 2002
- International Business Machines Corporation
- Thomas Adam Bartush
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Modular high frequency integrated circuit structure
- Patent number 6,259,148
- Issue date Jul 10, 2001
- International Business Machines Corporation
- Thomas Adam Bartush
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for fabricating multiple pillars inside a dram trench for i...
- Patent number 5,204,280
- Issue date Apr 20, 1993
- International Business Machines Corporation
- Sang H. Dhong
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
THERMAL PERFORMANCE FOR RADIO FREQUENCY (RF) CHIP PACKAGES
- Publication number 20240079371
- Publication date Mar 7, 2024
- GLOBALFOUNDRIES U.S. Inc.
- John C. MALINOWSKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-HEALING CRACK STOP STRUCTURE
- Publication number 20150097271
- Publication date Apr 9, 2015
- International Business Machines Corporation
- Stephen P. Ayotte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING THIN FILM RESISTOR AND TERMINAL BOND PAD SIMULTA...
- Publication number 20140001599
- Publication date Jan 2, 2014
- International Business Machines Corporation
- Fen CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISCONTINUOUS GUARD RING
- Publication number 20130256826
- Publication date Oct 3, 2013
- International Business Machines Corporation
- Jeffrey P. Gambino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRODUCT CHIPS AND DIE WITH A FEATURE PATTERN THAT CONTAINS INFORMAT...
- Publication number 20120119333
- Publication date May 17, 2012
- International Business Machines Corporation
- John M. Cohn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR READING A FEATURE PATTERN FROM A PACKAGED DIE
- Publication number 20120120758
- Publication date May 17, 2012
- International Business Machines Corporation
- John M. Cohn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Forming Thin Film Resistor and Terminal Bond Pad Simulta...
- Publication number 20100155893
- Publication date Jun 24, 2010
- International Business Machines Corporation
- Fen CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Product Chips and Die With a Feature Pattern That Contains Informat...
- Publication number 20100044858
- Publication date Feb 25, 2010
- John M. Cohn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF POLISHING C4 MOLYBDENUM MASKS TO REMOVE MOLYBDENUM PEAKS
- Publication number 20050045591
- Publication date Mar 3, 2005
- International Business Machines Corporation
- Steven R. Codding
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
A DUAL STACKED METAL-INSULATOR-METAL CAPACITOR AND METHOD FOR MAKIN...
- Publication number 20030197215
- Publication date Oct 23, 2003
- International Business Machines Corporation
- Douglas Duane Coolbaugh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Nitride etchstop film to protect metal-insulator-metal capacitor di...
- Publication number 20030146492
- Publication date Aug 7, 2003
- International Business Machines Corporation
- John Chester Malinowski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-level RF passive device
- Publication number 20030116850
- Publication date Jun 26, 2003
- International Business Machines Corporation
- Richard P. Volant
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dual chip stack method for electro-static discharge protection of i...
- Publication number 20030089979
- Publication date May 15, 2003
- John C. Malinowski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multiple material stacks with a stress relief layer between a metal...
- Publication number 20020163062
- Publication date Nov 7, 2002
- International Business Machines Corporation
- Ping-Chuan Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process for implanting a deep subcollector with self-aligned photo...
- Publication number 20020146889
- Publication date Oct 10, 2002
- International Business Machines Corporation
- Douglas D. Coolbaugh
- H01 - BASIC ELECTRIC ELEMENTS

John C. Malinowski

Person

Patents Grantslast 30 patents

Semiconductor structure with thin film resistor and terminal bond pad

Self-healing crack stop structure

Discontinuous guard ring

Methods for reading a feature pattern from a packaged die

Method for forming thin film resistor and terminal bond pad simulta...

Product chips and die with a feature pattern that contains informat...

Fabricating product chips and die with a feature pattern that conta...

Dual chip stack method for electro-static discharge protection of i...

Multi-level RF passive device

Method of polishing C4 molybdenum masks to remove molybdenum peaks

Process for implanting a deep subcollector with self-aligned photo...

Selective nitride: oxide anisotropic etch process

Modular high frequency integrated circuit structure

Modular high frequency integrated circuit structure

Process for fabricating multiple pillars inside a dram trench for i...

Patents Applicationslast 30 patents

THERMAL PERFORMANCE FOR RADIO FREQUENCY (RF) CHIP PACKAGES

SELF-HEALING CRACK STOP STRUCTURE

METHOD FOR FORMING THIN FILM RESISTOR AND TERMINAL BOND PAD SIMULTA...

DISCONTINUOUS GUARD RING

PRODUCT CHIPS AND DIE WITH A FEATURE PATTERN THAT CONTAINS INFORMAT...

METHODS FOR READING A FEATURE PATTERN FROM A PACKAGED DIE

Method for Forming Thin Film Resistor and Terminal Bond Pad Simulta...

Product Chips and Die With a Feature Pattern That Contains Informat...

METHOD OF POLISHING C4 MOLYBDENUM MASKS TO REMOVE MOLYBDENUM PEAKS

A DUAL STACKED METAL-INSULATOR-METAL CAPACITOR AND METHOD FOR MAKIN...

Nitride etchstop film to protect metal-insulator-metal capacitor di...

Multi-level RF passive device

Dual chip stack method for electro-static discharge protection of i...

Multiple material stacks with a stress relief layer between a metal...

Process for implanting a deep subcollector with self-aligned photo...