John David BRAZZLE

Person

Tracy, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Electronic component
- Patent number 11,844,178
- Issue date Dec 12, 2023
- Analog Devices International Unlimited Company
- John David Brazzle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked circuit package with molded base having laser drilled openi...
- Patent number 11,749,576
- Issue date Sep 5, 2023
- Analog Devices International Unlimited Company
- John D. Brazzle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional packaging techniques for power FET density improv...
- Patent number 11,476,232
- Issue date Oct 18, 2022
- Analog Devices International Unlimited Company
- Albert M. Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module for high power applications
- Patent number 11,410,977
- Issue date Aug 9, 2022
- Analog Devices International Unlimited Company
- John D. Brazzle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with overhang inductor
- Patent number 11,270,986
- Issue date Mar 8, 2022
- Analog Devices, Inc.
- Ahmadreza Odabaee
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Mechanically-compliant and electrically and thermally conductive le...
- Patent number 11,272,618
- Issue date Mar 8, 2022
- Analog Devices International Unlimited Company
- John David Brazzle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked circuit package with molded base having laser drilled openi...
- Patent number 10,497,635
- Issue date Dec 3, 2019
- Linear Technology Holding LLC
- John D. Brazzle
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MOLDED VERTICAL INTERCONNECT ARRAY
- Publication number 20250201683
- Publication date Jun 19, 2025
- Analog Devices, Inc.
- Michael John Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED VERTICAL POWER MODULE
- Publication number 20250183144
- Publication date Jun 5, 2025
- Analog Devices, Inc.
- John David Brazzle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ISOLATED METAL CLIPS WITH STRUCTURAL BRIDGE
- Publication number 20240096775
- Publication date Mar 21, 2024
- Analog Devices, Inc.
- Hien Minh Pham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW PROFILE COUPLED INDUCTOR
- Publication number 20230335328
- Publication date Oct 19, 2023
- Analog Devices, Inc.
- Steve Hawley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT
- Publication number 20210378098
- Publication date Dec 2, 2021
- Analog Devices International Unlimited Company
- John Brazzle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH OVERHANG INDUCTOR
- Publication number 20210358895
- Publication date Nov 18, 2021
- Analog Devices, Inc.
- Ahmadreza Odabaee
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
STACKED CIRCUIT PACKAGE WITH MOLDED BASE HAVING LASER DRILLED OPENI...
- Publication number 20210111084
- Publication date Apr 15, 2021
- Analog Devices International Unlimited Company
- John D. Brazzle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL PACKAGING TECHNIQUES FOR POWER FET DENSITY IMPROV...
- Publication number 20200312814
- Publication date Oct 1, 2020
- Analog Devices International Unlimited Company
- Albert M. Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC MODULE FOR HIGH POWER APPLICATIONS
- Publication number 20200152614
- Publication date May 14, 2020
- Analog Devices International Unlimited Company
- John D. Brazzle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED CIRCUIT PACKAGE WITH MOLDED BASE HAVING LASER DRILLED OPENI...
- Publication number 20190304865
- Publication date Oct 3, 2019
- Linear Technology Holding LLC
- John D. Brazzle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MECHANICALLY-COMPLIANT AND ELECTRICALLY AND THERMALLY CONDUCTIVE LE...
- Publication number 20190141834
- Publication date May 9, 2019
- John David Brazzle
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MECHANICALLY-COMPLIANT AND ELECTRICALLY AND THERMALLY CONDUCTIVE LE...
- Publication number 20170311447
- Publication date Oct 26, 2017
- Linear Technology Corporation
- John David BRAZZLE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

John David BRAZZLE

Person

Patents Grantslast 30 patents

Electronic component

Stacked circuit package with molded base having laser drilled openi...

Three-dimensional packaging techniques for power FET density improv...

Electronic module for high power applications

Package with overhang inductor

Mechanically-compliant and electrically and thermally conductive le...

Stacked circuit package with molded base having laser drilled openi...

Patents Applicationslast 30 patents

MOLDED VERTICAL INTERCONNECT ARRAY

STACKED VERTICAL POWER MODULE

ISOLATED METAL CLIPS WITH STRUCTURAL BRIDGE

LOW PROFILE COUPLED INDUCTOR

ELECTRONIC COMPONENT

PACKAGE WITH OVERHANG INDUCTOR

STACKED CIRCUIT PACKAGE WITH MOLDED BASE HAVING LASER DRILLED OPENI...

THREE-DIMENSIONAL PACKAGING TECHNIQUES FOR POWER FET DENSITY IMPROV...

ELECTRONIC MODULE FOR HIGH POWER APPLICATIONS

STACKED CIRCUIT PACKAGE WITH MOLDED BASE HAVING LASER DRILLED OPENI...

MECHANICALLY-COMPLIANT AND ELECTRICALLY AND THERMALLY CONDUCTIVE LE...

MECHANICALLY-COMPLIANT AND ELECTRICALLY AND THERMALLY CONDUCTIVE LE...