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John J. Konrad
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Endicott, NY, US
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Patents Grants
last 30 patents
Information
Patent Grant
Circuitized substrate assembly
Patent number
8,288,266
Issue date
Oct 16, 2012
Endicott Interconnect Technologies, Inc.
Norman A. Card
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method of making circuitized substrate with selected conductors hav...
Patent number
7,910,156
Issue date
Mar 22, 2011
Endicott Interconnect Technologies, Inc.
Norman A. Card
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Photoresist composition with antibacterial agent
Patent number
7,635,552
Issue date
Dec 22, 2009
Endicott Interconnect Technologies, Inc.
Ross W. Keesler
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Selective shield/material flow mechanism
Patent number
7,425,256
Issue date
Sep 16, 2008
International Business Machines Corporation
Ralph A. Barrese
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information
Patent Grant
Selective shield/material flow mechanism
Patent number
7,288,177
Issue date
Oct 30, 2007
International Business Machines Corporation
Ralph A. Barrese
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information
Patent Grant
Plating method for circuitized substrates
Patent number
7,169,313
Issue date
Jan 30, 2007
Endicott Interconnect Technologies, Inc.
Norman A. Card
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method of making circuitized substrate
Patent number
7,163,847
Issue date
Jan 16, 2007
Endicott Interconnect Technologies, Inc.
Timothy Antesberger
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method of making circuitized substrate
Patent number
7,091,066
Issue date
Aug 15, 2006
Endicott Interconnect Technologies, Inc.
Timothy Antesberger
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method of making a circuitized substrate having a plurality of sold...
Patent number
7,087,441
Issue date
Aug 8, 2006
Endicott Interconnect Technologies, Inc.
John J. Konrad
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method of making circuitized substrate
Patent number
7,084,014
Issue date
Aug 1, 2006
Endicott Interconnect Technologies, Inc.
Timothy Antesberger
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Process for manufacturing a printed wiring board
Patent number
7,007,378
Issue date
Mar 7, 2006
International Business Machines Corporation
John G. Gaudiello
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method of fabricating printed circuit board with mixed metallurgy pads
Patent number
6,931,722
Issue date
Aug 23, 2005
International Business Machines Corporation
Edward L. Arrington
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Structure having laser ablated features and method of fabricating
Patent number
6,919,514
Issue date
Jul 19, 2005
International Business Machines Corporation
John Joseph Konrad
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Selective shield/material flow mechanism
Patent number
6,746,578
Issue date
Jun 8, 2004
International Business Machines Corporation
Ralph A. Barrese
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information
Patent Grant
Structure having laser ablated features and method of fabricating
Patent number
6,730,857
Issue date
May 4, 2004
International Business Machines Corporation
John Joseph Konrad
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Printed circuit board with mixed metallurgy pads and method of fabr...
Patent number
6,586,683
Issue date
Jul 1, 2003
International Business Machines Corporation
Edward L. Arrington
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Chip carriers with enhanced wire bondability
Patent number
6,534,186
Issue date
Mar 18, 2003
International Business Machines Corporation
Konstantinos Papathomas
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of controlling the spread of an adhesive on a circuitized or...
Patent number
6,524,654
Issue date
Feb 25, 2003
International Business Machines Corporation
John Joseph Konrad
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method for masking a hole in a substrate during plating
Patent number
6,485,892
Issue date
Nov 26, 2002
International Business Machines Corporation
Lawrence Robert Blumberg
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Process for reducing extraneous metal plating
Patent number
6,455,139
Issue date
Sep 24, 2002
International Business Machines Corporation
John Joseph Konrad
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Treatment solution for reducing adhesive resin bleed
Patent number
6,432,182
Issue date
Aug 13, 2002
International Business Machines Corporation
John Joseph Konrad
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Apparatus for preventing drag-out
Patent number
6,372,101
Issue date
Apr 16, 2002
International Business Machines Corporation
Ralph A. Barrese
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Process for reducing extraneous metal plating
Patent number
6,296,897
Issue date
Oct 2, 2001
International Business Machines Corporation
John Joseph Konrad
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Method of rendering a substrate selectively non-wettable chip carri...
Patent number
6,251,469
Issue date
Jun 26, 2001
International Business Machines, Corporation
Konstantinos Papathomas
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of controlling the spread of an adhesive on a circuitized or...
Patent number
6,099,959
Issue date
Aug 8, 2000
International Business Machines Corporation
John Joseph Konrad
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Technique for removing defects from a layer of metal
Patent number
5,893,983
Issue date
Apr 13, 1999
International Business Machines Corporation
John Joseph Konrad
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Electrolytic method of depositing gold connectors on a printed circ...
Patent number
5,733,466
Issue date
Mar 31, 1998
International Business Machines Corporation
Biebele Opubo Benebo
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method of analyzing gold electroplating solutions for arsenic(III)
Patent number
5,723,339
Issue date
Mar 3, 1998
International Business Machines Corporation
John Joseph Konrad
G01 - MEASURING TESTING
Information
Patent Grant
Electrode array and use thereof
Patent number
5,156,730
Issue date
Oct 20, 1992
International Business Machines
Anilkumar C. Bhatt
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Automatic loading mechanism
Patent number
4,979,862
Issue date
Dec 25, 1990
IBM
Richard A. Bartlett
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
SYSTEMS AND METHODS FOR FORMING STUBLESS PLATED THROUGH HOLES HAVIN...
Publication number
20240188217
Publication date
Jun 6, 2024
TTM TECHNOLOGIES INC.
Matthew Douglas Neely
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SYSTEMS AND METHODS FOR REMOVING UNDESIRED METAL WITHIN VIAS FROM P...
Publication number
20220053641
Publication date
Feb 17, 2022
TTM TECHNOLOGIES INC.
Matthew Douglas Neely
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
CONDUCTIVE METAL NUB FOR ENHANCED ELECTRICAL INTERCONNECTION, AND I...
Publication number
20120243155
Publication date
Sep 27, 2012
Endicott Interconnect Technologies, Inc.
Luis J. Matienzo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method of making circuitized substrate with selected conductors hav...
Publication number
20080241359
Publication date
Oct 2, 2008
Endicott Interconnect Technologies, Inc.
Norman A. Card
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Solder mask application process
Publication number
20080038670
Publication date
Feb 14, 2008
Endicott Interconnect Technologies, Inc.
Norman A. Card
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Photoresist composition with antibacterial agent
Publication number
20080026316
Publication date
Jan 31, 2008
Endicott Interconnect Technologies, Inc.
Ross W. Keesler
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SELECTIVE SHIELD/MATERIAL FLOW MECHANISM
Publication number
20080000777
Publication date
Jan 3, 2008
International Business Machines Corporation
Ralph A. Barrese
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
Plating method for circuitized substrates
Publication number
20060255009
Publication date
Nov 16, 2006
Endicott Interconnect Technologies, Inc.
Norman A. Card
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Method of making a circuitized substrate having a plurality of sold...
Publication number
20060099727
Publication date
May 11, 2006
Endicott Interconnect Technologies, Inc.
John J. Konrad
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Circuitized substrate, method of making same and information handli...
Publication number
20060046462
Publication date
Mar 2, 2006
Endicott Interconnect Technologies, Inc.
Timothy Antesberger
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Circuitized substrate, method of making same and information handli...
Publication number
20060040426
Publication date
Feb 23, 2006
Endicott Interconnect Technologies, Inc.
Timothy Antesberger
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Selective shield/material flow mechanism
Publication number
20050218002
Publication date
Oct 6, 2005
International Business Machines Corporation
Ralph A. Barrese
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
Circuitized substrate, method of making same and information handli...
Publication number
20050074924
Publication date
Apr 7, 2005
Endicott Interconnect Technologies, Inc.
Timothy Antesberger
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Structure having laser ablated features and method of fabricating
Publication number
20040064939
Publication date
Apr 8, 2004
International Business Machines Corporation
John Joseph Konrad
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Printed circuit board with mixed metallurgy pads and method of fabr...
Publication number
20030177635
Publication date
Sep 25, 2003
Edward L. Arrington
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Alternate metallurgy for land grid array connectors
Publication number
20030102160
Publication date
Jun 5, 2003
International Business Machines Corporation
John G. Gaudiello
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Selective shield/material flow mechanism
Publication number
20020179450
Publication date
Dec 5, 2002
International Business Machines Corporation
Ralph A. Barrese
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
Printed circuit board with mixed metallurgy pads and method of fabr...
Publication number
20020157861
Publication date
Oct 31, 2002
International Business Machines Corporation
Edward L. Arrington
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information
Patent Application
Structure having laser ablated Features and method of fabricating
Publication number
20020129972
Publication date
Sep 19, 2002
International Business Machines Corporation
John Joseph Konrad
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information
Patent Application
Process for reducing extraneous metal plating
Publication number
20010040047
Publication date
Nov 15, 2001
John Joseph Konrad
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
Chip carriers with enhanced wire bondabi lity
Publication number
20010013644
Publication date
Aug 16, 2001
International Business Machines Corporation
Konstantinos Papathomas
H01 - BASIC ELECTRIC ELEMENTS