John Mendonca

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Austin, TX, US

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Patents Grantslast 30 patents

Information Patent Grant
Method for forming a copper interconnect using a multi-platen chemi...
- Patent number 6,573,173
- Issue date Jun 3, 2003
- Motorola, Inc.
- Janos Farkas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a copper interconnect using a multi-platen chemi...
- Patent number 6,444,569
- Issue date Sep 3, 2002
- Motorola, Inc.
- Janos Farkas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a copper interconnect using a multi-platen chemi...
- Patent number 6,274,478
- Issue date Aug 14, 2001
- Motorola, Inc.
- Janos Farkas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a copper barrier layer and formation thereof
- Patent number 6,093,966
- Issue date Jul 25, 2000
- Motorola, Inc.
- Ramnath Venkatraman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a semiconductor device using chemical-mechanical p...
- Patent number 5,985,748
- Issue date Nov 16, 1999
- Motorola, Inc.
- David K. Watts
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method for forming a copper interconnect using a multi-platen chemi...
- Publication number 20020151167
- Publication date Oct 17, 2002
- Janos Farkas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for forming a copper interconnect using a multi-platen chemi...
- Publication number 20010027083
- Publication date Oct 4, 2001
- Janos Farkas
- H01 - BASIC ELECTRIC ELEMENTS