John Owen Dukovic

Person

Pleasantville, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Electroplated interconnection structures on integrated circuit chips
- Patent number 6,946,716
- Issue date Sep 20, 2005
- International Business Machines Corporation
- Panayotis Constantinou Andricacos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making electroplated interconnection structures on integr...
- Patent number 6,709,562
- Issue date Mar 23, 2004
- International Business Machines Corporation
- Panayotis Constantinou Andricacos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for enhancing the uniformity of electrodeposition or electro...
- Patent number 6,685,814
- Issue date Feb 3, 2004
- International Business Machines Corporation
- Cyprian E. Uzoh
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Membrane partition system for plating of wafers
- Patent number 6,569,299
- Issue date May 27, 2003
- Novellus Systems, Inc.
- Jonathan David Reid
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method of controlling chemical bath composition in a manufacturing...
- Patent number 6,471,845
- Issue date Oct 29, 2002
- International Business Machines Corporation
- John O. Dukovic
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method and apparatus for enhancing the uniformity of electrodeposit...
- Patent number 6,261,426
- Issue date Jul 17, 2001
- International Business Machines Corporation
- Cyprian E. Uzoh
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Anode design for semiconductor deposition
- Patent number 6,251,251
- Issue date Jun 26, 2001
- International Business Machines Corporation
- Cyprian E. Uzoh
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electric potential shaping apparatus for holding a semiconductor wa...
- Patent number 6,193,859
- Issue date Feb 27, 2001
- Novellus Systems, Inc.
- Robert J. Contolini
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electric potential shaping method for electroplating
- Patent number 6,159,354
- Issue date Dec 12, 2000
- Novellus Systems, Inc.
- Robert J. Contolini
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electroplating anode including membrane partition system and method...
- Patent number 6,126,798
- Issue date Oct 3, 2000
- Novellus Systems, Inc.
- Jonathan David Reid
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electroplating workpiece fixture
- Patent number 5,522,975
- Issue date Jun 4, 1996
- International Business Machines Corporation
- Panayotis C. Andricacos
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Vertical paddle plating cell
- Patent number 5,516,412
- Issue date May 14, 1996
- International Business Machines Corporation
- Panayotis C. Andricacos
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method for controlling chemical species concentration
- Patent number 5,352,350
- Issue date Oct 4, 1994
- International Business Machines Corporation
- Panayotis C. Andricacos
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Multi-compartment eletroplating system
- Patent number 5,312,532
- Issue date May 17, 1994
- International Business Machines Corporation
- Panayotis Andricacos
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
Electroplated interconnection structures on integrated circuit chips
- Publication number 20060017169
- Publication date Jan 26, 2006
- International Business Machines Corporation
- Panayotis Constantinou Andricacos
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Electroplated interconnection structures on integrated circuit chips
- Publication number 20040229456
- Publication date Nov 18, 2004
- International Business Machines
- Panayotis Constantinou Andricacos
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method for enhancing the uniformity of electrodeposition or electro...
- Publication number 20010050233
- Publication date Dec 13, 2001
- Cyprian E. Uzoh
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

John Owen Dukovic

Person

Patents Grantslast 30 patents

Electroplated interconnection structures on integrated circuit chips

Method of making electroplated interconnection structures on integr...

Method for enhancing the uniformity of electrodeposition or electro...

Membrane partition system for plating of wafers

Method of controlling chemical bath composition in a manufacturing...

Method and apparatus for enhancing the uniformity of electrodeposit...

Anode design for semiconductor deposition

Electric potential shaping apparatus for holding a semiconductor wa...

Electric potential shaping method for electroplating

Electroplating anode including membrane partition system and method...

Electroplating workpiece fixture

Vertical paddle plating cell

Method for controlling chemical species concentration

Multi-compartment eletroplating system

Patents Applicationslast 30 patents

Electroplated interconnection structures on integrated circuit chips

Electroplated interconnection structures on integrated circuit chips

Method for enhancing the uniformity of electrodeposition or electro...