TREA

John Trezza

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  • Nashua, NH, US
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Patents Grantslast 30 patents

  • Information Patent Grant

    Tooling for coupling multiple electronic chips
    • Patent number 10,340,239
    • Issue date Jul 2, 2019
    • Cufer Asset Ltd. L.L.C.
    • Roger Dugas
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Tooling for coupling multiple electronic chips
    • Patent number 9,754,907
    • Issue date Sep 5, 2017
    • Cufer Asset Ltd. L.L.C.
    • Roger Dugas
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Tooling for coupling multiple electronic chips
    • Patent number 9,324,629
    • Issue date Apr 26, 2016
    • Cufer Asset Ltd. L.L.C.
    • Roger Dugas
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Contact-based encapsulation
    • Patent number 9,147,635
    • Issue date Sep 29, 2015
    • Cufer Asset Ltd. L.L.C.
    • John Trezza
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Low noise hybridized detector using charge transfer
    • Patent number 8,860,083
    • Issue date Oct 14, 2014
    • Sensors Unlimited, Inc.
    • John Alfred Trezza
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Inverse chip connector
    • Patent number 8,846,445
    • Issue date Sep 30, 2014
    • Cufer Asset Ltd. L.L.C.
    • John Trezza
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Multicolor detectors and applications thereof
    • Patent number 8,766,159
    • Issue date Jul 1, 2014
    • Sensors Unlimited, Inc.
    • John Trezza
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Processed wafer via
    • Patent number 8,643,186
    • Issue date Feb 4, 2014
    • Cufer Asset Ltd. L.L.C.
    • John Trezza
    • Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Information Patent Grant

    Method of making a capacitive sensor
    • Patent number 8,499,434
    • Issue date Aug 6, 2013
    • Cufer Asset Ltd. L.L.C.
    • Abhay Misra
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Grant

    Triaxial through-chip connection
    • Patent number 8,456,015
    • Issue date Jun 4, 2013
    • Cufer Asset Ltd. L.L.C.
    • John Trezza
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Multicolor detectors and applications thereof
    • Patent number 8,399,820
    • Issue date Mar 19, 2013
    • Sensors Unlimited, Inc.
    • John Trezza
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Thermally balanced via
    • Patent number 8,283,778
    • Issue date Oct 9, 2012
    • Cufer Asset Ltd. L.L.C.
    • John Trezza
    • Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Information Patent Grant

    Process for chip capacitive coupling
    • Patent number 8,232,194
    • Issue date Jul 31, 2012
    • Cufer Asset Ltd. L.L.C.
    • John Trezza
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Rigid-backed, membrane-based chip tooling
    • Patent number 8,197,626
    • Issue date Jun 12, 2012
    • Cufer Asset Ltd. L.L.C.
    • John Trezza
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Pin-type chip tooling
    • Patent number 8,197,627
    • Issue date Jun 12, 2012
    • Cufer Asset Ltd. L.L.C.
    • John Trezza
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Profiled contact
    • Patent number 8,154,131
    • Issue date Apr 10, 2012
    • Cufer Asset Ltd. L.L.C.
    • John Trezza
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Electrically conductive interconnect system and method
    • Patent number 8,093,729
    • Issue date Jan 10, 2012
    • Cufer Asset Ltd. L.L.C.
    • John Trezza
    • Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Information Patent Grant

    Side stacking apparatus and method
    • Patent number 8,084,851
    • Issue date Dec 27, 2011
    • Cufer Asset Ltd. L.L.C.
    • John Trezza
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Coaxial through chip connection
    • Patent number 8,067,312
    • Issue date Nov 29, 2011
    • Cufer Asset Ltd. L.L.C.
    • John Trezza
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Chip capacitive coupling
    • Patent number 8,053,903
    • Issue date Nov 8, 2011
    • Cufer Asset Ltd. L.L.C.
    • John Trezza
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Remote chip attachment
    • Patent number 8,021,922
    • Issue date Sep 20, 2011
    • Cufer Asset Ltd. L.L.C.
    • John Trezza
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Patterned contact
    • Patent number 7,989,958
    • Issue date Aug 2, 2011
    • Cufer Assett Ltd. L.L.C.
    • John Trezza
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Variable off-chip drive
    • Patent number 7,969,192
    • Issue date Jun 28, 2011
    • Cufer Asset Ltd. L.L.C.
    • Theodore J. Wyman
    • H03 - BASIC ELECTRONIC CIRCUITRY
  • Information Patent Grant

    Inverse chip connector
    • Patent number 7,969,015
    • Issue date Jun 28, 2011
    • Cufer Asset Ltd. L.L.C.
    • John Trezza
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Ultra-thin chip packaging
    • Patent number 7,960,210
    • Issue date Jun 14, 2011
    • Cufer Asset Ltd. L.L.C.
    • John Trezza
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Pin-type chip tooling
    • Patent number 7,946,331
    • Issue date May 24, 2011
    • Cufer Asset Ltd. L.L.C.
    • John Trezza
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Rigid-backed, membrane-based chip tooling
    • Patent number 7,942,182
    • Issue date May 17, 2011
    • Cufer Asset Ltd. L.L.C.
    • John Trezza
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Stacked chip-based system and method
    • Patent number 7,932,584
    • Issue date Apr 26, 2011
    • Cufer Asset Ltd. L.L.C.
    • John Trezza
    • Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Information Patent Grant

    Coaxial through chip connection
    • Patent number 7,919,870
    • Issue date Apr 5, 2011
    • Cufer Asset Ltd. L.L.C.
    • John Trezza
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Chip connector
    • Patent number 7,884,483
    • Issue date Feb 8, 2011
    • Cufer Asset Ltd. L.L.C.
    • John Trezza
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    TOOLING FOR COUPLING MULTIPLE ELECTRONIC CHIPS
    • Publication number 20190259721
    • Publication date Aug 22, 2019
    • Cufer Asset Ltd. L.L.C.
    • Roger Dugas
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    TOOLING FOR COUPLING MULTIPLE ELECTRONIC CHIPS
    • Publication number 20180033754
    • Publication date Feb 1, 2018
    • Cufer Asset Ltd. L.L.C.
    • Roger Dugas
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    TOOLING FOR COUPLING MULTIPLE ELECTRONIC CHIPS
    • Publication number 20160322320
    • Publication date Nov 3, 2016
    • Cufer Asset Ltd. L.L.C.
    • Roger Dugas
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRICALLY CONDUCTIVE INTERCONNECT SYSTEM AND METHOD
    • Publication number 20120108009
    • Publication date May 3, 2012
    • John Trezza
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CHIP CAPACITIVE COUPLING
    • Publication number 20120034739
    • Publication date Feb 9, 2012
    • John Trezza
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PATTERNED CONTACT
    • Publication number 20110275178
    • Publication date Nov 10, 2011
    • John Trezza
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    INVERSE CHIP CONNECTOR
    • Publication number 20110250722
    • Publication date Oct 13, 2011
    • John Trezza
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PIN-TYPE CHIP TOOLING
    • Publication number 20110223717
    • Publication date Sep 15, 2011
    • John Trezza
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    RIGID-BACKED, MEMBRANE-BASED CHIP TOOLING
    • Publication number 20110212573
    • Publication date Sep 1, 2011
    • John Trezza
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CONTACT-BASED ENCAPSULATION
    • Publication number 20110147932
    • Publication date Jun 23, 2011
    • John Trezza
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MULTICOLOR DETECTORS AND APPLICATIONS THEREOF
    • Publication number 20100320365
    • Publication date Dec 23, 2010
    • John Trezza
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PROCESSED WAFER VIA
    • Publication number 20100304565
    • Publication date Dec 2, 2010
    • John Trezza
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    REMOTE CHIP ATTACHMENT
    • Publication number 20100261297
    • Publication date Oct 14, 2010
    • John Trezza
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CHIP CAPACITIVE COUPLING
    • Publication number 20100219503
    • Publication date Sep 2, 2010
    • John Trezza
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    COAXIAL THROUGH CHIP CONNECTION
    • Publication number 20100197134
    • Publication date Aug 5, 2010
    • John Trezza
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    VARIABLE OFF-CHIP DRIVE
    • Publication number 20100176844
    • Publication date Jul 15, 2010
    • Theodore J. (Ted) Wyman
    • H03 - BASIC ELECTRONIC CIRCUITRY
  • Information Patent Application

    SIDE STACKING APPARATUS AND METHOD
    • Publication number 20100148343
    • Publication date Jun 17, 2010
    • John Trezza
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    TRIAXIAL THROUGH-CHIP CONNECTON
    • Publication number 20100140776
    • Publication date Jun 10, 2010
    • John Trezza
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SENSITIVITY CAPACITIVE SENSOR
    • Publication number 20100055838
    • Publication date Mar 4, 2010
    • Abhay Misra
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Application

    CHIP-BASED THERMO-STACK
    • Publication number 20090269888
    • Publication date Oct 29, 2009
    • John Trezza
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ULTRA-THIN CHIP PACKAGING
    • Publication number 20090267219
    • Publication date Oct 29, 2009
    • John Trezza
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PLATED PILLAR PACKAGE FORMATION
    • Publication number 20090174079
    • Publication date Jul 9, 2009
    • JOHN TREZZA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ISOLATING CHIP-TO-CHIP CONTACT
    • Publication number 20090137116
    • Publication date May 28, 2009
    • Cufer Asset Ltd. L.L.C.
    • John Trezza
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CONDUCTIVE VIA FORMATION
    • Publication number 20080261392
    • Publication date Oct 23, 2008
    • John Trezza
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    ULTRA-THIN CHIP PACKAGING
    • Publication number 20080258284
    • Publication date Oct 23, 2008
    • John Trezza
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MOBILE BINDING IN AN ELECTRONIC CONNECTION
    • Publication number 20080246145
    • Publication date Oct 9, 2008
    • John Trezza
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    HEAT CYCLE-ABLE CONNECTION
    • Publication number 20080245846
    • Publication date Oct 9, 2008
    • John Trezza
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    BOWED WAFER HYBRIDIZATION COMPENSATION
    • Publication number 20080197488
    • Publication date Aug 21, 2008
    • John Trezza
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PLATED PILLAR PACKAGE FORMATION
    • Publication number 20080197508
    • Publication date Aug 21, 2008
    • John Trezza
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    POST-SEED DEPOSITION PROCESS
    • Publication number 20080200022
    • Publication date Aug 21, 2008
    • John Callahan
    • H01 - BASIC ELECTRIC ELEMENTS