John W. Osenbach

Person

Spring Township, Berks County, PA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Thermal interface material containment
- Patent number 12,218,031
- Issue date Feb 4, 2025
- Infinera Corporation
- John W. Osenbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Opto-electronic package and a method for making an opto-electronic...
- Patent number 11,803,021
- Issue date Oct 31, 2023
- Infinera Corporation
- Franklin Wall
- G02 - OPTICS
Information Patent Grant
Low-cost nano-heat pipe
- Patent number 10,962,296
- Issue date Mar 30, 2021
- Infinera Corporation
- John W. Osenbach
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Tunable waveguide devices
- Patent number 10,741,999
- Issue date Aug 11, 2020
- Infinera Coropration
- Peter W. Evans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photonic integrated circuit package
- Patent number 10,290,619
- Issue date May 14, 2019
- Infinera Corporation
- Peter W. Evans
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Tunable waveguide devices
- Patent number 10,205,301
- Issue date Feb 12, 2019
- Infinera Corporation
- Peter W. Evans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tunable waveguide devices
- Patent number 10,181,697
- Issue date Jan 15, 2019
- Infinera Corporation
- Peter W. Evans
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Tunable waveguide devices
- Patent number 10,181,698
- Issue date Jan 15, 2019
- Infinera Corporation
- Peter W. Evans
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Low-cost nano-heat pipe
- Patent number 10,175,005
- Issue date Jan 8, 2019
- Infinera Corporation
- John W. Osenbach
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Tunable waveguide devices
- Patent number 10,177,531
- Issue date Jan 8, 2019
- Infinera Corporation
- Peter W. Evans
- G02 - OPTICS
Information Patent Grant
Tunable waveguide devices
- Patent number 10,122,149
- Issue date Nov 6, 2018
- Infinera Corporation
- Peter W. Evans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photonic integrated circuit package
- Patent number 10,037,982
- Issue date Jul 31, 2018
- Infinera Corporation
- Peter W. Evans
- G02 - OPTICS
Information Patent Grant
Photonic integrated circuit package
- Patent number 10,026,723
- Issue date Jul 17, 2018
- Infinera Corporation
- Peter W. Evans
- G02 - OPTICS
Information Patent Grant
Photonic integrated circuit (PIC) and silicon photonics (SIP) circu...
- Patent number 9,784,933
- Issue date Oct 10, 2017
- Infinera Corporation
- John W. Osenbach
- G02 - OPTICS
Information Patent Grant
Integration of shallow trench isolation and through-substrate vias...
- Patent number 9,613,847
- Issue date Apr 4, 2017
- Avago Technologies General IP (Singapore) Pte. Ltd.
- Mark A. Bachman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pb-free solder bumps with improved mechanical properties
- Patent number 9,443,821
- Issue date Sep 13, 2016
- Avago Technologies General IP (Singapore) Pte. Ltd.
- Mark Bachman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating equal height metal pillars of different diam...
- Patent number 9,324,557
- Issue date Apr 26, 2016
- Avago Technologies General IP (Singapore) Pte. Ltd.
- Steven D. Cate
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Moisture barrier for a wire bond
- Patent number 9,136,245
- Issue date Sep 15, 2015
- Avago Technologies General IP (Singapore) Pte. Ltd.
- John M. DeLucca
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked interconnect heat sink
- Patent number 9,054,064
- Issue date Jun 9, 2015
- Avago Technologies General IP (Singapore) Pte. Ltd.
- Mark A Bachman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of fabrication of through-substrate vias
- Patent number 8,987,137
- Issue date Mar 24, 2015
- LSI Corporation
- Mark A. Bachman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing an electronic device package
- Patent number 8,869,389
- Issue date Oct 28, 2014
- LSI Corporation
- Larry Golick
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
PB-free solder bumps with improved mechanical properties
- Patent number 8,779,587
- Issue date Jul 15, 2014
- Agere Systems LLC
- Mark Bachman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Moisture barrier for a wire bond
- Patent number 8,766,436
- Issue date Jul 1, 2014
- LSI Corporation
- John M. DeLucca
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integration of shallow trench isolation and through-substrate vias...
- Patent number 8,742,535
- Issue date Jun 3, 2014
- LSI Corporation
- Mark A. Bachman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mitigation of whiskers in Sn-films
- Patent number 8,653,375
- Issue date Feb 18, 2014
- Agere Systems, INC
- John W. Osenbach
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Solder interconnect by addition of copper
- Patent number 8,580,621
- Issue date Nov 12, 2013
- LSI Corporation
- Mark A. Bachman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low-cost 3D face-to-face out assembly
- Patent number 8,502,372
- Issue date Aug 6, 2013
- LSI Corporation
- John Osenbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked interconnect heat sink
- Patent number 8,492,911
- Issue date Jul 23, 2013
- LSI Corporation
- Mark A. Bachman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder interconnect by addition of copper
- Patent number 8,378,485
- Issue date Feb 19, 2013
- LSI Corporation
- Mark A. Bachman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame design to improve reliability
- Patent number 8,334,467
- Issue date Dec 18, 2012
- LSI Corporation
- Larry W. Golick
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
NON-HERMETIC PACKAGE HAVING INTERNAL TEMPERATURE CONTROL
- Publication number 20250067945
- Publication date Feb 27, 2025
- Infinera Corporation
- John W. Osenbach
- G01 - MEASURING TESTING
Information Patent Application
BALL GRID ARRAY RF PACKAGE CONFIGURATIONS
- Publication number 20240282722
- Publication date Aug 22, 2024
- Infinera Corporation
- John W. Osenbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID INTEGRATED CIRCUIT PACKAGE
- Publication number 20220238449
- Publication date Jul 28, 2022
- Infinera Corp.
- John W. Osenbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL INTERFACE MATERIAL CONTAINMENT
- Publication number 20220216127
- Publication date Jul 7, 2022
- Infinera Corp.
- John W. Osenbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Opto-Electronic Package and a Method for Making an Opto-Electronic...
- Publication number 20210302671
- Publication date Sep 30, 2021
- Infinera Corp.
- Franklin Wall
- G02 - OPTICS
Information Patent Application
HETEROGENEOUS COMMON SUBSTRATE MULTI-CHIP PACKAGE INCLUDING PHOTONI...
- Publication number 20190391348
- Publication date Dec 26, 2019
- Infinera Corporation
- John Osenbach
- G02 - OPTICS
Information Patent Application
SPARE CHANNELS ON PHOTONIC INTEGRATED CIRCUITS AND IN PHOTONIC INTE...
- Publication number 20190342010
- Publication date Nov 7, 2019
- Infinera Corporation
- Peter W. Evans
- G02 - OPTICS
Information Patent Application
INTERPOSER ON CARRIER INTEGRATED CIRCUIT MOUNT
- Publication number 20190341359
- Publication date Nov 7, 2019
- Infinera Corporation
- Jie Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPARE CHANNELS ON PHOTONIC INTEGRATED CIRCUITS AND IN PHOTONIC INTE...
- Publication number 20190339468
- Publication date Nov 7, 2019
- Infinera Corporation
- Peter W. Evans
- G02 - OPTICS
Information Patent Application
SPARE CHANNELS ON PHOTONIC INTEGRATED CIRCUITS AND IN PHOTONIC INTE...
- Publication number 20190342009
- Publication date Nov 7, 2019
- Infinera Corporation
- Peter W. Evans
- G02 - OPTICS
Information Patent Application
LOW-COST NANO-HEAT PIPE
- Publication number 20190137186
- Publication date May 9, 2019
- Infinera Corporation
- John W. Osenbach
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
OPTICAL MODULES HAVING AN IMPROVED OPTICAL SIGNAL TO NOISE RATIO
- Publication number 20190089475
- Publication date Mar 21, 2019
- INFINERA CORPORATION
- Fred A. Kish
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
OPTICAL MODULES HAVING AN IMPROVED OPTICAL SIGNAL TO NOISE RATIO
- Publication number 20190089476
- Publication date Mar 21, 2019
- INFINERA CORPORATION
- Fred A. Kish
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
OPTICAL MODULES HAVING AN IMPROVED OPTICAL SIGNAL TO NOISE RATIO
- Publication number 20180351684
- Publication date Dec 6, 2018
- Infinera Corparation
- John Osenbach
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Tunable Waveguide Devices
- Publication number 20180331497
- Publication date Nov 15, 2018
- Infinera Corporation
- Peter W. Evans
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Tunable Waveguide Devices
- Publication number 20180331498
- Publication date Nov 15, 2018
- Infinera Corporation
- Peter W. Evans
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Tunable Waveguide Devices
- Publication number 20180131159
- Publication date May 10, 2018
- Infinera Corporation
- Peter W. Evans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Tunable Waveguide Devices
- Publication number 20180131158
- Publication date May 10, 2018
- Infinera Corporation
- Peter W. Evans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Tunable Waveguide Devices
- Publication number 20180131157
- Publication date May 10, 2018
- Infinera Corporation
- Peter W. Evans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTONIC INTEGRATED CIRCUIT PACKAGE
- Publication number 20170194310
- Publication date Jul 6, 2017
- Infinera Corporation
- Peter W. Evans
- G02 - OPTICS
Information Patent Application
TUNABLE WAVEGUIDE DEVICES
- Publication number 20170194764
- Publication date Jul 6, 2017
- Infinera Corporation
- Peter W. Evans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTONIC INTEGRATED CIRCUIT PACKAGE
- Publication number 20170194308
- Publication date Jul 6, 2017
- Infinera Corporation
- Peter W. Evans
- G02 - OPTICS
Information Patent Application
PHOTONIC INTEGRATED CIRCUIT PACKAGE
- Publication number 20170194309
- Publication date Jul 6, 2017
- Infinera Corporation
- Peter W. Evans
- G02 - OPTICS
Information Patent Application
LOW-COST NANO-HEAT PIPE
- Publication number 20160290734
- Publication date Oct 6, 2016
- Infinera Corporation
- John W. OSENBACH
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PHOTONIC INTEGRATED CIRCUIT (PIC) AND SILICON PHOTONICS (SIP) CIRCU...
- Publication number 20160178861
- Publication date Jun 23, 2016
- Infinera Corporation
- John W. OSENBACH
- G02 - OPTICS
Information Patent Application
Method for Fabricating Equal Height Metal Pillars of Different Diam...
- Publication number 20150262949
- Publication date Sep 17, 2015
- LSI Corporation
- John W. Osenbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Fabricating Equal Height Metal Pillars of Different Diam...
- Publication number 20150262950
- Publication date Sep 17, 2015
- LSI Corporation
- Steven D. Cate
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Flip-Chip Bonding Using Copper Pillars
- Publication number 20150243617
- Publication date Aug 27, 2015
- LSI Corporation
- John W. Osenbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Copper Wire Bonding Apparatus Using A Purge Gas to Enhance Ball Bon...
- Publication number 20150243534
- Publication date Aug 27, 2015
- LSI Corporation
- John W. Osenbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED INTERCONNECT HEAT SINK
- Publication number 20150214130
- Publication date Jul 30, 2015
- Avago Technologies General IP (Singapore) PTE. LTD.
- Mark A. Bachman
- H01 - BASIC ELECTRIC ELEMENTS

John W. Osenbach

Person

Patents Grantslast 30 patents

Thermal interface material containment

Opto-electronic package and a method for making an opto-electronic...

Low-cost nano-heat pipe

Tunable waveguide devices

Photonic integrated circuit package

Tunable waveguide devices

Tunable waveguide devices

Tunable waveguide devices

Low-cost nano-heat pipe

Tunable waveguide devices

Tunable waveguide devices

Photonic integrated circuit package

Photonic integrated circuit package

Photonic integrated circuit (PIC) and silicon photonics (SIP) circu...

Integration of shallow trench isolation and through-substrate vias...

Pb-free solder bumps with improved mechanical properties

Method for fabricating equal height metal pillars of different diam...

Moisture barrier for a wire bond

Stacked interconnect heat sink

Method of fabrication of through-substrate vias

Method of manufacturing an electronic device package

PB-free solder bumps with improved mechanical properties

Moisture barrier for a wire bond

Integration of shallow trench isolation and through-substrate vias...

Mitigation of whiskers in Sn-films

Solder interconnect by addition of copper

Low-cost 3D face-to-face out assembly

Stacked interconnect heat sink

Solder interconnect by addition of copper

Lead frame design to improve reliability

Patents Applicationslast 30 patents

NON-HERMETIC PACKAGE HAVING INTERNAL TEMPERATURE CONTROL

BALL GRID ARRAY RF PACKAGE CONFIGURATIONS

HYBRID INTEGRATED CIRCUIT PACKAGE

THERMAL INTERFACE MATERIAL CONTAINMENT

Opto-Electronic Package and a Method for Making an Opto-Electronic...

HETEROGENEOUS COMMON SUBSTRATE MULTI-CHIP PACKAGE INCLUDING PHOTONI...

SPARE CHANNELS ON PHOTONIC INTEGRATED CIRCUITS AND IN PHOTONIC INTE...

INTERPOSER ON CARRIER INTEGRATED CIRCUIT MOUNT

SPARE CHANNELS ON PHOTONIC INTEGRATED CIRCUITS AND IN PHOTONIC INTE...

SPARE CHANNELS ON PHOTONIC INTEGRATED CIRCUITS AND IN PHOTONIC INTE...

LOW-COST NANO-HEAT PIPE

OPTICAL MODULES HAVING AN IMPROVED OPTICAL SIGNAL TO NOISE RATIO

OPTICAL MODULES HAVING AN IMPROVED OPTICAL SIGNAL TO NOISE RATIO

OPTICAL MODULES HAVING AN IMPROVED OPTICAL SIGNAL TO NOISE RATIO

Tunable Waveguide Devices

Tunable Waveguide Devices

Tunable Waveguide Devices

Tunable Waveguide Devices

Tunable Waveguide Devices

PHOTONIC INTEGRATED CIRCUIT PACKAGE

TUNABLE WAVEGUIDE DEVICES

PHOTONIC INTEGRATED CIRCUIT PACKAGE

PHOTONIC INTEGRATED CIRCUIT PACKAGE

LOW-COST NANO-HEAT PIPE

PHOTONIC INTEGRATED CIRCUIT (PIC) AND SILICON PHOTONICS (SIP) CIRCU...

Method for Fabricating Equal Height Metal Pillars of Different Diam...

Method for Fabricating Equal Height Metal Pillars of Different Diam...

Method for Flip-Chip Bonding Using Copper Pillars

Copper Wire Bonding Apparatus Using A Purge Gas to Enhance Ball Bon...

STACKED INTERCONNECT HEAT SINK