Jonathan D. Reid

Person

Johnson City, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Copper electrofill on non-copper liner layers
- Patent number 12,012,667
- Issue date Jun 18, 2024
- Lam Research Corporation
- Lee J. Brogan
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Removal of electroplating bath additives
- Patent number 11,280,022
- Issue date Mar 22, 2022
- Lam Research Corporation
- Tighe A. Spurlin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Monitoring surface oxide on seed layers during electroplating
- Patent number 11,208,732
- Issue date Dec 28, 2021
- Lam Research Corporation
- Ludan Huang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Process for optimizing cobalt electrofill using sacrificial oxidants
- Patent number 11,078,591
- Issue date Aug 3, 2021
- Lam Research Corporation
- Lee J. Brogan
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Configuration and method of operation of an electrodeposition syste...
- Patent number 10,745,817
- Issue date Aug 18, 2020
- Novellus Systems, Inc.
- Kousik Ganesan
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Removal of electroplating bath additives
- Patent number 10,711,366
- Issue date Jul 14, 2020
- Lam Research Corporation
- Tighe A. Spurlin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electrolyte concentration control system for high rate electroplating
- Patent number 10,472,730
- Issue date Nov 12, 2019
- Novellus Systems, Inc.
- Steven T. Mayer
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Monitoring surface oxide on seed layers during electroplating
- Patent number 10,443,146
- Issue date Oct 15, 2019
- Lam Research Corporation
- Ludan Huang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Gap fill process stability monitoring of an electroplating process...
- Patent number 10,358,738
- Issue date Jul 23, 2019
- Lam Research Corporation
- Quan Ma
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Process for optimizing cobalt electrofill using sacrificial oxidants
- Patent number 10,329,683
- Issue date Jun 25, 2019
- Lam Research Corporation
- Lee J. Brogan
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Low copper electroplating solutions for fill and defect control
- Patent number 10,214,826
- Issue date Feb 26, 2019
- Novellus Systems, Inc.
- Jian Zhou
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Dynamic current distribution control apparatus and method for wafer...
- Patent number 10,023,970
- Issue date Jul 17, 2018
- Novellus Systems, Inc.
- Zhian He
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method and apparatus for filling interconnect structures
- Patent number 10,006,144
- Issue date Jun 26, 2018
- Novellus Systems, Inc.
- Jonathan D. Reid
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method and apparatus for remote plasma treatment for reducing metal...
- Patent number 9,865,501
- Issue date Jan 9, 2018
- Lam Research Corporation
- Tighe A. Spurlin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Dynamic current distribution control apparatus and method for wafer...
- Patent number 9,822,461
- Issue date Nov 21, 2017
- Novellus Systems, Inc.
- Zhian He
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Configuration and method of operation of an electrodeposition syste...
- Patent number 9,816,193
- Issue date Nov 14, 2017
- Novellus Systems, Inc.
- Kousik Ganesan
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method and apparatus for electroplating semiconductor wafer when co...
- Patent number 9,816,196
- Issue date Nov 14, 2017
- Novellus Systems, Inc.
- Tighe A. Spurlin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Control of electrolyte flow dynamics for uniform electroplating
- Patent number 9,816,194
- Issue date Nov 14, 2017
- Lam Research Corporation
- Zhian He
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Chemistry additives and process for cobalt film electrodeposition
- Patent number 9,777,386
- Issue date Oct 3, 2017
- Lam Research Corporation
- Natalia V. Doubina
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Geometry and process optimization for ultra-high RPM plating
- Patent number 9,481,942
- Issue date Nov 1, 2016
- Lam Research Corporation
- Jian Zhou
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method and apparatus for characterizing metal oxide reduction
- Patent number 9,472,377
- Issue date Oct 18, 2016
- Lam Research Corporation
- Edward C. Opocensky
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Current ramping and current pulsing entry of substrates for electro...
- Patent number 9,385,035
- Issue date Jul 5, 2016
- Novellus Systems, Inc.
- Tighe A. Spurlin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method and apparatus for electroplating
- Patent number 9,309,604
- Issue date Apr 12, 2016
- Novellus Systems, Inc.
- Steven Mayer
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electrolyte concentration control system for high rate electroplating
- Patent number 9,109,295
- Issue date Aug 18, 2015
- Novellus Systems, Inc.
- Jonathan D. Reid
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Control of electrolyte composition in a copper electroplating appar...
- Patent number 9,045,841
- Issue date Jun 2, 2015
- Novellus Systems, Inc.
- Bryan Buckalew
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Dynamic current distribution control apparatus and method for wafer...
- Patent number 9,045,840
- Issue date Jun 2, 2015
- Novellus Systems, Inc.
- David W. Porter
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Process for through silicon via filling
- Patent number 8,722,539
- Issue date May 13, 2014
- Novellus Systems, Inc.
- Jonathan D. Reid
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Tungsten barrier and seed for copper filled TSV
- Patent number 8,709,948
- Issue date Apr 29, 2014
- Novellus Systems, Inc.
- Michal Danek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper electroplating process for uniform across wafer deposition a...
- Patent number 8,703,615
- Issue date Apr 22, 2014
- Novellus Systems, Inc.
- Thomas A. Ponnuswamy
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method of electroplating using a high resistance ionic current source
- Patent number 8,623,193
- Issue date Jan 7, 2014
- Novellus Systems, Inc.
- Steven T Mayer
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
ELECTROFILL FROM ALKALINE ELECTROPLATING SOLUTIONS
- Publication number 20230227992
- Publication date Jul 20, 2023
- LAM RESEARCH CORPORATION
- Lee J. Brogan
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
WET FUNCTIONALIZATION OF DIELECTRIC SURFACES
- Publication number 20230197509
- Publication date Jun 22, 2023
- LAM RESEARCH CORPORATION
- Lee J. Brogan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ELECTROPLATING COBALT, NICKEL, AND ALLOYS THEREOF
- Publication number 20230178430
- Publication date Jun 8, 2023
- LAM RESEARCH CORPORATION
- Natalia V. Doubina
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEVELING COMPOUND CONTROL
- Publication number 20230144437
- Publication date May 11, 2023
- LAM RESEARCH CORPORATION
- Matthew A. Rigsby
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
INTERCONNECT STRUCTURE WITH SELECTIVE ELECTROPLATED VIA FILL
- Publication number 20220415710
- Publication date Dec 29, 2022
- LAM RESEARCH CORPORATION
- Jonathan David REID
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PROTECTION OF SEED LAYERS DURING ELECTRODEPOSITION OF METALS IN SEM...
- Publication number 20220208604
- Publication date Jun 30, 2022
- LAM RESEARCH CORPORATION
- Huanfeng Zhu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ELECTRODEPOSITION OF COBALT TUNGSTEN FILMS
- Publication number 20220102209
- Publication date Mar 31, 2022
- LAM RESEARCH CORPORATION
- Tighe A. Spurlin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COPPER ELECTROFILL ON NON-COPPER LINER LAYERS
- Publication number 20210156045
- Publication date May 27, 2021
- LAM RESEARCH CORPORATION
- Lee J. Brogan
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
REMOVAL OF ELECTROPLATING BATH ADDITIVES
- Publication number 20200308724
- Publication date Oct 1, 2020
- LAM RESEARCH CORPORATION
- Tighe A. Spurlin
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
MONITORING SURFACE OXIDE ON SEED LAYERS DURING ELECTROPLATING
- Publication number 20190390361
- Publication date Dec 26, 2019
- LAM RESEARCH CORPORATION
- Ludan Huang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PROCESS FOR OPTIMIZING COBALT ELECTROFILL USING SACRIFICIAL OXIDANTS
- Publication number 20190271094
- Publication date Sep 5, 2019
- LAM RESEARCH CORPORATION
- Lee J. Brogan
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
REMOVAL OF ELECTROPLATING BATH ADDITIVES
- Publication number 20190203375
- Publication date Jul 4, 2019
- LAM RESEARCH CORPORATION
- Tighe A. Spurlin
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
LOW COPPER ELECTROPLATING SOLUTIONS FOR FILL AND DEFECT CONTROL
- Publication number 20190145017
- Publication date May 16, 2019
- Novellus Systems, Inc.
- Jian Zhou
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD AND APPARATUS FOR REMOTE PLASMA TREATMENT FOR REDUCING METAL...
- Publication number 20180350670
- Publication date Dec 6, 2018
- LAM RESEARCH CORPORATION
- Tighe A. Spurlin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
MONITORING SURFACE OXIDE ON SEED LAYERS DURING ELECTROPLATING
- Publication number 20180282894
- Publication date Oct 4, 2018
- LAM RESEARCH CORPORATION
- Ludan Huang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PROCESS FOR OPTIMIZING COBALT ELECTROFILL USING SACRIFICIAL OXIDANTS
- Publication number 20180119305
- Publication date May 3, 2018
- LAM RESEARCH CORPORATION
- Lee J. Brogan
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
GAP FILL PROCESS STABILITY MONITORING OF AN ELECTROPLATING PROCESS...
- Publication number 20180080140
- Publication date Mar 22, 2018
- LAM RESEARCH CORPORATION
- Quan Ma
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
DYNAMIC CURRENT DISTRIBUTION CONTROL APPARATUS AND METHOD FOR WAFER...
- Publication number 20180057955
- Publication date Mar 1, 2018
- Novellus Systems, Inc.
- Zhian HE
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
CONFIGURATION AND METHOD OF OPERATION OF AN ELECTRODEPOSITION SYSTE...
- Publication number 20180038007
- Publication date Feb 8, 2018
- Novellus Systems, Inc.
- Kousik Ganesan
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD AND APPARATUS FOR ELECTROPLATING SEMICONDUCTOR WAFER WHEN CO...
- Publication number 20180030611
- Publication date Feb 1, 2018
- Novellus Systems, Inc.
- Tighe A. Spurlin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
DYNAMIC CURRENT DISTRIBUTION CONTROL APPARATUS AND METHOD FOR WAFER...
- Publication number 20170096745
- Publication date Apr 6, 2017
- Novellus Systems, Inc.
- Zhian HE
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
CONTROL OF ELECTROLYTE FLOW DYNAMICS FOR UNIFORM ELECTROPLATING
- Publication number 20160273119
- Publication date Sep 22, 2016
- LAM RESEARCH CORPORATION
- Zhian He
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
CHEMISTRY ADDITIVES AND PROCESS FOR COBALT FILM ELECTRODEPOSITION
- Publication number 20160273117
- Publication date Sep 22, 2016
- LAM RESEARCH CORPORATION
- Natalia V. Doubina
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
GEOMETRY AND PROCESS OPTIMIZATION FOR ULTRA-HIGH RPM PLATING
- Publication number 20160222535
- Publication date Aug 4, 2016
- LAM RESEARCH CORPORATION
- Jian Zhou
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD AND APPARATUS FOR CHARACTERIZING METAL OXIDE REDUCTION
- Publication number 20160111344
- Publication date Apr 21, 2016
- LAM RESEARCH CORPORATION
- Edward C. Opocensky
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
LOW COPPER/HIGH HALIDE ELECTROPLATING SOLUTIONS FOR FILL AND DEFECT...
- Publication number 20160102416
- Publication date Apr 14, 2016
- Novellus Systems, Inc.
- Jian Zhou
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ATMOSPHERIC PLASMA APPARATUS FOR SEMICONDUCTOR PROCESSING
- Publication number 20150376792
- Publication date Dec 31, 2015
- LAM RESEARCH CORPORATION
- Tighe A. Spurlin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROLYTE CONCENTRATION CONTROL SYSTEM FOR HIGH RATE ELECTROPLATING
- Publication number 20150315720
- Publication date Nov 5, 2015
- Novellus Systems, Inc.
- Steven T. Mayer
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD AND APPARATUS FOR PREPARING A SUBSTRATE WITH A SEMI-NOBLE ME...
- Publication number 20150299886
- Publication date Oct 22, 2015
- LAM RESEARCH CORPORATION
- Natalia V. Doubina
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD AND APPARATUS FOR REMOTE PLASMA TREATMENT FOR REDUCING METAL...
- Publication number 20150072538
- Publication date Mar 12, 2015
- LAM RESEARCH CORPORATION
- Tighe A. Spurlin
- H01 - BASIC ELECTRIC ELEMENTS

Jonathan D. Reid

Person

Patents Grantslast 30 patents

Copper electrofill on non-copper liner layers

Removal of electroplating bath additives

Monitoring surface oxide on seed layers during electroplating

Process for optimizing cobalt electrofill using sacrificial oxidants

Configuration and method of operation of an electrodeposition syste...

Removal of electroplating bath additives

Electrolyte concentration control system for high rate electroplating

Monitoring surface oxide on seed layers during electroplating

Gap fill process stability monitoring of an electroplating process...

Process for optimizing cobalt electrofill using sacrificial oxidants

Low copper electroplating solutions for fill and defect control

Dynamic current distribution control apparatus and method for wafer...

Method and apparatus for filling interconnect structures

Method and apparatus for remote plasma treatment for reducing metal...

Dynamic current distribution control apparatus and method for wafer...

Configuration and method of operation of an electrodeposition syste...

Method and apparatus for electroplating semiconductor wafer when co...

Control of electrolyte flow dynamics for uniform electroplating

Chemistry additives and process for cobalt film electrodeposition

Geometry and process optimization for ultra-high RPM plating

Method and apparatus for characterizing metal oxide reduction

Current ramping and current pulsing entry of substrates for electro...

Method and apparatus for electroplating

Electrolyte concentration control system for high rate electroplating

Control of electrolyte composition in a copper electroplating appar...

Dynamic current distribution control apparatus and method for wafer...

Process for through silicon via filling

Tungsten barrier and seed for copper filled TSV

Copper electroplating process for uniform across wafer deposition a...

Method of electroplating using a high resistance ionic current source

Patents Applicationslast 30 patents

ELECTROFILL FROM ALKALINE ELECTROPLATING SOLUTIONS

WET FUNCTIONALIZATION OF DIELECTRIC SURFACES

ELECTROPLATING COBALT, NICKEL, AND ALLOYS THEREOF

LEVELING COMPOUND CONTROL

INTERCONNECT STRUCTURE WITH SELECTIVE ELECTROPLATED VIA FILL

PROTECTION OF SEED LAYERS DURING ELECTRODEPOSITION OF METALS IN SEM...

ELECTRODEPOSITION OF COBALT TUNGSTEN FILMS

COPPER ELECTROFILL ON NON-COPPER LINER LAYERS

REMOVAL OF ELECTROPLATING BATH ADDITIVES

MONITORING SURFACE OXIDE ON SEED LAYERS DURING ELECTROPLATING

PROCESS FOR OPTIMIZING COBALT ELECTROFILL USING SACRIFICIAL OXIDANTS

REMOVAL OF ELECTROPLATING BATH ADDITIVES

LOW COPPER ELECTROPLATING SOLUTIONS FOR FILL AND DEFECT CONTROL

METHOD AND APPARATUS FOR REMOTE PLASMA TREATMENT FOR REDUCING METAL...

MONITORING SURFACE OXIDE ON SEED LAYERS DURING ELECTROPLATING

PROCESS FOR OPTIMIZING COBALT ELECTROFILL USING SACRIFICIAL OXIDANTS

GAP FILL PROCESS STABILITY MONITORING OF AN ELECTROPLATING PROCESS...

DYNAMIC CURRENT DISTRIBUTION CONTROL APPARATUS AND METHOD FOR WAFER...

CONFIGURATION AND METHOD OF OPERATION OF AN ELECTRODEPOSITION SYSTE...

METHOD AND APPARATUS FOR ELECTROPLATING SEMICONDUCTOR WAFER WHEN CO...

DYNAMIC CURRENT DISTRIBUTION CONTROL APPARATUS AND METHOD FOR WAFER...

CONTROL OF ELECTROLYTE FLOW DYNAMICS FOR UNIFORM ELECTROPLATING

CHEMISTRY ADDITIVES AND PROCESS FOR COBALT FILM ELECTRODEPOSITION

GEOMETRY AND PROCESS OPTIMIZATION FOR ULTRA-HIGH RPM PLATING

METHOD AND APPARATUS FOR CHARACTERIZING METAL OXIDE REDUCTION

LOW COPPER/HIGH HALIDE ELECTROPLATING SOLUTIONS FOR FILL AND DEFECT...

ATMOSPHERIC PLASMA APPARATUS FOR SEMICONDUCTOR PROCESSING

ELECTROLYTE CONCENTRATION CONTROL SYSTEM FOR HIGH RATE ELECTROPLATING

METHOD AND APPARATUS FOR PREPARING A SUBSTRATE WITH A SEMI-NOBLE ME...

METHOD AND APPARATUS FOR REMOTE PLASMA TREATMENT FOR REDUCING METAL...