Jonathan H. Harris

Person

Pepper Pike, OH, US

People

Patents Grantslast 30 patents

Information Patent Grant
Transient liquid phase, pressureless joining of aluminum nitride co...
- Patent number 9,340,462
- Issue date May 17, 2016
- Oasis Materials Corporation
- Jonathan H. Harris
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Microcircuit package having ductile layer
- Patent number RE43807
- Issue date Nov 20, 2012
- IQLP, LLC
- Michael A. Zimmerman
- 257 - Active solid-state devices
Information Patent Grant
Microcircuit package having ductile layer
- Patent number 7,679,185
- Issue date Mar 16, 2010
- Interplex QLP, Inc.
- Michael A. Zimmerman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die attachment utilizing grooved surfaces
- Patent number 6,399,182
- Issue date Jun 4, 2002
- CMC Wireless Components, Inc.
- Erich K. Rubel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for making a low electrical resistivity, high purity alumin...
- Patent number 6,017,485
- Issue date Jan 25, 2000
- Carborundum Corporation
- Rudolph C. Enck
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Method of forming an aluminum nitride article utilizing a platinum...
- Patent number 5,888,446
- Issue date Mar 30, 1999
- International Business Machines Corporation
- Jon A. Casey
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Low temperature sintered, resistive aluminum nitride ceramics
- Patent number 5,773,377
- Issue date Jun 30, 1998
- Crystalline Materials Corporation
- Jonathan H. Harris
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Aluminum nitride body having graded metallurgy
- Patent number 5,763,093
- Issue date Jun 9, 1998
- International Business Machines Corporation
- Jon Alfred Casey
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Aluminum nitride body having graded metallurgy
- Patent number 5,682,589
- Issue date Oct 28, 1997
- International Business Machines Corporation
- Jon Alfred Casey
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Aluminum nitride body having graded metallurgy
- Patent number 5,552,232
- Issue date Sep 3, 1996
- International Business Machines Corporation
- Jon A. Casey
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Aluminum nitride body having graded metallurgy
- Patent number 5,552,107
- Issue date Sep 3, 1996
- Jon A. Casey
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Low temperature sintering route for aluminum nitride ceramics
- Patent number 5,541,145
- Issue date Jul 30, 1996
- The Carborundum Company/IBM Corporation
- Jonathan H. Harris
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Low temperature sintering route for aluminum nitride ceramics
- Patent number 5,424,261
- Issue date Jun 13, 1995
- The Carborundum Company
- Jonathan H. Harris
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES

Patents Applicationslast 30 patents

Information Patent Application
Thermocompression bonding apparatus and method
- Publication number 20160150594
- Publication date May 26, 2016
- Stephen Nootens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Low Cost Manufacture of High Reflectivity Aluminum Nitride Substrates
- Publication number 20140066287
- Publication date Mar 6, 2014
- Jonathan H. HARRIS
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
Transient liquid phase, pressureless joining of aluminum nitride co...
- Publication number 20130319762
- Publication date Dec 5, 2013
- Jonathan H. Harris
- B32 - LAYERED PRODUCTS
Information Patent Application
Microcircuit package having ductile layer
- Publication number 20080128908
- Publication date Jun 5, 2008
- QUANTUM LEAP PACKAGING, INC.
- Michael A. Zimmerman
- H01 - BASIC ELECTRIC ELEMENTS

Jonathan H. Harris

Person

Patents Grantslast 30 patents

Transient liquid phase, pressureless joining of aluminum nitride co...

Microcircuit package having ductile layer

Microcircuit package having ductile layer

Die attachment utilizing grooved surfaces

Process for making a low electrical resistivity, high purity alumin...

Method of forming an aluminum nitride article utilizing a platinum...

Low temperature sintered, resistive aluminum nitride ceramics

Aluminum nitride body having graded metallurgy

Aluminum nitride body having graded metallurgy

Aluminum nitride body having graded metallurgy

Aluminum nitride body having graded metallurgy

Low temperature sintering route for aluminum nitride ceramics

Low temperature sintering route for aluminum nitride ceramics

Patents Applicationslast 30 patents

Thermocompression bonding apparatus and method

Low Cost Manufacture of High Reflectivity Aluminum Nitride Substrates

Transient liquid phase, pressureless joining of aluminum nitride co...

Microcircuit package having ductile layer