Jong Wook Ju

Person

Bubal-eub Icheon-Si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit package system with overhang die
- Patent number 8,956,914
- Issue date Feb 17, 2015
- Stats Chippac Ltd.
- Ja Eun Yun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package system with offset stack
- Patent number 8,659,175
- Issue date Feb 25, 2014
- Stats Chippac Ltd.
- Jong Wook Ju
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Workpiece displacement system
- Patent number 8,632,112
- Issue date Jan 21, 2014
- Stats Chippac Ltd.
- Hyunjoo Kim
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Grant
Adhesive/spacer island structure for multiple die package
- Patent number 8,623,704
- Issue date Jan 7, 2014
- ChipPAC, Inc.
- Sang Ho Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked integrated circuit package-in-package system and method of...
- Patent number 8,617,924
- Issue date Dec 31, 2013
- Stats Chippac Ltd.
- OhSug Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with collapsed multi-integratio...
- Patent number 8,569,882
- Issue date Oct 29, 2013
- Stats Chippac Ltd.
- WonJun Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive/spacer island structure for stacking over wire bonded die
- Patent number 8,552,551
- Issue date Oct 8, 2013
- ChipPAC, Inc.
- Sang Ho Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with heat spreader and method o...
- Patent number 8,415,204
- Issue date Apr 9, 2013
- Stats Chippac Ltd.
- JaEun Yun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package system including honeycomb molding
- Patent number 8,217,501
- Issue date Jul 10, 2012
- Stats Chippac Ltd.
- Hyeog Chan Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package system including die having relieved act...
- Patent number 8,143,102
- Issue date Mar 27, 2012
- Stats Chippac Ltd.
- Byung Tai Do
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package system with package integration
- Patent number 8,067,275
- Issue date Nov 29, 2011
- Stats Chippac Ltd.
- WonJun Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package system with planar interconnects
- Patent number 8,067,831
- Issue date Nov 29, 2011
- Stats Chippac Ltd.
- Hyeog Chan Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked integrated circuit package-in-package system
- Patent number 7,772,683
- Issue date Aug 10, 2010
- Stats Chippac Ltd.
- Ki Youn Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid stacking package system
- Patent number 7,763,961
- Issue date Jul 27, 2010
- Stats Chippac Ltd.
- Seung Wook Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package system including honeycomb molding
- Patent number 7,737,539
- Issue date Jun 15, 2010
- Stats Chippac Ltd.
- Hyeog Chan Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked integrated circuit package-in-package system
- Patent number 7,635,913
- Issue date Dec 22, 2009
- Stats Chippac Ltd.
- OhSug Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked integrated circuit package system with connection protection
- Patent number 7,443,037
- Issue date Oct 28, 2008
- Stats Chippac Ltd.
- Hyun Joung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip packaging method with individually placed film a...
- Patent number 7,306,971
- Issue date Dec 11, 2007
- Chippac Inc.
- Jin-Wook Jeong
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH COLLAPSED MULTI-INTEGRATIO...
- Publication number 20120241980
- Publication date Sep 27, 2012
- WonJun Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH BUMP BONDED DIES AND METHO...
- Publication number 20120224332
- Publication date Sep 6, 2012
- JaEun Yun
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH HEAT SPREADER AND METHOD O...
- Publication number 20100244236
- Publication date Sep 30, 2010
- JaEun Yun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM INCLUDING HONEYCOMB MOLDING
- Publication number 20100237488
- Publication date Sep 23, 2010
- Hyeog Chan Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED INTEGRATED CIRCUIT PACKAGE-IN-PACKAGE SYSTEM AND METHOD OF...
- Publication number 20100044849
- Publication date Feb 25, 2010
- OhSug Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH PACKAGE INTEGRATION
- Publication number 20090155961
- Publication date Jun 18, 2009
- WonJun Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM INCLUDING DIE HAVING RELIEVED ACT...
- Publication number 20090091042
- Publication date Apr 9, 2009
- Byung Tai Do
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH OVERHANG DIE
- Publication number 20090001613
- Publication date Jan 1, 2009
- Ja Eun Yun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED INTEGRATED CIRCUIT PACKAGE-IN-PACKAGE SYSTEM
- Publication number 20080136007
- Publication date Jun 12, 2008
- STATS ChipPAC Ltd.
- OhSug Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED INTEGRATED CIRCUIT PACKAGE-IN-PACKAGE SYSTEM
- Publication number 20080136006
- Publication date Jun 12, 2008
- STATS ChipPAC Ltd.
- Ki Youn Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WORKPIECE DISPLACEMENT SYSTEM
- Publication number 20080066511
- Publication date Mar 20, 2008
- STATS ChipPAC Ltd.
- Hyunjoo Kim
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH OFFSET STACK
- Publication number 20070296086
- Publication date Dec 27, 2007
- Jong Wook Ju
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID STACKING PACKAGE SYSTEM
- Publication number 20070235879
- Publication date Oct 11, 2007
- STATS ChipPAC Ltd.
- Seung Wook Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED INTEGRATED CIRCUIT PACKAGE SYSTEM WITH CONNECTION PROTECTION
- Publication number 20070229107
- Publication date Oct 4, 2007
- STATS ChipPAC Ltd.
- Hyun Joung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Adhesive/Spacer Island Structure for Multiple Die Package
- Publication number 20070015314
- Publication date Jan 18, 2007
- ChipPAC, Inc.
- Sang Ho Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Adhesive/spacer island structure for stacking over wire bonded die
- Publication number 20050269676
- Publication date Dec 8, 2005
- ChipPAC, Inc.
- Sang Ho Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Adhesive/spacer island structure for multiple die package
- Publication number 20050258527
- Publication date Nov 24, 2005
- ChipPAC, Inc.
- Sang Ho Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die to substrate attach using printed adhesive
- Publication number 20050208700
- Publication date Sep 22, 2005
- ChipPAC, Inc.
- Hyeog Chan Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor chip packaging method with individually placed film a...
- Publication number 20050208701
- Publication date Sep 22, 2005
- ChipPAC, Inc.
- Jin-Wook Jeong
- H01 - BASIC ELECTRIC ELEMENTS

Jong Wook Ju

Person

Patents Grantslast 30 patents

Integrated circuit package system with overhang die

Integrated circuit package system with offset stack

Workpiece displacement system

Adhesive/spacer island structure for multiple die package

Stacked integrated circuit package-in-package system and method of...

Integrated circuit packaging system with collapsed multi-integratio...

Adhesive/spacer island structure for stacking over wire bonded die

Integrated circuit packaging system with heat spreader and method o...

Integrated circuit package system including honeycomb molding

Integrated circuit package system including die having relieved act...

Integrated circuit package system with package integration

Integrated circuit package system with planar interconnects

Stacked integrated circuit package-in-package system

Hybrid stacking package system

Integrated circuit package system including honeycomb molding

Stacked integrated circuit package-in-package system

Stacked integrated circuit package system with connection protection

Semiconductor chip packaging method with individually placed film a...

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH COLLAPSED MULTI-INTEGRATIO...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH BUMP BONDED DIES AND METHO...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH HEAT SPREADER AND METHOD O...

INTEGRATED CIRCUIT PACKAGE SYSTEM INCLUDING HONEYCOMB MOLDING

STACKED INTEGRATED CIRCUIT PACKAGE-IN-PACKAGE SYSTEM AND METHOD OF...

INTEGRATED CIRCUIT PACKAGE SYSTEM WITH PACKAGE INTEGRATION

INTEGRATED CIRCUIT PACKAGE SYSTEM INCLUDING DIE HAVING RELIEVED ACT...

INTEGRATED CIRCUIT PACKAGE SYSTEM WITH OVERHANG DIE

STACKED INTEGRATED CIRCUIT PACKAGE-IN-PACKAGE SYSTEM

STACKED INTEGRATED CIRCUIT PACKAGE-IN-PACKAGE SYSTEM

WORKPIECE DISPLACEMENT SYSTEM

INTEGRATED CIRCUIT PACKAGE SYSTEM WITH OFFSET STACK

HYBRID STACKING PACKAGE SYSTEM

STACKED INTEGRATED CIRCUIT PACKAGE SYSTEM WITH CONNECTION PROTECTION

Adhesive/Spacer Island Structure for Multiple Die Package

Adhesive/spacer island structure for stacking over wire bonded die

Adhesive/spacer island structure for multiple die package

Die to substrate attach using printed adhesive

Semiconductor chip packaging method with individually placed film a...