Jonnie Chuang

Person

Pan Chiao City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Package for a light emitting diode and method for fabricating the same
- Patent number 8,137,999
- Issue date Mar 20, 2012
- Harvatek Corporation
- Bily Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Penetrating hole type LED chip package structure using a ceramic ma...
- Patent number 8,003,413
- Issue date Aug 23, 2011
- Harvatek Corporation
- Bily Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LED chip package structure with high-efficiency light-emitting effe...
- Patent number 7,951,621
- Issue date May 31, 2011
- Harvatek Corporation
- Bily Wang
- G02 - OPTICS
Information Patent Grant
LED chip package structure with high-efficiency light-emitting effe...
- Patent number 7,923,745
- Issue date Apr 12, 2011
- Harvatek Corporation
- Bily Wang
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Front and rear covering type LED package structure and method for p...
- Patent number 7,842,964
- Issue date Nov 30, 2010
- Harvatek Corporation
- Bily Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LED chip package structure with high-efficiency light-emitting effe...
- Patent number 7,834,365
- Issue date Nov 16, 2010
- Harvatek Corporation
- Bily Wang
- G02 - OPTICS
Information Patent Grant
LED lamp structure and system with high-efficiency heat-dissipating...
- Patent number 7,828,464
- Issue date Nov 9, 2010
- Harvatek Corporation
- Bily Wang
- F21 - LIGHTING
Information Patent Grant
Method for manufacturing an LED chip package structure
- Patent number 7,824,938
- Issue date Nov 2, 2010
- Harvatek Corporation
- Bily Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mold structure for packaging LED chips and method thereof
- Patent number 7,803,641
- Issue date Sep 28, 2010
- Harvatek Corporation
- Bily Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-wavelength white light-emitting structure
- Patent number 7,804,162
- Issue date Sep 28, 2010
- Harvatek Corporation
- Bily Wang
- F21 - LIGHTING
Information Patent Grant
Method for manufacturing a light-emitting diode having high heat-di...
- Patent number 7,749,781
- Issue date Jul 6, 2010
- Harvatek Corporation
- Bily Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Penetrating hole type LED chip package structure using a ceramic ma...
- Patent number 7,741,648
- Issue date Jun 22, 2010
- Harvatek Corporation
- Bily Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High efficiency white light emitting diode and method for manufactu...
- Patent number 7,737,635
- Issue date Jun 15, 2010
- Harvatek Corporation
- Bily Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
White light-emitting device having a cap layer formed from a mixtur...
- Patent number 7,701,124
- Issue date Apr 20, 2010
- Harvatek Corporation
- Bily Wang
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
LED chip package structure using a ceramic material as a substrate...
- Patent number 7,671,373
- Issue date Mar 2, 2010
- Harvatek Corporation
- Bily Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LED chip package structure with a plurality of thick guiding pins a...
- Patent number 7,671,374
- Issue date Mar 2, 2010
- Harvatek Corporation
- Bily Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a substrate structure for increasing cuttin...
- Patent number 7,662,661
- Issue date Feb 16, 2010
- Harvatek Corporation
- Bily Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer level electro-optical semiconductor manufacture fabrication m...
- Patent number 7,655,997
- Issue date Feb 2, 2010
- Harvatek Corporation
- Bily Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laminated light-emitting diode display device and manufacturing met...
- Patent number 7,563,641
- Issue date Jul 21, 2009
- Harvatek Corporation
- Bily Wang
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
LED package structure for increasing light-emitting efficiency and...
- Patent number 7,515,061
- Issue date Apr 7, 2009
- Harvatek Corporation
- Bily Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing high power light-emitting device package an...
- Patent number 7,485,480
- Issue date Feb 3, 2009
- Harvatek Corporation
- Bily Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor substrate structure and processing method thereof
- Patent number 7,303,984
- Issue date Dec 4, 2007
- Harvatek Corporation
- Bily Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package structure for semiconductor
- Patent number 7,276,782
- Issue date Oct 2, 2007
- Harvatek Corporation
- Billy Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lighting module
- Patent number 7,255,463
- Issue date Aug 14, 2007
- Harvatek Corporation
- Bily Wang
- F21 - LIGHTING
Information Patent Grant
Backlight module
- Patent number 7,237,938
- Issue date Jul 3, 2007
- Harvatek Corporation
- Bily Wang
- G02 - OPTICS
Information Patent Grant
LED package structure and method for making the same
- Patent number 7,211,882
- Issue date May 1, 2007
- Harvatek Corporation
- Bily Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Water-cooling heat dissipation device adopted for modulized LEDs
- Patent number 7,140,753
- Issue date Nov 28, 2006
- Harvatek Corporation
- Bily Wang
- F21 - LIGHTING
Information Patent Grant
Circuit board for large screen LED matrix array display
- Patent number 7,142,181
- Issue date Nov 28, 2006
- Harvatek Corporation
- Bily Wang
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
LED packaging structure
- Patent number 7,049,639
- Issue date May 23, 2006
- Harvatek Corporation
- Bily Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Light-emitting diode
- Patent number D511328
- Issue date Nov 8, 2005
- Harvatek Corporation
- Bily Wang
- D13 - Equipment for production, distribution, or transformation of energy

Patents Applicationslast 30 patents

Information Patent Application
WAFER LEVEL LED PACKAGE STRUCTURE FOR INCREASING LIGHT-EMITTING EFF...
- Publication number 20120094407
- Publication date Apr 19, 2012
- HARVATEK CORPORATION
- Bily Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A LED CHIP PACKAGE STRUCTURE
- Publication number 20120009700
- Publication date Jan 12, 2012
- HARVATEK CORPORATION
- BILY WANG
- G02 - OPTICS
Information Patent Application
LED CHIP PACKAGE STRUCTURE
- Publication number 20120001203
- Publication date Jan 5, 2012
- HARVATEK CORPORATION
- BILY WANG
- G02 - OPTICS
Information Patent Application
PACKAGE FOR A LIGHT EMITTING DIODE AND METHOD FOR FABRICATING THE SAME
- Publication number 20110300649
- Publication date Dec 8, 2011
- HARVATEK CORPORATION
- Bily Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-GUIDING STRUCTURE WITH PHOSPHOR MATERIAL LAYERS
- Publication number 20110170317
- Publication date Jul 14, 2011
- BILY WANG
- G02 - OPTICS
Information Patent Application
WAFER LEVEL LED PACKAGE STRUCTURE FOR INCREASING LIGHT-EMITTING EFF...
- Publication number 20100301349
- Publication date Dec 2, 2010
- HARVATEK CORPORATION
- Bily Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-GUIDING STRUCTURE WITH PHOSPHOR MATERIAL LAYERS
- Publication number 20100271844
- Publication date Oct 28, 2010
- Harvatek Corporation
- Bily Wang
- G02 - OPTICS
Information Patent Application
LED chip package structure with high-efficiency light-emitting effe...
- Publication number 20100099207
- Publication date Apr 22, 2010
- Bily Wang
- G02 - OPTICS
Information Patent Application
LED chip package structure and method for manufacturing the same
- Publication number 20090246897
- Publication date Oct 1, 2009
- Bily Wang
- G02 - OPTICS
Information Patent Application
Package for a light emitting diode and a process for fabricating th...
- Publication number 20090239319
- Publication date Sep 24, 2009
- Bily Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Led chip package structre with a plurality of thick guiding and a m...
- Publication number 20090186434
- Publication date Jul 23, 2009
- Bily Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-wavelength white light-emitting structure
- Publication number 20090152574
- Publication date Jun 18, 2009
- Bily Wang
- F21 - LIGHTING
Information Patent Application
Penetrating hole type LED chip package structure using a ceramic ma...
- Publication number 20090124032
- Publication date May 14, 2009
- Bily Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LED chip package structure with high-efficiency light-emitting effe...
- Publication number 20090065789
- Publication date Mar 12, 2009
- Bily Wang
- G02 - OPTICS
Information Patent Application
Front and rear covering type LED package structure and method for p...
- Publication number 20090050922
- Publication date Feb 26, 2009
- Bily Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LED CHIP PACKAGE STRUCTURE WITH HIGH-EFFICIENCY LIGHT-EMITTING EFFE...
- Publication number 20090020770
- Publication date Jan 22, 2009
- HARVATEK CORPORATION
- Bily Wang
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Method of manufacturing high power light-emitting device package an...
- Publication number 20090014745
- Publication date Jan 15, 2009
- Bily Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LED lamp structure and system with high-efficiency heat-dissipating...
- Publication number 20090009999
- Publication date Jan 8, 2009
- Bily Wang
- F21 - LIGHTING
Information Patent Application
Penetrating hole type LED chip package structure using a ceramic ma...
- Publication number 20090008656
- Publication date Jan 8, 2009
- Bily Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITION OF LED FRAME BODY AND MANUFACTURING METHOD THEREOF
- Publication number 20080246185
- Publication date Oct 9, 2008
- Bily Wang
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
MANUFACTURING METHOD OF WHITE LIGHT LED AND STRUCTURE THEREOF
- Publication number 20080246397
- Publication date Oct 9, 2008
- Bily Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A LIGHT-EMITTING DIODE HAVING HIGH HEAT-DI...
- Publication number 20080194048
- Publication date Aug 14, 2008
- Bily WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DIODE STRUCTURE WITH HIGH HEAT DISSIPATION
- Publication number 20080191235
- Publication date Aug 14, 2008
- Bily WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LED CHIP PACKAGE STRUCTURE WITH A PLURALITY OF THICK GUIDING PINS A...
- Publication number 20080179604
- Publication date Jul 31, 2008
- HARVATEK CORPORATION
- BILY WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LED chip package structure using a ceramic material as a substrate...
- Publication number 20080173881
- Publication date Jul 24, 2008
- Bily Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLD STRUCTURE FOR PACKAGING LED CHIPS AND METHOD THEREOF
- Publication number 20080160658
- Publication date Jul 3, 2008
- HARVATEK CORPORATION
- BILY WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LED package structure for increasing light-emitting effiency and me...
- Publication number 20080099778
- Publication date May 1, 2008
- Bily Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing high power light-emitting device package an...
- Publication number 20080073662
- Publication date Mar 27, 2008
- Bily Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LED chip package structure and method for manufacturing the same
- Publication number 20080012035
- Publication date Jan 17, 2008
- Bily Wang
- G02 - OPTICS
Information Patent Application
Modular lamp structure
- Publication number 20070297177
- Publication date Dec 27, 2007
- Bily Wang
- F21 - LIGHTING

Jonnie Chuang

Person

Patents Grantslast 30 patents

Package for a light emitting diode and method for fabricating the same

Penetrating hole type LED chip package structure using a ceramic ma...

LED chip package structure with high-efficiency light-emitting effe...

LED chip package structure with high-efficiency light-emitting effe...

Front and rear covering type LED package structure and method for p...

LED chip package structure with high-efficiency light-emitting effe...

LED lamp structure and system with high-efficiency heat-dissipating...

Method for manufacturing an LED chip package structure

Mold structure for packaging LED chips and method thereof

Multi-wavelength white light-emitting structure

Method for manufacturing a light-emitting diode having high heat-di...

Penetrating hole type LED chip package structure using a ceramic ma...

High efficiency white light emitting diode and method for manufactu...

White light-emitting device having a cap layer formed from a mixtur...

LED chip package structure using a ceramic material as a substrate...

LED chip package structure with a plurality of thick guiding pins a...

Method of manufacturing a substrate structure for increasing cuttin...

Wafer level electro-optical semiconductor manufacture fabrication m...

Laminated light-emitting diode display device and manufacturing met...

LED package structure for increasing light-emitting efficiency and...

Method of manufacturing high power light-emitting device package an...

Semiconductor substrate structure and processing method thereof

Package structure for semiconductor

Lighting module

Backlight module

LED package structure and method for making the same

Water-cooling heat dissipation device adopted for modulized LEDs

Circuit board for large screen LED matrix array display

LED packaging structure

Light-emitting diode

Patents Applicationslast 30 patents

WAFER LEVEL LED PACKAGE STRUCTURE FOR INCREASING LIGHT-EMITTING EFF...

METHOD OF MANUFACTURING A LED CHIP PACKAGE STRUCTURE

LED CHIP PACKAGE STRUCTURE

PACKAGE FOR A LIGHT EMITTING DIODE AND METHOD FOR FABRICATING THE SAME

LIGHT-GUIDING STRUCTURE WITH PHOSPHOR MATERIAL LAYERS

WAFER LEVEL LED PACKAGE STRUCTURE FOR INCREASING LIGHT-EMITTING EFF...

LIGHT-GUIDING STRUCTURE WITH PHOSPHOR MATERIAL LAYERS

LED chip package structure with high-efficiency light-emitting effe...

LED chip package structure and method for manufacturing the same

Package for a light emitting diode and a process for fabricating th...

Led chip package structre with a plurality of thick guiding and a m...

Multi-wavelength white light-emitting structure

Penetrating hole type LED chip package structure using a ceramic ma...

LED chip package structure with high-efficiency light-emitting effe...

Front and rear covering type LED package structure and method for p...

LED CHIP PACKAGE STRUCTURE WITH HIGH-EFFICIENCY LIGHT-EMITTING EFFE...

Method of manufacturing high power light-emitting device package an...

LED lamp structure and system with high-efficiency heat-dissipating...

Penetrating hole type LED chip package structure using a ceramic ma...

COMPOSITION OF LED FRAME BODY AND MANUFACTURING METHOD THEREOF

MANUFACTURING METHOD OF WHITE LIGHT LED AND STRUCTURE THEREOF

METHOD FOR MANUFACTURING A LIGHT-EMITTING DIODE HAVING HIGH HEAT-DI...

LIGHT EMITTING DIODE STRUCTURE WITH HIGH HEAT DISSIPATION

LED CHIP PACKAGE STRUCTURE WITH A PLURALITY OF THICK GUIDING PINS A...

LED chip package structure using a ceramic material as a substrate...

MOLD STRUCTURE FOR PACKAGING LED CHIPS AND METHOD THEREOF

LED package structure for increasing light-emitting effiency and me...

Method of manufacturing high power light-emitting device package an...

LED chip package structure and method for manufacturing the same

Modular lamp structure