Jorge Munoz

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Cypress, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Chip-scale package
- Patent number 6,984,890
- Issue date Jan 10, 2006
- International Rectifier Corporation
- Bharat Shivkumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-scale package
- Patent number 6,776,399
- Issue date Aug 17, 2004
- International Rectifier Corporation
- Bharat Shivkumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-scale package
- Patent number 6,410,989
- Issue date Jun 25, 2002
- International Rectifier Corporation
- Bharat Shivkumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 6,396,127
- Issue date May 28, 2002
- International Rectifier Corporation
- Jorge Munoz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder-on back metal for semiconductor die
- Patent number 6,376,910
- Issue date Apr 23, 2002
- International Rectifier Corporation
- Jorge Munoz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 6,040,626
- Issue date Mar 21, 2000
- International Rectifier Corp.
- Chuan Cheah
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Small-Outline Package for a Power Transistor
- Publication number 20130049079
- Publication date Feb 28, 2013
- INTERNATIONAL RECTIFIER CORPORATION
- Jorge Munoz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip-scale package
- Publication number 20040238971
- Publication date Dec 2, 2004
- International Rectifier Corporation
- Bharat Shivkumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip-scale package
- Publication number 20020135079
- Publication date Sep 26, 2002
- International Rectifier Corporation
- Bharat Shivkumar
- H01 - BASIC ELECTRIC ELEMENTS