Joseph Funari

Person

Vestal, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Process for manufacturing boards that can accept a pluggable tab mo...
- Patent number 6,070,785
- Issue date Jun 6, 2000
- International Business Machines Corporation
- Joseph George Ameen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection of a carrier substrate and a semiconductor device
- Patent number 5,920,125
- Issue date Jul 6, 1999
- International Business Machines Corporation
- James Vernon Ellerson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer-multi-chip pyramid and circuit board structure and meth...
- Patent number 5,907,903
- Issue date Jun 1, 1999
- International Business Machines Corporation
- Joseph George Ameen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection of a carrier substrate and a semiconductor device
- Patent number 5,859,470
- Issue date Jan 12, 1999
- International Business Machines Corporation
- James Vernon Ellerson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit boards that can accept a pluggable tab module that can be a...
- Patent number 5,744,759
- Issue date Apr 28, 1998
- International Business Machines Corporation
- Joseph George Ameen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer, multi-chip pyramid and circuit board structure
- Patent number 5,715,144
- Issue date Feb 3, 1998
- International Business Machines Corporation
- Joseph George Ameen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for soldering with a multiple tip and associat...
- Patent number 5,565,119
- Issue date Oct 15, 1996
- International Business Machines Corporation
- John R. Behun
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Interconnection of a carrier substrate and a semiconductor device
- Patent number 5,553,769
- Issue date Sep 10, 1996
- International Business Machine Corporation
- James V. Ellerson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible circuit member
- Patent number 5,435,732
- Issue date Jul 25, 1995
- International Business Machines Corporation
- Christopher G. Angulas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayered flexible circuit package
- Patent number 5,321,884
- Issue date Jun 21, 1994
- International Business Machines Corporation
- Joseph G. Ameen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for bonding flexible circuit to circuitized substrate to pro...
- Patent number 5,261,155
- Issue date Nov 16, 1993
- International Business Machines Corporation
- Christopher G. Angulas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mutlilayered flexible circuit package
- Patent number 5,241,454
- Issue date Aug 31, 1993
- International Business Machines Corporation
- Joseph G. Ameen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for soldering a semiconductor device to a circuitized sub...
- Patent number 5,222,649
- Issue date Jun 29, 1993
- International Business Machines
- Joseph Funari
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of applying solder
- Patent number 5,211,328
- Issue date May 18, 1993
- International Business Machines
- Joseph G. Ameen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for soldering a semiconductor device to a circuitized substrate
- Patent number 5,207,372
- Issue date May 4, 1993
- International Business Machines
- Joseph Funari
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of bonding flexible circuit to cicuitized substrate to provi...
- Patent number 5,203,075
- Issue date Apr 20, 1993
- Inernational Business Machines
- Christopher G. Angulas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ozone safe stripping solution for thermal grease
- Patent number 5,190,595
- Issue date Mar 2, 1993
- International Business Machines Corporation
- Joseph G. Ameen
- B08 - CLEANING
Information Patent Grant
Method for bonding thin film electronic device
- Patent number 5,115,964
- Issue date May 26, 1992
- International Business Machines Corporation
- Joseph G. Ameen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pluggable electronic circuit package assembly with snap together he...
- Patent number 5,109,318
- Issue date Apr 28, 1992
- International Business Machines Corporation
- Joseph Funari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film electronic device
- Patent number 5,057,969
- Issue date Oct 15, 1991
- International Business Machines Corporation
- Joseph G. Ameen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Epoxy composition and use thereof
- Patent number 5,028,984
- Issue date Jul 2, 1991
- International Business Machines Corporation
- Joseph G. Ameen
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Electronic assembly with enhanced heat sinking
- Patent number 5,003,429
- Issue date Mar 26, 1991
- International Business Machines Corporation
- Don L. Baker
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic package with improved heat sink
- Patent number 4,849,856
- Issue date Jul 18, 1989
- International Business Machines Corp.
- Joseph Funari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure containing a layer consisting of a polyimide and an organ...
- Patent number 4,670,325
- Issue date Jun 2, 1987
- IBM Corporation
- Peter Bakos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pinned ceramic substrate
- Patent number 4,434,134
- Issue date Feb 28, 1984
- International Business Machines Corporation
- Russell E. Darrow
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Spray head apparatus
- Patent number 4,392,617
- Issue date Jul 12, 1983
- International Business Machines Corporation
- Peter Bakos
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Composition containing alcohol and use thereof for epoxy removal
- Patent number 4,294,729
- Issue date Oct 13, 1981
- International Business Machines Corporation
- Peter Bakos
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Micro-surface welding
- Patent number 4,171,477
- Issue date Oct 16, 1979
- International Business Machines Corporation
- Joseph Funari
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Joseph Funari

Person

Patents Grantslast 30 patents

Process for manufacturing boards that can accept a pluggable tab mo...

Interconnection of a carrier substrate and a semiconductor device

Multi-layer-multi-chip pyramid and circuit board structure and meth...

Interconnection of a carrier substrate and a semiconductor device

Circuit boards that can accept a pluggable tab module that can be a...

Multi-layer, multi-chip pyramid and circuit board structure

Method and apparatus for soldering with a multiple tip and associat...

Interconnection of a carrier substrate and a semiconductor device

Flexible circuit member

Multilayered flexible circuit package

Method for bonding flexible circuit to circuitized substrate to pro...

Mutlilayered flexible circuit package

Apparatus for soldering a semiconductor device to a circuitized sub...

Method of applying solder

Method for soldering a semiconductor device to a circuitized substrate

Method of bonding flexible circuit to cicuitized substrate to provi...

Ozone safe stripping solution for thermal grease

Method for bonding thin film electronic device

Pluggable electronic circuit package assembly with snap together he...

Thin film electronic device

Epoxy composition and use thereof

Electronic assembly with enhanced heat sinking

Electronic package with improved heat sink

Structure containing a layer consisting of a polyimide and an organ...

Pinned ceramic substrate

Spray head apparatus

Composition containing alcohol and use thereof for epoxy removal

Micro-surface welding