Juchen HUANG

Person

Guangdong, CN

People

Patents Applicationslast 30 patents

Information Patent Application
COMPONENT PACKAGE SUBSTRATE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240186230
- Publication date Jun 6, 2024
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE MANUFACTURING METHOD, EMBEDDED SUBSTRATE AND SEMICONDUCTOR
- Publication number 20240153819
- Publication date May 9, 2024
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREFOR
- Publication number 20240113031
- Publication date Apr 4, 2024
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING HIGH-HEAT-DISSIPATION MIXED SUBSTRATE, AND...
- Publication number 20240079287
- Publication date Mar 7, 2024
- Zhuhai ACCESS Semiconductor Co., LTD.
- Xianming CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID CIRCULATING COOLING PACKAGE SUBSTRATE AND MANUFACTURING METH...
- Publication number 20230369167
- Publication date Nov 16, 2023
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE EMBEDDED WITH INTEGRATED INDUCTOR AND MANUFACTURING METHO...
- Publication number 20230361058
- Publication date Nov 9, 2023
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER PLATE FOR PREPARING PACKAGE SUBSTRATE, PACKAGE SUBSTRATE ST...
- Publication number 20230282490
- Publication date Sep 7, 2023
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H01 - BASIC ELECTRIC ELEMENTS

Juchen HUANG

Person

Patents Applicationslast 30 patents

COMPONENT PACKAGE SUBSTRATE STRUCTURE AND MANUFACTURING METHOD THEREOF

SUBSTRATE MANUFACTURING METHOD, EMBEDDED SUBSTRATE AND SEMICONDUCTOR

SEMICONDUCTOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREFOR

METHOD FOR MANUFACTURING HIGH-HEAT-DISSIPATION MIXED SUBSTRATE, AND...

LIQUID CIRCULATING COOLING PACKAGE SUBSTRATE AND MANUFACTURING METH...

SUBSTRATE EMBEDDED WITH INTEGRATED INDUCTOR AND MANUFACTURING METHO...

CARRIER PLATE FOR PREPARING PACKAGE SUBSTRATE, PACKAGE SUBSTRATE ST...