Julian Gonska

Person

Reutlingen, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Micromechanical device and method for manufacturing a micromechanic...
- Patent number 9,988,261
- Issue date Jun 5, 2018
- Robert Bosch GmbH
- Julian Gonska
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micromechanical sensor device and corresponding manufacturing method
- Patent number 9,725,309
- Issue date Aug 8, 2017
- Robert Bosch GmbH
- Julian Gonska
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micromechanical sensor unit and method for manufacturing micromecha...
- Patent number 9,670,055
- Issue date Jun 6, 2017
- Robert Bosch GmbH
- Jochen Reinmuth
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Component including two semiconductor elements, which are bonded to...
- Patent number 9,650,240
- Issue date May 16, 2017
- Robert Bosch GmbH
- Mirko Hattass
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micromechanical component and method for producing a micromechanica...
- Patent number 9,593,011
- Issue date Mar 14, 2017
- Robert Bosch GmbH
- Julian Gonska
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micromechanical component
- Patent number 9,567,212
- Issue date Feb 14, 2017
- Robert Bosch GmbH
- Julian Gonska
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micromechanical sensor device with a getter in an enclosed cavity
- Patent number 9,567,205
- Issue date Feb 14, 2017
- Robert Bosch GmbH
- Jochen Reinmuth
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for bonding two silicon substrates, and a correspondeing sys...
- Patent number 9,123,716
- Issue date Sep 1, 2015
- Robert Bosch GmbH
- Julian Gonska
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Component having a via and method for manufacturing it
- Patent number 8,975,118
- Issue date Mar 10, 2015
- Robert Bosch GmbH
- Julian Gonska
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for attaching a first carrier device to a second carrier dev...
- Patent number 8,530,260
- Issue date Sep 10, 2013
- Robert Bosch GmbH
- Julian Gonska
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micromechanical device which has cavities having different internal...
- Patent number 8,035,209
- Issue date Oct 11, 2011
- Robert Bosch GmbH
- Julian Gonska
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Electrical through-plating of semiconductor chips
- Patent number 7,572,660
- Issue date Aug 11, 2009
- Robert Bosch GmbH
- Hubert Benzel
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micromechanical component having a diaphragm
- Patent number 7,495,302
- Issue date Feb 24, 2009
- Robert Bosch GmbH
- Frank Fischer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for dicing semiconductor chips and corresponding semiconduct...
- Patent number 7,026,224
- Issue date Apr 11, 2006
- Robert Bosch GmbH
- Hubert Benzel
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR PRODUCING A MICROMECHANICAL COMPONENT
- Publication number 20160368763
- Publication date Dec 22, 2016
- ROBERT BOSCH GmbH
- Julian Gonska
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROMECHANICAL SENSOR DEVICE AND CORRESPONDING MANUFACTURING METHOD
- Publication number 20160152466
- Publication date Jun 2, 2016
- ROBERT BOSCH GmbH
- Julian GONSKA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
COMPONENT INCLUDING TWO SEMICONDUCTOR ELEMENTS, WHICH ARE BONDED TO...
- Publication number 20150353349
- Publication date Dec 10, 2015
- Robert Bosch GmbH
- Mirko HATTASS
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
COMPONENT HAVING A VIA AND METHOD FOR MANUFACTURING IT
- Publication number 20150137329
- Publication date May 21, 2015
- ROBERT BOSCH GmbH
- Julian Gonska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Micromechanical sensor unit and method for manufacturing micromecha...
- Publication number 20150123217
- Publication date May 7, 2015
- ROBERT BOSCH GmbH
- Jochen REINMUTH
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROMECHANICAL SENSOR DEVICE AND CORRESPONDING MANUFACTURING METHOD
- Publication number 20150123221
- Publication date May 7, 2015
- ROBERT BOSCH GmbH
- Jochen REINMUTH
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROMECHANICAL COMPONENT
- Publication number 20140117472
- Publication date May 1, 2014
- ROBERT BOSCH GmbH
- Julian Gonska
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROMECHANICAL DEVICE AND METHOD FOR MANUFACTURING A MICROMECHANIC...
- Publication number 20130334622
- Publication date Dec 19, 2013
- ROBERT BOSCH GmbH
- Julian GONSKA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROMECHANICAL COMPONENT AND METHOD FOR MANUFACTURING A MICROMECHA...
- Publication number 20130285175
- Publication date Oct 31, 2013
- ROBERT BOSCH GmbH
- Julian Gonska
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR BONDING TWO SILICON SUBSTRATES, AND A CORRESPONDEING SYS...
- Publication number 20130161820
- Publication date Jun 27, 2013
- Julian GONSKA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Component Having a Via and Method for Manufacturing It
- Publication number 20130147020
- Publication date Jun 13, 2013
- Julian Gonska
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROMECHANICAL COMPONENT AND METHOD FOR PRODUCING A MICROMECHANICA...
- Publication number 20120045628
- Publication date Feb 23, 2012
- Julian Gonska
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method for attaching a first carrier device to a second carrier dev...
- Publication number 20100258884
- Publication date Oct 14, 2010
- Julian Gonska
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROMECHANICAL DEVICE WHICH HAS CAVITIES HAVING DIFFERENT INTERNAL...
- Publication number 20100028618
- Publication date Feb 4, 2010
- Julian Gonska
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method for Accelerated Etching of Silicon
- Publication number 20080254635
- Publication date Oct 16, 2008
- Hubert Benzel
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Micromechanical component having a diaphragm, and method for manufa...
- Publication number 20050204821
- Publication date Sep 22, 2005
- Frank Fischer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Electrical through-plating of semiconductor chips
- Publication number 20050133880
- Publication date Jun 23, 2005
- Hubert Benzel
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method for dicing semiconductor chips and corresponding semiconduct...
- Publication number 20050087843
- Publication date Apr 28, 2005
- Hubert Benzel
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Julian Gonska

Person

Patents Grantslast 30 patents

Micromechanical device and method for manufacturing a micromechanic...

Micromechanical sensor device and corresponding manufacturing method

Micromechanical sensor unit and method for manufacturing micromecha...

Component including two semiconductor elements, which are bonded to...

Micromechanical component and method for producing a micromechanica...

Micromechanical component

Micromechanical sensor device with a getter in an enclosed cavity

Method for bonding two silicon substrates, and a correspondeing sys...

Component having a via and method for manufacturing it

Method for attaching a first carrier device to a second carrier dev...

Micromechanical device which has cavities having different internal...

Electrical through-plating of semiconductor chips

Micromechanical component having a diaphragm

Method for dicing semiconductor chips and corresponding semiconduct...

Patents Applicationslast 30 patents

METHOD FOR PRODUCING A MICROMECHANICAL COMPONENT

MICROMECHANICAL SENSOR DEVICE AND CORRESPONDING MANUFACTURING METHOD

COMPONENT INCLUDING TWO SEMICONDUCTOR ELEMENTS, WHICH ARE BONDED TO...

COMPONENT HAVING A VIA AND METHOD FOR MANUFACTURING IT

Micromechanical sensor unit and method for manufacturing micromecha...

MICROMECHANICAL SENSOR DEVICE AND CORRESPONDING MANUFACTURING METHOD

MICROMECHANICAL COMPONENT

MICROMECHANICAL DEVICE AND METHOD FOR MANUFACTURING A MICROMECHANIC...

MICROMECHANICAL COMPONENT AND METHOD FOR MANUFACTURING A MICROMECHA...

METHOD FOR BONDING TWO SILICON SUBSTRATES, AND A CORRESPONDEING SYS...

Component Having a Via and Method for Manufacturing It

MICROMECHANICAL COMPONENT AND METHOD FOR PRODUCING A MICROMECHANICA...

Method for attaching a first carrier device to a second carrier dev...

MICROMECHANICAL DEVICE WHICH HAS CAVITIES HAVING DIFFERENT INTERNAL...

Method for Accelerated Etching of Silicon

Micromechanical component having a diaphragm, and method for manufa...

Electrical through-plating of semiconductor chips

Method for dicing semiconductor chips and corresponding semiconduct...