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Jun Chung Hsu
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Taoyuan, TW
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Patents Grants
last 30 patents
Information
Patent Grant
Semiconductor packaging substrate fine pitch metal bump and reinfor...
Patent number
11,908,819
Issue date
Feb 20, 2024
Apple Inc.
Jun Chung Hsu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor packaging substrate fine pitch metal bump and reinfor...
Patent number
11,545,455
Issue date
Jan 3, 2023
Apple Inc.
Jun Chung Hsu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Carrier ultra thin substrate
Patent number
9,899,239
Issue date
Feb 20, 2018
Apple Inc.
Jun Chung Hsu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methodology to achieve zero warpage for IC package
Patent number
9,633,953
Issue date
Apr 25, 2017
Apple Inc.
Jun Chung Hsu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of manufacturing a thin support package structure
Patent number
9,351,409
Issue date
May 24, 2016
Kinsus Interconnect Technology Corp.
Hsueh-Ping Chien
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method of final defect inspection
Patent number
8,837,808
Issue date
Sep 16, 2014
Kinsus Interconnect Technology Corp.
Chia-Chi Lo
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Laminate circuit board with a multi-layer circuit structure
Patent number
8,754,328
Issue date
Jun 17, 2014
Kinsus Interconnect Technology Corp.
Jun-Chung Hsu
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Final defect inspection system
Patent number
8,547,548
Issue date
Oct 1, 2013
Kinsus Interconnect Technology Corp.
Chia-Chi Lo
G01 - MEASURING TESTING
Information
Patent Grant
Keyboard structure with antenna function
Patent number
8,519,904
Issue date
Aug 27, 2013
Lite-On Electronics (Guangzhou) Limited
Jun-Ting Hsu
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Solder pad structure with high bondability to solder ball
Patent number
8,315,063
Issue date
Nov 20, 2012
Kinsus Interconnect Technology Corp.
Jun-Chung Hsu
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method for selectively processing surface tension of solder mask la...
Patent number
7,805,835
Issue date
Oct 5, 2010
Kinsus Interconnect Technology Corp.
Hsien-Ming Dai
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Package structure preventing solder overflow on substrate solder pads
Patent number
7,768,131
Issue date
Aug 3, 2010
Kinsus Interconnect Technology Corp.
Jun-Chung Hsu
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method for manufacturing carrier substrate
Patent number
7,662,662
Issue date
Feb 16, 2010
Kinsus Interconnect Technology Corp.
Jun-Chung Hsu
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
Semiconductor Packaging Substrate Fine Pitch Metal Bump and Reinfor...
Publication number
20230115986
Publication date
Apr 13, 2023
Apple Inc.
Jun Chung Hsu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Packaging Substrate Fine Pitch Metal Bump and Reinfor...
Publication number
20200381383
Publication date
Dec 3, 2020
Apple Inc.
Jun Chung Hsu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CARRIER ULTRA THIN SUBSTRATE
Publication number
20180082858
Publication date
Mar 22, 2018
Apple Inc.
Jun Chung Hsu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CARRIER ULTRA THIN SUBSTRATE
Publication number
20170135219
Publication date
May 11, 2017
Apple Inc.
Jun Chung Hsu
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
METHODOLOGY TO ACHIEVE ZERO WARPAGE FOR IC PACKAGE
Publication number
20160071807
Publication date
Mar 10, 2016
Apple Inc.
Jun Chung Hsu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ENHANCED CHIP BOARD PACKAGE STRUCTURE
Publication number
20150271915
Publication date
Sep 24, 2015
KINSUS INTERCONNECT TECHNOLOGY CORP.
Jun-Chung Hsu
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
INSULATION LAYER STRUCTURE
Publication number
20150140262
Publication date
May 21, 2015
KINSUS INTERCONNECT TECHNOLOGY CORP.
Yu-Hsiang SUN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP BOARD PACKAGE STRUCTURE
Publication number
20150041183
Publication date
Feb 12, 2015
KINSUS INTERCONNECT TECHNOLOGY CORP.
Jun-Chung Hsu
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
METHOD OF MANUFACTURING A THIN SUPPORT PACKAGE STRUCTURE
Publication number
20150044359
Publication date
Feb 12, 2015
KINSUS INTERCONNECT TECHNOLOGY CORP.
Hsueh-Ping Chien
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
THIN PACKAGE STRUCTURE WITH ENHANCED STRENGTH
Publication number
20150041205
Publication date
Feb 12, 2015
KINSUS INTERCONNECT TECHNOLOGY CORP.
Hsueh-Ping Chien
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
CIRCUIT BOARD STRUCTURE FOR HIGH FREQUENCY SIGNALS
Publication number
20150027756
Publication date
Jan 29, 2015
KINSUS INTERCONNECT TECHNOLOGY CORP.
Jun-Chung Hsu
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
METHOD OF FINAL DEFECT INSPECTION
Publication number
20140177939
Publication date
Jun 26, 2014
KINSUS INTERCONNECT TECHNOLOGY CORP.
Chia-Chi Lo
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
LAMINATE CIRCUIT BOARD STRUCTURE
Publication number
20130284500
Publication date
Oct 31, 2013
Jun-Chung Hsu
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
METHOD OF MANUFACTURING A LAMINATE CIRCUIT BOARD
Publication number
20130255858
Publication date
Oct 3, 2013
Jun-Chung Hsu
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
LAMINATE CIRCUIT BOARD WITH A MULTI-LAYER CIRCUIT STRUCTURE
Publication number
20130224513
Publication date
Aug 29, 2013
KINSUS INTERCONNECT TECHNOLOGY CORP.
Jun-Chung Hsu
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
METHOD OF MANUFACTURING A LAMINATE CIRCUIT BOARD WITH A MULTILAYER...
Publication number
20130219713
Publication date
Aug 29, 2013
KINSUS INTERCONNECT TECHNOLOGY CORP.
Jun-Chung Hsu
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
KEYBOARD STRUCTURE WITH ANTENNA FUNCTION
Publication number
20120075189
Publication date
Mar 29, 2012
Lite-On Technology Corporation
Jun-Ting HSU
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
Method For Fabricating Carrier Board Having No Conduction Line
Publication number
20110061234
Publication date
Mar 17, 2011
Jun-Chung Hsu
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Flip-Chip Package Structure
Publication number
20110049703
Publication date
Mar 3, 2011
Jun-Chung Hsu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Solder Pad Structure With High Bondability To Solder Ball
Publication number
20110048782
Publication date
Mar 3, 2011
Jun-Chung Hsu
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
Method For Selectively Processing Surface Tension Of Solder Mask La...
Publication number
20090293269
Publication date
Dec 3, 2009
Hsien-Ming Dai
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Method For Manufacturing Carrier Substrate
Publication number
20080222886
Publication date
Sep 18, 2008
Jun-Chung Hsu
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Process for electroplating metal layer without plating lines after...
Publication number
20070111491
Publication date
May 17, 2007
Jun Chung Hsu
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
Bonding pad with high bonding strength to solder ball and bump
Publication number
20070108619
Publication date
May 17, 2007
Jun Chung Hsu
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR