Jun Zhai

Person

Cupertino, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Structure and method for sealing a silicon IC
- Patent number 12,261,132
- Issue date Mar 25, 2025
- Apple Inc.
- Vidhya Ramachandran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple chip module trenched lid and low coefficient of thermal ex...
- Patent number 12,249,599
- Issue date Mar 11, 2025
- Apple Inc.
- Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density 3D interconnect configuration
- Patent number 12,159,835
- Issue date Dec 3, 2024
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Recessed lid and ring designs and lid local peripheral reinforcemen...
- Patent number 12,119,275
- Issue date Oct 15, 2024
- Apple Inc.
- Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selectable monolithic or external scalable die-to-die interconnecti...
- Patent number 12,087,689
- Issue date Sep 10, 2024
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible package architecture concept in fanout
- Patent number 12,074,077
- Issue date Aug 27, 2024
- Apple Inc.
- Karthik Shanmugam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-die fine grain integrated voltage regulation
- Patent number 12,068,324
- Issue date Aug 20, 2024
- Apple Inc.
- Jared L. Zerbe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fully interconnected heterogeneous multi-layer reconstructed silico...
- Patent number 12,033,982
- Issue date Jul 9, 2024
- Apple Inc.
- Jun Zhai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnecting dies by stitch routing
- Patent number 12,021,035
- Issue date Jun 25, 2024
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for fabricating a computing system with an int...
- Patent number 11,967,528
- Issue date Apr 23, 2024
- Apple Inc.
- Vidhya Ramachandran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging substrate fine pitch metal bump and reinfor...
- Patent number 11,908,819
- Issue date Feb 20, 2024
- Apple Inc.
- Jun Chung Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selectable monolithic or external scalable die-to-die interconnecti...
- Patent number 11,862,557
- Issue date Jan 2, 2024
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for sealing a silicon IC
- Patent number 11,824,015
- Issue date Nov 21, 2023
- Apple Inc.
- Vidhya Ramachandran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package including a hybrid thermal interface material an...
- Patent number 11,749,631
- Issue date Sep 5, 2023
- Apple Inc.
- Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density 3D interconnect configuration
- Patent number 11,735,526
- Issue date Aug 22, 2023
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer reconstitution and die-stitching
- Patent number 11,735,567
- Issue date Aug 22, 2023
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die stitching and harvesting of arrayed structures
- Patent number 11,728,266
- Issue date Aug 15, 2023
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power management system switched capacitor voltage regulator with i...
- Patent number 11,699,949
- Issue date Jul 11, 2023
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for fabricating a computing system with an int...
- Patent number 11,670,548
- Issue date Jun 6, 2023
- Apple Inc.
- Vidhya Ramachandran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple chip module trenched lid and low coefficient of thermal ex...
- Patent number 11,646,302
- Issue date May 9, 2023
- Apple Inc.
- Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density interconnection using fanout interposer chiplet
- Patent number 11,594,494
- Issue date Feb 28, 2023
- Apple Inc.
- Jun Zhai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High bandwidth die to die interconnect with package area reduction
- Patent number 11,587,909
- Issue date Feb 21, 2023
- Apple Inc.
- Chonghua Zhong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wearable electronic device with fluid-based pressure sensing
- Patent number 11,561,144
- Issue date Jan 24, 2023
- Apple Inc.
- Caleb C. Han
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor packaging substrate fine pitch metal bump and reinfor...
- Patent number 11,545,455
- Issue date Jan 3, 2023
- Apple Inc.
- Jun Chung Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package integration using fanout cavity substrate
- Patent number 11,532,563
- Issue date Dec 20, 2022
- Apple Inc.
- Karthik Shanmugam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple component integration in fanout package with different bac...
- Patent number 11,515,261
- Issue date Nov 29, 2022
- Apple Inc.
- Karthik Shanmugam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die-to-die routing through a seal ring
- Patent number 11,476,203
- Issue date Oct 18, 2022
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Scalable extreme large size substrate integration
- Patent number 11,404,337
- Issue date Aug 2, 2022
- Apple Inc.
- Kunzhong Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level integration of passive devices
- Patent number 11,398,456
- Issue date Jul 26, 2022
- Apple Inc.
- Jun Zhai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density 3D interconnect configuration
- Patent number 11,309,246
- Issue date Apr 19, 2022
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Power, Signaling and Thermal Path Co-optimization
- Publication number 20250112154
- Publication date Apr 3, 2025
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High Density 3D Interconnect Configuration
- Publication number 20250046715
- Publication date Feb 6, 2025
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Selectable Monolithic or External Scalable Die-to-Die Interconnecti...
- Publication number 20250029921
- Publication date Jan 23, 2025
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Die Fine Grain Integrated Voltage Regulation
- Publication number 20250015033
- Publication date Jan 9, 2025
- Apple Inc.
- Jared L. Zerbe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDING COMPOUND LAYERS IN SEMICONDUCTOR PACKAGES
- Publication number 20250014960
- Publication date Jan 9, 2025
- Apple Inc.
- Jiongxin LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip Singulation Assisted Structures and Methods for Improving Bond...
- Publication number 20240421126
- Publication date Dec 19, 2024
- Apple Inc.
- Chi Nung Ni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Edge Recess Design for Molded and Fusion or Hybrid Bonded Integrate...
- Publication number 20240421013
- Publication date Dec 19, 2024
- Apple Inc.
- Jixuan Gong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package Redistribution Layer Structures for Stress Mitigation and A...
- Publication number 20240395686
- Publication date Nov 28, 2024
- Apple Inc.
- Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR INTERCONNECTING DIES
- Publication number 20240387390
- Publication date Nov 21, 2024
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fully Interconnected Heterogeneous Multi-layer Reconstructed Silico...
- Publication number 20240321833
- Publication date Sep 26, 2024
- Apple Inc.
- Jun Zhai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Selectively Dispensed Underfill and Edge Bond Patterns
- Publication number 20240249989
- Publication date Jul 25, 2024
- Apple Inc.
- Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and Method for Fabricating a Computing System with an Int...
- Publication number 20240243012
- Publication date Jul 18, 2024
- Apple Inc.
- Vidhya Ramachandran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermally Enhanced Chip-on-Wafer or Wafer-on-Wafer Bonding
- Publication number 20240105545
- Publication date Mar 28, 2024
- Apple Inc.
- Jiongxin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D Package with Chip-on-Reconstituted Wafer or Reconstituted Wafer-...
- Publication number 20240105702
- Publication date Mar 28, 2024
- Apple Inc.
- Chonghua Zhong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D Package with Chip-on-Reconstituted Wafer or Reconstituted Wafer-...
- Publication number 20240105704
- Publication date Mar 28, 2024
- Apple Inc.
- Chonghua Zhong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package with Local Interconnect and Chiplet Integration
- Publication number 20240105626
- Publication date Mar 28, 2024
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and Method of Fabrication for High Performance Integrated...
- Publication number 20240088032
- Publication date Mar 14, 2024
- Apple Inc.
- Vidhya Ramachandran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Selectable Monolithic or External Scalable Die-to-Die Interconnecti...
- Publication number 20240047353
- Publication date Feb 8, 2024
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and Method for Sealing a Silicon IC
- Publication number 20240038689
- Publication date Feb 1, 2024
- Apple Inc.
- Vidhya Ramachandran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER RECONSTITUTION AND DIE-STITCHING
- Publication number 20240014178
- Publication date Jan 11, 2024
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE STITCHING AND HARVESTING OF ARRAYED STRUCTURES
- Publication number 20230402373
- Publication date Dec 14, 2023
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and Method for Fabricating a Computing System with an Int...
- Publication number 20230335440
- Publication date Oct 19, 2023
- Apple Inc.
- Vidhya Ramachandran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High Density 3D Interconnect Configuration
- Publication number 20230335494
- Publication date Oct 19, 2023
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Microelectronic Package RDL Patterns to Reduce Stress in RDLs Acros...
- Publication number 20230317624
- Publication date Oct 5, 2023
- Apple Inc.
- Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multiple Chip Module Trenched Lid and Low Coefficient of Thermal Ex...
- Publication number 20230317708
- Publication date Oct 5, 2023
- Apple Inc.
- Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MANAGEMENT SYSTEM SWITCHED CAPACITOR VOLTAGE REGULATOR WITH I...
- Publication number 20230299668
- Publication date Sep 21, 2023
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Harvested Reconstitution Bumping
- Publication number 20230245988
- Publication date Aug 3, 2023
- Kwan-Yu Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY INTERCONNECTION USING FANOUT INTERPOSER CHIPLET
- Publication number 20230223348
- Publication date Jul 13, 2023
- Apple Inc.
- Jun Zhai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH BANDWIDTH DIE TO DIE INTERCONNECT WITH PACKAGE AREA REDUCTION
- Publication number 20230154897
- Publication date May 18, 2023
- Apple Inc.
- Chonghua Zhong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packaging Substrate Fine Pitch Metal Bump and Reinfor...
- Publication number 20230115986
- Publication date Apr 13, 2023
- Apple Inc.
- Jun Chung Hsu
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Structure and method for sealing a silicon IC

Multiple chip module trenched lid and low coefficient of thermal ex...

High density 3D interconnect configuration

Recessed lid and ring designs and lid local peripheral reinforcemen...

Selectable monolithic or external scalable die-to-die interconnecti...

Flexible package architecture concept in fanout

Multi-die fine grain integrated voltage regulation

Fully interconnected heterogeneous multi-layer reconstructed silico...

Interconnecting dies by stitch routing

Structure and method for fabricating a computing system with an int...

Semiconductor packaging substrate fine pitch metal bump and reinfor...

Selectable monolithic or external scalable die-to-die interconnecti...

Structure and method for sealing a silicon IC

Electronic package including a hybrid thermal interface material an...

High density 3D interconnect configuration

Wafer reconstitution and die-stitching

Die stitching and harvesting of arrayed structures

Power management system switched capacitor voltage regulator with i...

Structure and method for fabricating a computing system with an int...

Multiple chip module trenched lid and low coefficient of thermal ex...

High density interconnection using fanout interposer chiplet

High bandwidth die to die interconnect with package area reduction

Wearable electronic device with fluid-based pressure sensing

Semiconductor packaging substrate fine pitch metal bump and reinfor...

Package integration using fanout cavity substrate

Multiple component integration in fanout package with different bac...

Die-to-die routing through a seal ring

Scalable extreme large size substrate integration

Wafer level integration of passive devices

High density 3D interconnect configuration

Patents Applicationslast 30 patents

Power, Signaling and Thermal Path Co-optimization

High Density 3D Interconnect Configuration

Selectable Monolithic or External Scalable Die-to-Die Interconnecti...

Multi-Die Fine Grain Integrated Voltage Regulation

MOLDING COMPOUND LAYERS IN SEMICONDUCTOR PACKAGES

Chip Singulation Assisted Structures and Methods for Improving Bond...

Edge Recess Design for Molded and Fusion or Hybrid Bonded Integrate...

Package Redistribution Layer Structures for Stress Mitigation and A...

SYSTEMS AND METHODS FOR INTERCONNECTING DIES

Fully Interconnected Heterogeneous Multi-layer Reconstructed Silico...

Selectively Dispensed Underfill and Edge Bond Patterns

Structure and Method for Fabricating a Computing System with an Int...

Thermally Enhanced Chip-on-Wafer or Wafer-on-Wafer Bonding

3D Package with Chip-on-Reconstituted Wafer or Reconstituted Wafer-...

3D Package with Chip-on-Reconstituted Wafer or Reconstituted Wafer-...

Semiconductor Package with Local Interconnect and Chiplet Integration

Structure and Method of Fabrication for High Performance Integrated...

Selectable Monolithic or External Scalable Die-to-Die Interconnecti...

Structure and Method for Sealing a Silicon IC

WAFER RECONSTITUTION AND DIE-STITCHING

DIE STITCHING AND HARVESTING OF ARRAYED STRUCTURES

Structure and Method for Fabricating a Computing System with an Int...

High Density 3D Interconnect Configuration

Microelectronic Package RDL Patterns to Reduce Stress in RDLs Acros...

Multiple Chip Module Trenched Lid and Low Coefficient of Thermal Ex...

POWER MANAGEMENT SYSTEM SWITCHED CAPACITOR VOLTAGE REGULATOR WITH I...

Harvested Reconstitution Bumping

HIGH DENSITY INTERCONNECTION USING FANOUT INTERPOSER CHIPLET

HIGH BANDWIDTH DIE TO DIE INTERCONNECT WITH PACKAGE AREA REDUCTION

Semiconductor Packaging Substrate Fine Pitch Metal Bump and Reinfor...