Jung-Pang Huang

Person

Taichung, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Fabrication method of wafer level packaging semiconductor package w...
- Patent number 10,049,955
- Issue date Aug 14, 2018
- Siliconware Precision Industries Co., Ltd.
- Chiang-Cheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier, semiconductor package and fabrication method thereof
- Patent number 9,899,237
- Issue date Feb 20, 2018
- Siliconware Precision Industries Co., Ltd.
- Chiang-Cheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating semiconductor package having semiconductor el...
- Patent number 9,812,340
- Issue date Nov 7, 2017
- Siliconware Precision Industries Co., Ltd.
- Chiang-Cheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating multi-chip stack structure
- Patent number 9,754,927
- Issue date Sep 5, 2017
- Siliconware Precision Industries Co., Ltd.
- Chung-Lun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 9,324,585
- Issue date Apr 26, 2016
- Siliconware Precision Industries Co., Ltd.
- Chiang-Cheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method of semiconductor package
- Patent number 9,117,698
- Issue date Aug 25, 2015
- Siliconware Precision Industries Co., Ltd.
- Yan-Heng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electro-optical module
- Patent number 9,058,971
- Issue date Jun 16, 2015
- Siliconware Precision Industries Co., Ltd.
- Chih-Yuan Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method of semiconductor package
- Patent number 8,895,367
- Issue date Nov 25, 2014
- Siliconware Precision Industries Co., Ltd.
- Jung-Pang Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip stack structure and method for fabricating the same
- Patent number 8,896,130
- Issue date Nov 25, 2014
- Siliconware Precision Industries Co., Ltd.
- Chung-Lun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package, package structure and fabrication method the...
- Patent number 8,829,672
- Issue date Sep 9, 2014
- Siliconware Precision Industries Co., Ltd.
- Yan-Heng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method of semiconductor package device, and fabrication...
- Patent number 8,802,507
- Issue date Aug 12, 2014
- Siliconware Precision Industries Co., Ltd.
- Cheng-Chia Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier, semiconductor package and fabrication method thereof
- Patent number 8,680,692
- Issue date Mar 25, 2014
- Siliconware Precision Industries Co., Ltd.
- Chiang-Cheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and fabrication method thereof
- Patent number 8,519,526
- Issue date Aug 27, 2013
- Siliconware Precision Industries Co., Ltd.
- Jung-Pang Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package device, semiconductor package structure, and...
- Patent number 8,304,891
- Issue date Nov 6, 2012
- Siliconware Precision Industries Co., Ltd.
- Cheng-Chia Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method of multi-chip stack structure
- Patent number 7,981,729
- Issue date Jul 19, 2011
- Siliconware Precision Industries Co., Ltd.
- Jung-Pin Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip stack structure and fabrication method thereof
- Patent number 7,768,106
- Issue date Aug 3, 2010
- Siliconware Precision Industries Co., Ltd.
- Jung-Ping Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor package with stacked chips
- Patent number 7,655,503
- Issue date Feb 2, 2010
- Siliconware Precision Industries Co., Ltd.
- Jung-Pin Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with stacked chips and method for fabricating...
- Patent number 7,193,309
- Issue date Mar 20, 2007
- Siliconware Precision Industries, Co., Ltd.
- Jung-Pin Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with chip supporting structure
- Patent number 7,102,218
- Issue date Sep 5, 2006
- Siliconware Precision Industries Co., Ltd.
- Jung-Pin Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with chip supporting member
- Patent number 6,737,737
- Issue date May 18, 2004
- Siliconware Precision Industries Co., Ltd.
- Chin-Huang Chang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FABRICATION METHOD OF SEMICONDUCTOR PACKAGE
- Publication number 20170229364
- Publication date Aug 10, 2017
- Siliconware Precision Industries Co., Ltd.
- Chiang-Cheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING SEMICONDUCTOR PACKAGE
- Publication number 20160196990
- Publication date Jul 7, 2016
- Siliconware Precision Industries Co., Ltd.
- Chiang-Cheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE, CARRIER STRUCTURE AND FABRICATION METHOD THE...
- Publication number 20160079110
- Publication date Mar 17, 2016
- Siliconware Precision Industries Co., Ltd.
- Kuan-Wei Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING MULTI-CHIP STACK STRUCTURE
- Publication number 20150044821
- Publication date Feb 12, 2015
- Siliconware Precision Industries Co., Ltd.
- Chung-Lun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION METHOD OF SEMICONDUCTOR PACKAGE
- Publication number 20140342507
- Publication date Nov 20, 2014
- Yan-Heng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRO-OPTICAL MODULE
- Publication number 20140192832
- Publication date Jul 10, 2014
- Chih-Yuan Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20140183721
- Publication date Jul 3, 2014
- Siliconware Precision Industries Co., Ltd.
- Yan-Heng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER, SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20140154842
- Publication date Jun 5, 2014
- Siliconware Precision Industries Co., Ltd.
- Chiang-Cheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING SEMICONDUCTOR PACKAGE
- Publication number 20140134797
- Publication date May 15, 2014
- Siliconware Precision Industries Co., Ltd.
- Chieh-Yuan Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20140117537
- Publication date May 1, 2014
- Siliconware Precision Industries Co., Ltd.
- Chen-Han Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20140021629
- Publication date Jan 23, 2014
- Siliconware Precision Industries Co., Ltd.
- Chiang-Cheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION METHOD OF SEMICONDUCTOR PACKAGE
- Publication number 20130330883
- Publication date Dec 12, 2013
- Siliconware Precision Industries Co., Ltd.
- Jung-Pang Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE, PACKAGE STRUCTURE AND FABRICATION METHOD THE...
- Publication number 20130256875
- Publication date Oct 3, 2013
- Siliconware Precision Industries Co., Ltd.
- Yan-Heng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20130228915
- Publication date Sep 5, 2013
- Siliconware Precision Industries Co., Ltd.
- Chiang-Cheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER, SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20130187285
- Publication date Jul 25, 2013
- Siliconware Precision Industries Co., Ltd.
- Chiang-Cheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION METHOD OF SEMICONDUCTOR PACKAGE DEVICE, AND FABRICATION...
- Publication number 20130059418
- Publication date Mar 7, 2013
- Siliconware Precision Industries Co., Ltd.
- Cheng-Chia Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20120161301
- Publication date Jun 28, 2012
- Siliconware Precision Industries Co., Ltd.
- Jung-Pang Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP STACK STRUCTURE HAVING THROUGH SILICON VIA
- Publication number 20110227226
- Publication date Sep 22, 2011
- Siliconware Precision Industries Co., Ltd.
- Chiang-Cheng Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION METHOD OF MULTI-CHIP STACK STRUCTURE
- Publication number 20100255635
- Publication date Oct 7, 2010
- Siliconware Precision Industries Co., Ltd.
- Jung-Pin Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package device, semiconductor package structure, and...
- Publication number 20090294959
- Publication date Dec 3, 2009
- Siliconware Precision Industries Co., Ltd.
- Cheng-Chia Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP STACK STRUCTURE AND METHOD FOR FABRICATING THE SAME
- Publication number 20090140440
- Publication date Jun 4, 2009
- Siliconware Precision Industries Co., Ltd.
- Chung-Lun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-chip stack structure having through silicon via and method fo...
- Publication number 20090032928
- Publication date Feb 5, 2009
- Siliconware Precision Industries Co., Ltd.
- Chiang-Cheng Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-chip stack structure and fabricating method thereof
- Publication number 20090014860
- Publication date Jan 15, 2009
- Siliconware Precision Industries Co., Ltd.
- Chung-Lun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked package structure and fabrication method thereof
- Publication number 20080283994
- Publication date Nov 20, 2008
- Siliconware Precision Industries Co., Ltd.
- Ho-Yi Tsai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multi-chip stack structure and fabrication method thereof
- Publication number 20080224289
- Publication date Sep 18, 2008
- Siliconware Precision Industries Co., Ltd.
- Jung-Pin Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multichip stacking structure
- Publication number 20080174030
- Publication date Jul 24, 2008
- Siliconware Precision Industries Co., Ltd.
- Chung-Lun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fabrication method of multichip stacking structure
- Publication number 20080176358
- Publication date Jul 24, 2008
- Silicon Precision Industries Co., Ltd.
- Chung-Lun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for fabricating semiconductor package with stacked chips
- Publication number 20070108571
- Publication date May 17, 2007
- Siliconware Precision Industries Co., Ltd.
- Jung-Pin Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package with stacked chips and method for fabricating...
- Publication number 20060022315
- Publication date Feb 2, 2006
- Siliconware Precision Industries Co., Ltd.
- Jung-Pin Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package with chip supporting structure
- Publication number 20040099931
- Publication date May 27, 2004
- Siliconware Precision Industries, Ltd., Taiwan
- Jung-Pin Huang
- H01 - BASIC ELECTRIC ELEMENTS

Jung-Pang Huang

Person

Patents Grantslast 30 patents

Fabrication method of wafer level packaging semiconductor package w...

Carrier, semiconductor package and fabrication method thereof

Method of fabricating semiconductor package having semiconductor el...

Method for fabricating multi-chip stack structure

Semiconductor package and method of fabricating the same

Fabrication method of semiconductor package

Electro-optical module

Fabrication method of semiconductor package

Multi-chip stack structure and method for fabricating the same

Semiconductor package, package structure and fabrication method the...

Fabrication method of semiconductor package device, and fabrication...

Carrier, semiconductor package and fabrication method thereof

Semiconductor package and fabrication method thereof

Semiconductor package device, semiconductor package structure, and...

Fabrication method of multi-chip stack structure

Multi-chip stack structure and fabrication method thereof

Method for fabricating semiconductor package with stacked chips

Semiconductor package with stacked chips and method for fabricating...

Semiconductor package with chip supporting structure

Semiconductor package with chip supporting member

Patents Applicationslast 30 patents

FABRICATION METHOD OF SEMICONDUCTOR PACKAGE

METHOD OF FABRICATING SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE, CARRIER STRUCTURE AND FABRICATION METHOD THE...

METHOD FOR FABRICATING MULTI-CHIP STACK STRUCTURE

FABRICATION METHOD OF SEMICONDUCTOR PACKAGE

ELECTRO-OPTICAL MODULE

SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF

CARRIER, SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF

METHOD FOR FABRICATING SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

FABRICATION METHOD OF SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE, PACKAGE STRUCTURE AND FABRICATION METHOD THE...

SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF

CARRIER, SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF

FABRICATION METHOD OF SEMICONDUCTOR PACKAGE DEVICE, AND FABRICATION...

SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF

MULTI-CHIP STACK STRUCTURE HAVING THROUGH SILICON VIA

FABRICATION METHOD OF MULTI-CHIP STACK STRUCTURE

Semiconductor package device, semiconductor package structure, and...

MULTI-CHIP STACK STRUCTURE AND METHOD FOR FABRICATING THE SAME

Multi-chip stack structure having through silicon via and method fo...

Multi-chip stack structure and fabricating method thereof

Stacked package structure and fabrication method thereof

Multi-chip stack structure and fabrication method thereof

Multichip stacking structure

Fabrication method of multichip stacking structure

Method for fabricating semiconductor package with stacked chips

Semiconductor package with stacked chips and method for fabricating...

Semiconductor package with chip supporting structure