Junitsu Yamakawa

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Copper oxide solid for use in plating of a substrate, method of pro...
- Patent number 11,781,233
- Issue date Oct 10, 2023
- Ebara Corporation
- Junitsu Yamakawa
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Copper oxide solid for use in plating of a substrate, method of pro...
- Patent number 11,767,606
- Issue date Sep 26, 2023
- Ebara Corporation
- Junitsu Yamakawa
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Substrate holding device
- Patent number 11,600,514
- Issue date Mar 7, 2023
- Ebara Corporation
- Masaki Tomita
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Copper oxide solid for use in plating of a substrate, method of pro...
- Patent number 11,230,780
- Issue date Jan 25, 2022
- Ebara Corporation
- Junitsu Yamakawa
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Substrate holder and plating apparatus
- Patent number 11,015,261
- Issue date May 25, 2021
- Ebara Corporation
- Yoshitaka Mukaiyama
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Substrate processing device, method for controlling substrate proce...
- Patent number 10,991,605
- Issue date Apr 27, 2021
- Ebara Corporation
- Junitsu Yamakawa
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Cleaning apparatus, plating apparatus using the same, and cleaning...
- Patent number 10,781,530
- Issue date Sep 22, 2020
- Ebara Corporation
- Junitsu Yamakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing device, method for controlling substrate proce...
- Patent number 10,163,672
- Issue date Dec 25, 2018
- Ebara Corporation
- Junitsu Yamakawa
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method of managing a plating liquid used in a plating apparatus
- Patent number 7,172,683
- Issue date Feb 6, 2007
- Ebara Corporation
- Yasushi Isayama
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plating apparatus
- Patent number RE39123
- Issue date Jun 13, 2006
- Ebara Corporation
- Fumio Kuriyama
- 205 - Electrolysis: processes, compositions used therein, and methods of prep...
Information Patent Grant
Substrate plating apparatus and method
- Patent number 6,793,794
- Issue date Sep 21, 2004
- Ebara Corporation
- Akihisa Hongo
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method of measuring the concentration of a leveler in a plating liquid
- Patent number 6,627,066
- Issue date Sep 30, 2003
- Ebara Corporation
- Yasushi Isayama
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plating apparatus
- Patent number 6,379,520
- Issue date Apr 30, 2002
- Ebara Corporation
- Fumio Kuriyama
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Substrate plating device
- Patent number 6,365,017
- Issue date Apr 2, 2002
- Ebara Corporation
- Akihisa Hongo
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
COPPER OXIDE SOLID FOR USE IN PLATING OF A SUBSTRATE, METHOD OF PRO...
- Publication number 20220074065
- Publication date Mar 10, 2022
- EBARA CORPORATION
- Junitsu Yamakawa
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COPPER OXIDE SOLID FOR USE IN PLATING OF A SUBSTRATE, METHOD OF PRO...
- Publication number 20220074064
- Publication date Mar 10, 2022
- EBARA CORPORATION
- Junitsu Yamakawa
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COPPER OXIDE SOLID FOR USE IN PLATING OF A SUBSTRATE, METHOD OF PRO...
- Publication number 20210180202
- Publication date Jun 17, 2021
- EBARA CORPORATION
- Junitsu Yamakawa
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SUBSTRATE HOLDING DEVICE
- Publication number 20200258768
- Publication date Aug 13, 2020
- EBARA CORPORATION
- Masaki Tomita
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SUBSTRATE PROCESSING DEVICE, METHOD FOR CONTROLLING SUBSTRATE PROCE...
- Publication number 20190181026
- Publication date Jun 13, 2019
- EBARA CORPORATION
- Junitsu YAMAKAWA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SUBSTRATE HOLDER AND PLATING APPARATUS
- Publication number 20190084777
- Publication date Mar 21, 2019
- EBARA CORPORATION
- Yoshitaka MUKAIYAMA
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
SUBSTRATE PROCESSING DEVICE, METHOD FOR CONTROLLING SUBSTRATE PROCE...
- Publication number 20180286730
- Publication date Oct 4, 2018
- EBARA CORPORATION
- Junitsu YAMAKAWA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
CLEANING APPARATUS, PLATING APPARATUS USING THE SAME, AND CLEANING...
- Publication number 20170370016
- Publication date Dec 28, 2017
- EBARA CORPORATION
- Junitsu YAMAKAWA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
WET PROCESSING APPARATUS AND PLATING APPARATUS
- Publication number 20150013905
- Publication date Jan 15, 2015
- EBARA CORPORATION
- Yoichi NAKAGAWA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Apparatus for managing a plating liquid
- Publication number 20070102285
- Publication date May 10, 2007
- Yasushi Isayama
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method of measuring the concentration of a leveler in a plating liq...
- Publication number 20040016644
- Publication date Jan 29, 2004
- Yasushi Isayama
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Substrate plating apparatus
- Publication number 20020139683
- Publication date Oct 3, 2002
- Akihisa Hongo
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Junitsu Yamakawa

Person

Patents Grantslast 30 patents

Copper oxide solid for use in plating of a substrate, method of pro...

Copper oxide solid for use in plating of a substrate, method of pro...

Substrate holding device

Copper oxide solid for use in plating of a substrate, method of pro...

Substrate holder and plating apparatus

Substrate processing device, method for controlling substrate proce...

Cleaning apparatus, plating apparatus using the same, and cleaning...

Substrate processing device, method for controlling substrate proce...

Method of managing a plating liquid used in a plating apparatus

Plating apparatus

Substrate plating apparatus and method

Method of measuring the concentration of a leveler in a plating liquid

Plating apparatus

Substrate plating device

Patents Applicationslast 30 patents

COPPER OXIDE SOLID FOR USE IN PLATING OF A SUBSTRATE, METHOD OF PRO...

COPPER OXIDE SOLID FOR USE IN PLATING OF A SUBSTRATE, METHOD OF PRO...

COPPER OXIDE SOLID FOR USE IN PLATING OF A SUBSTRATE, METHOD OF PRO...

SUBSTRATE HOLDING DEVICE

SUBSTRATE PROCESSING DEVICE, METHOD FOR CONTROLLING SUBSTRATE PROCE...

SUBSTRATE HOLDER AND PLATING APPARATUS

SUBSTRATE PROCESSING DEVICE, METHOD FOR CONTROLLING SUBSTRATE PROCE...

CLEANING APPARATUS, PLATING APPARATUS USING THE SAME, AND CLEANING...

WET PROCESSING APPARATUS AND PLATING APPARATUS

Apparatus for managing a plating liquid

Method of measuring the concentration of a leveler in a plating liq...

Substrate plating apparatus