Justin Hiroki Sato

Person

West Linn, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Metal-oxide-metal (MOM) capacitors for integrated circuit monitoring
- Patent number 12,205,885
- Issue date Jan 21, 2025
- Microchip Technology Incorporated
- Yaojian Leng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit bond pad with multi-material toothed structure
- Patent number 12,205,910
- Issue date Jan 21, 2025
- Microchip Technology Incorporated
- Justin Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device including interposers bonded to each other
- Patent number 12,040,282
- Issue date Jul 16, 2024
- Microchip Technology Incorporated
- Justin Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package module including a bonding system
- Patent number 11,935,824
- Issue date Mar 19, 2024
- Microchip Technology Incorporated
- Justin Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-oxide-metal (MOM) capacitors for integrated circuit monitoring
- Patent number 11,735,516
- Issue date Aug 22, 2023
- Microchip Technology Incorporated
- Yaojian Leng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit (IC) package with integrated inductor having cor...
- Patent number 11,723,222
- Issue date Aug 8, 2023
- Microchip Technology Incorporated
- Yaojian Leng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional metal-insulator-metal (MIM) capacitor
- Patent number 11,715,757
- Issue date Aug 1, 2023
- Microchip Technology Incorporated
- Yaojian Leng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit bond pad with multi-material toothed structure
- Patent number 11,682,641
- Issue date Jun 20, 2023
- Microchip Technology Incorporated
- Justin Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit (IC) device including a force mitigation system...
- Patent number 11,682,642
- Issue date Jun 20, 2023
- Microchip Technology Incorporated
- Justin Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated inductor with a stacked metal wire
- Patent number 11,670,583
- Issue date Jun 6, 2023
- Microchip Technology Incorporated
- Yaojian Leng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin-film resistor (TFR) with improved contacts
- Patent number 11,626,474
- Issue date Apr 11, 2023
- Microchip Technology Incorporated
- Yaojian Leng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional metal-insulator-metal (MIM) capacitor
- Patent number 11,545,544
- Issue date Jan 3, 2023
- Microchip Technology Incorporated
- Yaojian Leng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mixed-orientation multi-die integrated circuit package with at leas...
- Patent number 11,043,471
- Issue date Jun 22, 2021
- Microchip Technology Incorporated
- Justin Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit (IC) device including a force mitigation system...
- Patent number 10,896,888
- Issue date Jan 19, 2021
- Microchip Technology Incorporated
- Justin Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin-film resistor (TFR) formed under a metal layer and method of f...
- Patent number 10,818,748
- Issue date Oct 27, 2020
- Microchip Technology Incorporated
- Yaojian Leng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Aluminum compatible thin-film resistor (TFR) and manufacturing methods
- Patent number 10,658,453
- Issue date May 19, 2020
- Microchip Technology Incorporated
- Justin Hiroki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin-film resistor (TFR) module with top-side interconnects connect...
- Patent number 10,553,336
- Issue date Feb 4, 2020
- Microchip Technology Incorporated
- Yaojian Leng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sacrificial alignment ring and self-soldering vias for wafer bonding
- Patent number 10,381,330
- Issue date Aug 13, 2019
- Silicon Storage Technology, Inc.
- Justin Hiroki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sidewall-type memory cell
- Patent number 10,056,545
- Issue date Aug 21, 2018
- Microchip Technology Incorporated
- Justin Hiroki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Air-gap assisted etch self-aligned dual Damascene
- Patent number 10,002,785
- Issue date Jun 19, 2018
- Microchip Technology Incorporated
- Justin Hiroki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single-wafer real-time etch rate and uniformity predictor for plasm...
- Patent number 9,953,886
- Issue date Apr 24, 2018
- Microchip Technology Incorporated
- Justin Hiroki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing a damascene thin-film resistor
- Patent number 9,679,844
- Issue date Jun 13, 2017
- Microchip Technology Incorporated
- Yaojian Leng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming shallow trench isolation (STI) structures
- Patent number 9,627,246
- Issue date Apr 18, 2017
- Microchip Technology Incorporated
- Justin Hiroki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for photolithography-free self-aligned reverse active etch
- Patent number 9,589,828
- Issue date Mar 7, 2017
- Microchip Technology Incorporated
- Justin Hiroki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sidewall type memory cell
- Patent number 9,444,040
- Issue date Sep 13, 2016
- Microchip Technology Incorporated
- Justin Hiroki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a semiconductor die with multiple depth sh...
- Patent number 8,853,091
- Issue date Oct 7, 2014
- Microchip Technology Incorporated
- Justin H. Sato
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Metal-Oxide-Metal (MOM) Capacitors for Integrated Circuit Monitoring
- Publication number 20230352398
- Publication date Nov 2, 2023
- MICROCHIP TECHNOLOGY INCORPORATED
- Yaojian Leng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE WITH BACKSIDE LEAD FOR CLOCK TREE OR POW...
- Publication number 20230290765
- Publication date Sep 14, 2023
- MICROCHIP TECHNOLOGY INCORPORATED
- Justin Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED INDUCTOR WITH A STACKED METAL WIRE
- Publication number 20230268269
- Publication date Aug 24, 2023
- MICROCHIP TECHNOLOGY INCORPORATED
- Yaojian Leng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT BOND PAD WITH MULTI-MATERIAL TOOTHED STRUCTURE
- Publication number 20230260938
- Publication date Aug 17, 2023
- MICROCHIP TECHNOLOGY INCORPORATED
- Justin Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE INCLUDING INTERPOSERS BONDED TO EACH OTHER
- Publication number 20230109629
- Publication date Apr 6, 2023
- MICROCHIP TECHNOLOGY INCORPORATED
- Justin Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE MODULE INCLUDING A BONDING SYSTEM
- Publication number 20230099856
- Publication date Mar 30, 2023
- MICROCHIP TECHNOLOGY INCORPORATED
- Justin Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL METAL-INSULATOR-METAL (MIM) CAPACITOR
- Publication number 20230096226
- Publication date Mar 30, 2023
- MICROCHIP TECHNOLOGY INCORPORATED
- Yaojian Leng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE WITH HEAT TRANSFER CHIMNEY INCLUDING THE...
- Publication number 20230055102
- Publication date Feb 23, 2023
- MICROCHIP TECHNOLOGY INCORPORATED
- Bomy Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING AN INTEGRATED CIRCUIT VIA
- Publication number 20230050344
- Publication date Feb 16, 2023
- MICROCHIP TECHNOLOGY INCORPORATED
- Daniel Baker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN-FILM RESISTOR (TFR) WITH IMPROVED CONTACTS
- Publication number 20220208954
- Publication date Jun 30, 2022
- MICROCHIP TECHNOLOGY INCORPORATED
- Yaojian Leng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-OXIDE-METAL (MOM) CAPACITORS FOR INTEGRATED CIRCUIT MONITORING
- Publication number 20220130753
- Publication date Apr 28, 2022
- MICROCHIP TECHNOLOGY INCORPORATED
- Yaojian Leng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL METAL-INSULATOR-METAL (MIM) CAPACITOR
- Publication number 20220069069
- Publication date Mar 3, 2022
- MICROCHIP TECHNOLOGY INCORPORATED
- Yaojian Leng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT BOND PAD WITH MULTI-MATERIAL TOOTHED STRUCTURE
- Publication number 20220052001
- Publication date Feb 17, 2022
- MICROCHIP TECHNOLOGY INCORPORATED
- Justin Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED INDUCTOR WITH A STACKED METAL WIRE
- Publication number 20210384122
- Publication date Dec 9, 2021
- MICROCHIP TECHNOLOGY INCORPORATED
- Yaojian Leng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE INTERCONNECT FOR INTEGRATED CIRCUIT PACKAGE INTERPOSER
- Publication number 20210335627
- Publication date Oct 28, 2021
- MICROCHIP TECHNOLOGY INCORPORATED
- Justin Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT (IC) PACKAGE WITH INTEGRATED INDUCTOR HAVING COR...
- Publication number 20210036059
- Publication date Feb 4, 2021
- Microchip Technology Incorporated
- Yaojian Leng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit (IC) Device Including A Force Mitigation System...
- Publication number 20200411462
- Publication date Dec 31, 2020
- MICROCHIP TECHNOLOGY INCORPORATED
- Justin Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MIXED-ORIENTATION MULTI-DIE INTEGRATED CIRCUIT PACKAGE WITH AT LEAS...
- Publication number 20200357767
- Publication date Nov 12, 2020
- MICROCHIP TECHNOLOGY INCORPORATED
- Justin Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thin-Film Resistor (TFR) Module With Top-Side Interconnects Connect...
- Publication number 20190392967
- Publication date Dec 26, 2019
- MICROCHIP TECHNOLOGY INCORPORATED
- Yaojian Leng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Aluminum Compatible Thin-Film Resistor (TFR) and Manufacturing Methods
- Publication number 20190386091
- Publication date Dec 19, 2019
- MICROCHIP TECHNOLOGY INCORPORATED
- Justin Hiroki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thin-Film Resistor (TFR) Formed Under a Metal Layer and Method of F...
- Publication number 20190348494
- Publication date Nov 14, 2019
- MICROCHIP TECHNOLOGY INCORPORATED
- Yaojian Leng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT (IC) DEVICE INCLUDING A FORCE MITIGATION SYSTEM...
- Publication number 20190287936
- Publication date Sep 19, 2019
- MICROCHIP TECHNOLOGY INCORPORATED
- Justin Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dual Damascene Process for Forming Vias and Interconnects in an Int...
- Publication number 20190096751
- Publication date Mar 28, 2019
- MICROCHIP TECHNOLOGY INCORPORATED
- Justin Hiroki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Sidewall-Type Memory Cell
- Publication number 20180294407
- Publication date Oct 11, 2018
- MICROCHIP TECHNOLOGY INCORPORATED
- Justin Hiroki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Sacrificial Alignment Ring And Self-Soldering Vias For Wafer Bonding
- Publication number 20180286836
- Publication date Oct 4, 2018
- Silicon Storage Technology, Inc.
- Justin Hiroki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING SHALLOW TRENCH ISOLATION (STI) STRUCTURES
- Publication number 20170229340
- Publication date Aug 10, 2017
- MICROCHIP TECHNOLOGY INCORPORATED
- Justin Hiroki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Single-Wafer Real-Time Etch Rate and Uniformity Predictor For Plasm...
- Publication number 20170053841
- Publication date Feb 23, 2017
- MICROCHIP TECHNOLOGY INCORPORATED
- Justin Hiroki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Sidewall-Type Memory Cell
- Publication number 20160380192
- Publication date Dec 29, 2016
- MICROCHIP TECHNOLOGY INCORPORATED
- Justin Hiroki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Damascene Thin-Film Resistor with an Added Mask Layer
- Publication number 20160372420
- Publication date Dec 22, 2016
- MICROCHIP TECHNOLOGY INCORPORATED
- Yaojian Leng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING SHALLOW TRENCH ISOLATION (STI) STRUCTURES
- Publication number 20160365272
- Publication date Dec 15, 2016
- MICROCHIP TECHNOLOGY INCORPORATED
- Justin Hiroki Sato
- H01 - BASIC ELECTRIC ELEMENTS

Justin Hiroki Sato

Person

Patents Grantslast 30 patents

Metal-oxide-metal (MOM) capacitors for integrated circuit monitoring

Integrated circuit bond pad with multi-material toothed structure

Electronic device including interposers bonded to each other

Integrated circuit package module including a bonding system

Metal-oxide-metal (MOM) capacitors for integrated circuit monitoring

Integrated circuit (IC) package with integrated inductor having cor...

Three-dimensional metal-insulator-metal (MIM) capacitor

Integrated circuit bond pad with multi-material toothed structure

Integrated circuit (IC) device including a force mitigation system...

Integrated inductor with a stacked metal wire

Thin-film resistor (TFR) with improved contacts

Three-dimensional metal-insulator-metal (MIM) capacitor

Mixed-orientation multi-die integrated circuit package with at leas...

Integrated circuit (IC) device including a force mitigation system...

Thin-film resistor (TFR) formed under a metal layer and method of f...

Aluminum compatible thin-film resistor (TFR) and manufacturing methods

Thin-film resistor (TFR) module with top-side interconnects connect...

Sacrificial alignment ring and self-soldering vias for wafer bonding

Sidewall-type memory cell

Air-gap assisted etch self-aligned dual Damascene

Single-wafer real-time etch rate and uniformity predictor for plasm...

Manufacturing a damascene thin-film resistor

Method of forming shallow trench isolation (STI) structures

Method for photolithography-free self-aligned reverse active etch

Sidewall type memory cell

Method for manufacturing a semiconductor die with multiple depth sh...

Patents Applicationslast 30 patents

Metal-Oxide-Metal (MOM) Capacitors for Integrated Circuit Monitoring

INTEGRATED CIRCUIT PACKAGE WITH BACKSIDE LEAD FOR CLOCK TREE OR POW...

INTEGRATED INDUCTOR WITH A STACKED METAL WIRE

INTEGRATED CIRCUIT BOND PAD WITH MULTI-MATERIAL TOOTHED STRUCTURE

ELECTRONIC DEVICE INCLUDING INTERPOSERS BONDED TO EACH OTHER

INTEGRATED CIRCUIT PACKAGE MODULE INCLUDING A BONDING SYSTEM

THREE-DIMENSIONAL METAL-INSULATOR-METAL (MIM) CAPACITOR

INTEGRATED CIRCUIT PACKAGE WITH HEAT TRANSFER CHIMNEY INCLUDING THE...

METHOD OF FORMING AN INTEGRATED CIRCUIT VIA

THIN-FILM RESISTOR (TFR) WITH IMPROVED CONTACTS

METAL-OXIDE-METAL (MOM) CAPACITORS FOR INTEGRATED CIRCUIT MONITORING

THREE-DIMENSIONAL METAL-INSULATOR-METAL (MIM) CAPACITOR

INTEGRATED CIRCUIT BOND PAD WITH MULTI-MATERIAL TOOTHED STRUCTURE

INTEGRATED INDUCTOR WITH A STACKED METAL WIRE

BACKSIDE INTERCONNECT FOR INTEGRATED CIRCUIT PACKAGE INTERPOSER

INTEGRATED CIRCUIT (IC) PACKAGE WITH INTEGRATED INDUCTOR HAVING COR...

Integrated Circuit (IC) Device Including A Force Mitigation System...

MIXED-ORIENTATION MULTI-DIE INTEGRATED CIRCUIT PACKAGE WITH AT LEAS...

Thin-Film Resistor (TFR) Module With Top-Side Interconnects Connect...

Aluminum Compatible Thin-Film Resistor (TFR) and Manufacturing Methods

Thin-Film Resistor (TFR) Formed Under a Metal Layer and Method of F...

INTEGRATED CIRCUIT (IC) DEVICE INCLUDING A FORCE MITIGATION SYSTEM...

Dual Damascene Process for Forming Vias and Interconnects in an Int...

Sidewall-Type Memory Cell

Sacrificial Alignment Ring And Self-Soldering Vias For Wafer Bonding

METHOD OF FORMING SHALLOW TRENCH ISOLATION (STI) STRUCTURES

Single-Wafer Real-Time Etch Rate and Uniformity Predictor For Plasm...

Sidewall-Type Memory Cell

Damascene Thin-Film Resistor with an Added Mask Layer

METHOD OF FORMING SHALLOW TRENCH ISOLATION (STI) STRUCTURES